《半导体工程专业英语》课件-6.1 Purpose

微专业---半导体制造技术课程：半导体工程专业英语ContentsSemiconductorProperties半导体特性01SemiconductorMaterials半导体材料02SemiconductorDeviceandHowTheyareUsed半导体器件及其使用03ProcessTechnology工艺技术04FabricationProcesses制造工艺05SemiconductorMaterialsandProcessCharacterization半导体材料与工艺表征06SemiconductorMaterialsandProcessCharacterization6.1Purpose6.2Methods6.3ExamplesofApplications066SemiconductorMaterialsandProcessCharacterization1ChapterOverview

Thereisastrongcorrelationbetweenconditionofthematerialsusedtoprocessfunctionaldevice,andtheperformanceofsuchdevice.Therefore,itis

importanttoanyresearchanddevelopmentendeavorinvolvingsemiconductormaterials,andequallyimportanttothecommercialmanufacturingof

semiconductordevices,thatthephysicalandchemicalcharacteristicsofthe

processedmaterialareknownandcontrolledateverystageofthefabrication

procedures.Forthatreason,characterizationofsemiconductormaterials

anddevicesisanintegralpartofanysemiconductorengineeringeffort./ˌkɔːrəˈleɪʃ(ə)n/关联/ɪnˈdevər/尝试/ˈɪntɪɡrəl/完整的，必须的2Introduction

Toreiteratethepointmadeearlier,operationofsemiconductordevicesdependsontheintricatephysicalinteractionsbetweenoutsidestimuli(current,voltage,light,temperature,andothers),andsemiconductormaterials.Therefore,inordertoassurepredictable,controllable,andreproducible

characteristicsofthedevice,propertiesofthematerialsusedtofabricate

anygivendevicemustbeknownnotonlyintermsoftheirinherentcharacteristics,butalsointermsofthepotentialchangesinflictedbytheprocesses

discussedinChapter5ofthisvolume./ˈɪntrɪkət/复杂的6.1Purpose/ɪnˈherənt/内在的/riˈɪtəreɪt/重述/prɪˈdɪktəb(ə)l/可预测的6SemiconductorMaterialsandProcessCharacterization/ˈstɪmjəlaɪ/激励/ɪnˈflɪktɪd/造成的/ˌriːprəˈduːsəbl/可重现2Processmonitoring

isanindispensablepartofanymanufacturingendeavor.Itisessentialtotheoutcomeofthefabricationprocedurestoknow

whatistheconditionofthesemiconductorwaferunderprocessingateach

andeverystageofthefabricationprocess.Thus,semiconductormanufacturingprocessesmustbethoroughlymonitored.

Thegoaloftheprocessmonitoringistodetectpossibleprocessmalfunctionassoonasitactuallyoccurs.Otherwise,withwafersgettinglarger

andmoreexpensive,thecostofmanufacturingprocessesincreasing,andthe

numberofoperationsperformedoneachwafergrowing,lossesresultingfromanyprocessmalfunctioncouldbestaggering./ˈstæɡərɪŋ/令人吃惊的6.1Purpose/ˌɪndɪˈspensəb(ə)l/必需的/ˌmælˈfʌŋkʃ(ə)n/失效6SemiconductorMaterialsandProcessCharacterization26.1Purpose6SemiconductorMaterialsandProcessCharacterization(a)Off-lineprocessmonitoringondesig