PCB制造成本参数

,,,,PCB板成本测算表,,,,,,,,,,,,,

报价单编号:,,,,,,,,,,,,,,,,,

客户名称:,,,客户型号:,,,,,,大料Pcs数,,,Pcs,板材利用率:,,100%,,

生产工艺:,,,单元尺寸:,,*,,mm,,大料Set数,#DIV/0!,,连片,大料,,*,,inch

PCS/SET数:,,,连片尺寸:,,*,,mm,,V-CUT刀数,横向,0,刀；,竖向,0,刀,,

序号,生产流程,,关键成本项目,,,,,,元/平米,成本核算依据,,,,,,,

1,开料,,板料:,0.8H/HCEM-3B,,,,1,#DIV/0!,83,元,,板料采购成本,,,,

2,烤板/磨边/销钉,,,,,,是/否,1,3.00,3.0,元/平米,,,,,,

3,钻孔/锣槽,,,,,孔数/PCS:,,22,#DIV/0!,0.25,元/千孔,,（最小孔0.70mm）,,,,不含税

4,除胶渣,,,,,,是/否,0,0.00,8.5,元/平米,,,,,,

5,沉铜,,,,,,是/否,1,6.50,6.5,元/平米,,药水包线,,,,

6,整板电铜,,,,,,,,,,,,,,,,

,,,"200u""",,,,是/否,1,5.81,5.81,元/平米,,,,,,

,,,"450u""",,,,是/否,0,0.00,12.78,元/平米,,,,,,

7,线路,,,,,,,,,,,,,,,,

,,,干膜面数:,,,,面数,0,0.00,9.7,元/平米,,/每面,,,,

,,,湿膜面数:,,,,面数,2,5.80,2.9,元/平米,,/每面,,,,

8,图形电镀(电铜/电锡),,,,,,,,,,,,,,,,

,,,孔铜厚18um,,,,是/否,0,0.00,20.92,元/平米,,≤18um时,,,,

,,,孔铜厚20um,,,,是/否,0,0.00,46.2,元/平米,,≤20um时,,,,

,,,孔铜厚25um,,,,是/否,0,0.00,54.6,元/平米,,≥25um时,,,,

,,,电锡5um,,,,是/否,0,0.00,7.83,元/平米,,,,,,

9,电镍,,电镍,,,,是/否,0,0.00,8.85,元/平米,,,,,,

10,电镍/电金,,,,,,,,,,,,,,,,

,,,"金厚:0.1u""",,,,厚度,0,0.00,13.43,元/平米,,双面，电镀面积比率是两面比率相加以75%为基本,,,,

,,,电镀面积比率:%,,,,,75,,,,,,,,,

,,,"金厚:0.2u""",,,,厚度,0,0.00,26.86,元/平米,,,,,,

,,,电镀面积比率:%,,,,,75,,,,,,,,,

,,,"金厚:0.3u""",,,,厚度,0.3,39.22,40.29,元/平米,,,,,,

,,,电镀面积比率:%,,,,,73,,,,,,,,,

,,,"金厚:0.5u""",,,,厚度,0,0.00,67.15,元/平米,,,,,,

,,,电镀面积比率:%,,,,,75,,,,,,,,,

,,,"金厚:0.8u""",,,,厚度,0,0.00,107.44,元/平米,,,,,,

,,,电镀面积比率:%,,,,,75,,,,,,,,,

,,,"金厚:1.0u""",,,,厚度,0,0.00,134.3,元/平米,,,,,,

,,,电镀面积比率:%,,,,,75,,,,,,,,,

11,电镍/电钯,,"钯厚:0.3u""",,,,厚度,0,0.00,17.13,元/平米,,,,,,

,,,电镀面积比率:%,,,,,75,,,,,,,,,

12,退膜/蚀刻/退锡,,,,,,是/否,1,3.56,3.56,元/平米,,,,,,

13,中测,,,,,,是/否,1,5.00,5.0,元/平米,,,,,,

14,飞针测试,,,,,,点数,,#DIV/0!,1.5,元/1000点(不足按1000计),,,,,,

15,AOI,,,,,,是/否,0,0.00,5.0,元/平米,,,,,,

16,中检,,,,,,是/否,1,5.00,5.0,元/平米,,,,,,

17,防焊(感光绿油),,,,,,面数,0,0.00,8.549,元/平米,,/每面,,,,

18,文字(感光),,,,,,面数,0,0.00,8.549,元/平米,,/每面,,,,

19,文字(热固),,,,,,面数,0,0.00,1.65,元/平米,,/每面,,,,

20,喷锡,,,,,,是/否,0,0.00,16.81,元/平米,,,,,,不含税

21,沉金,,,,,,,,,,,,,,,,

,,,"金厚:0.5u""",,,,金厚,0,0.00,59.0,元/平米,,双面，面积比率是单片的两面比率相加30%为基本>,,,,

,,,电镀面积比率:%,,,,,30,,,,,,,,,

,,,"金厚:0.8u""",,,,金厚,0,0.00,78.0,元/平米,,,,,,

,,,电镀面积比率:%,,,,,30,,,,,,,,,

,,,"金厚:1.0u""",,,,金厚,0,0.00,85.0,元/平米,,,,,,

,,,电镀面积比率:%,,,,,30,,,,,,,,,

,,,"金厚:2.0u""",,,,金厚,0,0.00,140,元/平米,,,,,,

,,,电镀面积比率:%,,,,,30,,,,,,,,,

22,OSP,,,,,,是/否,0,0.00,10.62,元/米,,,,,,不含税

23,V-CUT,,V程:mm/片,,,,是/否,0,#DIV/0!,0.442,元/米,,,,,,不含税

,V-CUT半孔板,,V程:mm/片,,,,是/否,0,#DIV/0!,0.884,元/米,,按2倍,,,,不含税

24,锣槽,,槽数量/PCS,,,,个数,0,#DIV/0!,0.02,元/槽,,＜10mm短槽,,,,不含税

26,锣半孔,,锣程:/交货板,,（inch）,,0,,#DIV/0!,0.93,元/米,,锣半孔及贴胶纸按3倍,,,,不含税

25,锣外形,,,,,,,,,,,,,,,,

,,,锣程:/交货板,,（inch）,,,,#DIV/0!,0.62,元/米,,0.8mm锣刀按2倍,,,,不含税

,,,锣程:/交货板,,（inch）,,0,,#DIV/0!,0.31,元/米,,,,,,不含税

27,啤板,,,,,,是/否,1,5.76,5.76,元/平米,,,,,,

28,成品测试,,,,,,是/否,0,0.00,5.0,元/平米,,,,,,

29,FQC+包装,,,,,,是/否,1,0.50,0.5,元/平米,,,,,,

30,FQA抽检,,,,,,是/否,1,3.00,3.0,元/平米,,,,,,

31,电费,,,,,,,1,24.23,24.23,元/平米,,,,,,

32,水费,,,,,,,1,14.06,14.06,元/平米,,,,,,

33,厂租,,,,,,,1,2.37,2.37,元/平米,,,,,,

34,设备折旧,,,,,,,1,6.50,6.5,元/平米,,,,,,

35,低值易耗,,,,,,,1,17.17,17.17,元/平米,,,,,,

36,污水处理,,,,,,,1,5.84,5.84,元/平米,,,,,,

37,人工,,,,,,,1,68.61,68.61,元/平米,,,,,,

38,机器维修,,,,,,,1,5.87,5.87,元/平米,,,,,,

39,模具菲林测试架,,,,,,,1,4.36,4.36,元/平米,,,,,,

40,每平米大料生产成本小计:,,,,,,,,#DIV/0!,元/平米,,,,,,,不含税

41,成品生产成本,,不良品率:,2,%,难度系数：,,1,#DIV/0!,元/平米,,,,,,,

42,成本价,,,,,,,