IC-芯片封装流程课件

IntroductionofICAssemblyProcess

IC封装工艺简介1精选2021版课件IC制作.tw2精选2021版课件沙子硅熔炼单晶硅锭硅锭切割3精选2021版课件涂覆光刻胶光刻蚀刻4精选2021版课件注入离子电镀抛光切割5精选2021版课件ICUsingInLife集成电路在生活中的应用Electricalproductcanbeseeeverywhere.Theycometobethenecessaryofeveryone’slife.AlltheseproductscontainonepieceICormore.电子产品随处可见，已经成为每个人生活的必需品。而这些电子产品几乎都有一颗或多颗集成电路。6精选2021版课件WhyAssemblethedie？为什么要封装芯片？1.ElectricalInterconnection

电连接2.MechanicalSupport/Protection/Soldering

提供机械支持/保护/可焊性3.Powerdissipation

散热7精选2021版课件AssemblyProcessFlow封装流程图Taping贴膜BacksideGrinding背面磨晶Detaping&WaferMount去膜贴片DieSaw切片AdhesiveAttach涂胶DieAttach粘片WireBond焊线Molding模封Marking打标BallMount植球SawSingulation分割AVI自动检查8精选2021版课件Taping贴膜

Operation:Tapingonthefrontsideofwafer操作：在晶圆的正面贴上一层蓝膜Purpose:Protectwaferfrontside目的：保护晶圆正面9精选2021版课件BacksideGrinding背面磨晶Operation:Grindingbacksideofthewafer操作：磨晶圆的背面Purpose:Thinningthewafer目的：减小晶圆的厚度10精选2021版课件WaferMount&Detaping去膜贴片Operation:Detapingandwafermount操作：将晶圆背面贴在钢圈固定的蓝膜上，然后去除正面的保护膜Purpose:fixthewaferonthering目的：将晶圆用钢圈固定11精选2021版课件DieSaw切片Operation:Sawingofthewafersthroughscribestreet.操作：沿切割道切割晶圆。Purpose:separatethedie.目的：将单个芯片分开。12精选2021版课件AdhesiveAttach涂胶Operation:Printingadhesiveonthesubstrate操作：在基板正面印胶Purpose:Fornextstep目的：为下道工序准备13精选2021版课件DieAttach粘片Operation:Attachdieonsubstrate操作：将芯片贴到基板上Purpose:fixdieonsubstrate目的：在基板上固定芯片BacksideFrontside14精选2021版课件WireBond焊线Operation:bondingwireondiepadandlead操作：在芯片和管脚上焊线Purpose:interconnectleadanddie目的：芯片和管脚的内连接15精选2021版课件Molding模封Operation:Toencapsulatethesubstrateandthebondeddieincompound操作：用模封材料将基板和焊过线的芯片连接起来Purpose:Toprotectthedieandthebondedwirefromdamage目的：防止芯片和线受到损伤16精选2021版课件Marking打标Operation:usinglasermarkinformationonthesurface操作：用激光在表面打标Purpose:shownproductinformation目的：提供产品信息17精选2021版课件BallMount植球Operation:plantsolderballoncrunodes操作：在结点植球Purpose:forouterelectricalconnect目的：提供外部电连接的接口18精选2021版课件SawSingulation分割Operation:sawthesubstrate操作：分割基板Pu