瑞银-NVIDIA GTC大会结论：对科技供应链的影响-NVIDIA'S GTC conclusion：Implications for the Tech Supply Chain-20260323

a§

GlobalResearch

23March2026

APACTechnology

NVIDIA’sGTCconclusion:ImplicationsfortheTechSupplyChain

GTCtechsupplychainconclusionsandadditionalpaneltakeaways

NVIDIA’s16thGTCwasheldMarch16-19inSanJosewith30,000in-personand300,0000virtualaccessattendeesacross1,000sessionsand450+exhibits.Inthisreport,weincludeadditionaltakeawaysfromtheexhibitionfloorandsummarybulletsfrompanelsacrosscoolingandpower(CoolIT,Eaton,Delta,LiteOn,Schneider),ODMs(ASRock,Compal,GigaComputing,SupermicroandWistron)andmemory(Micron,Samsung,SKHynixandSolidigm)withothersessionscoveredinTimArcuri’sDay1,Day2,Day3,andDay4reportsandourGTCkeynotesupplychainimplicationsandAPACTechTourrecap(link,link).

Strongdemandandconstrainedsupply,thoughwithsmallpush-outsfromtheMiddleEast

NVIDIA’sopeningkeynotehighlighted2025-27BlackwellandRubinorderswerenowUS$1trn(vs.US$500bnfor2025-26lastfall)andthatpositivesentimentwasechoedonthefloorassupplybottlenecks(memorymostnotablybutalsooptics,PCB/substrate,andadvancedwafers)remainmoreaconcernthandemand.ThehighercomponentcostsalsolooktobepushinguprackpricingtoUS$6-7mnforVR200(vs.ourUS$6mnexpectation),upfromUS$4-4.5mnforGB300.DemandfeedbackisstrongbothfromCSPsandNeocloudssupportingourNVL72rackassumptionrampingfrom65kin2026to83kin2027(60kRubin+23kBlackwell)butalsopickingupfromenterprise,sovereignandtier2cloudforHGXdemandasusecasesforAIbroaden.MorerecentlytheUS-Iranconflictisopeningupprocurementconcernsformaterialdelivery.ODMsnotedsomedelaystoMiddleEastprojects/deliveriesandnetworkingsupportfromIsrael.

HardwareassemblysmootherandautomatedforRubin,Heliosracktimingabitlater

HardwareODMsonthefloorincludingHonHai,Wistron/Wiwynn,Quanta,Inventec,Compal,Lenovo,Pegatron,Asus,DellandSupermicroallechoedNVIDIA’scommentsonfasterandsmootherautomatedassemblyofthecomputetrayfrom2hoursto5minutesandimprovedmodulardesign.Rackassemblyandtesttimehaspulledinfrom4-6weekslastyearto2-3daysto1week(systemlevelburn-intest)thisyear.Whileinvestorsworryoncommoditization,leadODMshaveengagedinthatstandardizationmodelthroughouttheirhistoryinPCsandserversandwouldstillearnhigherGP$(albeitlowerGM%)onRubinvs.Blackwellforautomation,overseasproductioncosts,handlingandworkingcapitalfinancing,L11andverticalcomponentintegration.MostvendorsexpecttobeinmassproductionofVR200rackswithearlyvendorsfromAugustand2ndtiersuppliersfromOctoberalthoughconfidenceonmeetingthattimelineisloweronAMDHeliosgiventhenewdoublewiderackarchitectureandcouldpushitlateinto2026or2027atsomevendors.

RubincomponentstandardizationshowingupinNVIDIA’sMGXecosystem

NVIDIAonceagainshowcaseditsexpandingMGXsupplierboardintheGTCconcourse.TheMGXisdesignedtostreamlineandacceleratehardwareassembly,improveabilitytoupgradetonewgenerationsonannualcadence,andbuildaresilientsupplychainwithmultiplesuppliersatcompetitivecostalthoughdoesraiseinvestorfearofstandardizationequalingcommoditization.WhiletheMGXspecsarestandardized,vendorsstillhavedifferentwaystoimplementtoimprovereliabilityandcost,varyon

Equities

Global

Technology

RandyAbrams

Analyst

randy.abrams@

+886-2-87227338

NicolasGaudois

Analyst

nicolas.gaudois@

+65-64955148

SunnyLin

Analyst

sunny.lin@

+886-2-87227346

TimothyArcuri

Analyst

timothy.arcuri@

+1-415-3525676

DianaChang

Analyst

diana.chang@

+886-2-87227335

JerrySu

Analyst

jerry.su@

+886-28-7227306

ZoeXu

Analyst

zoe-za.xu@

+852-29717724

ThisreporthasbeenpreparedbyUBSSecuritiesPte.Ltd.,TaipeiBranch.ANALYSTCERTIFICATIONANDREQUIREDDISCLOSURES,iNcLuDiNGiNFoRmAtioNoNtHEQuANtitAtivEREsEARcHREviEwpuBLisHEDByUBS,BEGiNoNpAGE17.UBSdoesandseekstodobusinesswithcompaniescoveredinitsresearchreports.Asaresult,investorsshouldbeawarethatthefirmmayhaveaconflictofinterestthatcouldaffecttheobjectivityofthisreport.Investorsshouldconsiderthisreportasonlyasinglefactorinmakingtheirinvestmentdecision.

APACTechnology23March2026婚§2

timetomarket,serviceability,andcustomerserviceandsupport.Componentsondisplayincludepower(powershelf,distributionboardandsidecar),cooling(coldplates,rackmanifolds,innermanifolds,in-rowCDU,liquidcooledandHPMbusbar,powerwhip,UQD/MQD-universal/multiquickdisconnect),sliderails,rackchassis,andvoltageregulatormodule.

Powersupplyhasa50%+contentgainwithRubin,withpowerracksreadying

fasterforRubinUltra

TheAC-DCpowersupplyisupgradingfrom833kWpowershelvesdelivering264kWpowercapacityforGB300tosupporttherack’s130-140kWpowerwithredundancyto4110kWshelvesfor440kWpowercapacityforVR200NVL72rackstosupportits180kWMax-Qand227kWMax-PTDP.Rubinisa50%+contentgainforPSUcontenttosupportourestimatesforDeltatomaintainlastyear’s30%+YoYsalesgrowthonthebackofpowerandcoolinggrowth.Onemid-termriskisChinacompetitionwithMegmeetqualifiedbyNVIDIAandshowingupatUScustomersasaback-upsourcebyshiftingproductiontoThailandandalsosamplingitspowerrackfromApril.Westillviewspecsadvancingtoprotecthighershareforincumbents,withsteeperupgradewithRubinUltra,wherevendorsuniversallyseethehighercomputedensitymovingthepowercomponentsintoaseparatesidecarnexttotheITrack.Thefirstgenerationpowersidecarwouldfeature6x110kWpowershelvestoservea500-600kWITrackandalsointegrate5x90kWbatteryback-upshelves,powerdistributionunittoandoptionalcapacitorback-upunitsforhighercontentperwatt.VendorsarenotingNVIDIAbeingaggressivetopull-inthepowerracktoH226althoughlikelysmallvolumetobereadyforasteeperrampalongsideRubinUltrainH227.Aseparate400VsidecarsolutionisalsobeingreadiedforASICservers.Feynmancouldextendto1GWandrequirehigherdensityshelvesinthepowersidecar.

SolidStateTransformers(SST)abattlegroundforpowercontentin2-4years

800VDCtimingtostartintroducingasolidstatetransformerisstillinthe2028-2030timeperiod(potentiallyfirstwithNVIDIA’sFeynmangeneration)subjecttosafetystandardsalthoughDeltahasinitialsampleswithChinacustomersandfeedbackonthefloorshowsthepulliscomingfromthefieldsooner.TheSSTwillbeadisruptivebattlegroundasthatnewcontentdisplacestraditionaltransformersalongwithcontentfromUPSandAC-DCconversionneartherack.NewopportunitiesalsocomeinforBESS(batteryenergystorage)orfuelcells(DeltadevelopingwithCeres)and800Vto48VDC-DCconversioninrack.Vendorspursuingthisopportunitycouldincludegreyspacesuppliers(Vertiv,Schneider,Eatonetc),transformersuppliers(Siemens,MitsubishiandHitachi)andwhitespacesuppliersneartheITrack(Delta,LiteOn,Megmeet,Flex).Deltaviewsitsearlydevelopment,powerintegrationexpertiseandSiCmoduleworkwiththesiliconvendorsgivingitanopportunity.

CoolingarchitecturesstilldominatedbydirectchipcoolingandL2Asidecarsfor

RubinwhileL2LCDUsrampwithRubinUltra

ThecoolingarchitectureisstreamliningmovingfromBlackwelltoRubin,withliquidcoolingnowcovering100%oftheactivecomponents,fromhybrid80%liquid/20%airwithBlackwellto100%withRubinasnowboththehotsilicon(GPU,CPU)andfront-endcomponents(NICs,SSD,optics,VRMs)extendtothemajorcomponentsonthetraywithoutfansandimprovedinnermanifoldseparatinginflowandoutflowofliquid.Forthesidecar,L2AwhichisledinmarketsharebyDeltaextendsthroughtheRubingenerationthroughH127withDeltanowsupporting300kWcooling,LiteOndeveloping280kWCPUandSupermicroplanninganL2Asupporting500kW.L2LCDUsarebeinginstalledfornewbuildsandshouldbecomemainstreamwiththehigherpowerRubinUltrawithL2LCDUsprovidingcapacityfor2.4kWtosupport8VR200racksor4Kyberracks.L2LshouldseemorecompetitionfromsystemvendorslikeVertivandSchneider,althoughDeltaisalreadyqualifiedbyNVIDIAandemphasizingprovenreliability,maintenance,costefficiencies,DC-DCpumpsforlessnoiseandtrackrecordfromL2A.

MemoryinshortagebutacriticalcomponentforAIworkloads

ThekeynoteNVIDIAroadmapchangesandmemorysessionsechoedtherisingimportanceofmemoryasagentic,reasoningandmultimodalinferenceincreases.

Agentsandreasoningalongwithlongercontextlengtharecallingforhigherthroughputandmoretokenstopremiumusers,drivingincreasedcapacityandthroughputbothforHBMandforKvcacheoffloadtolargerpoolsofsystemmemory(shiftingtoLPDDRforlowerpower)andhighcapacityNANDSSDs.WeviewtheGroqLPUonlysupplementingtheVeraRubinGPUratherthandisplacingit.NVIDIAnotedfor

APACTechnology23March2026婚§3

itstop10customers(~60%ofrevenue)thattheseworkloadscoulddrive25%oftraffictoa220kWLPUserverusingonboardSRAMcacheandDDRassystemmemory.NVIDIArepresentativesfromGroqattheexpostillrecommendheavyVR200mixleveragingHBM,withsuggestionfora1:2mixofGPUstoLPUs.Inthissetup,GPUshandlethecomputeintensiveprefill,whiledecodeissplitsuchthatGPUsexecutetheattentionstageandLPUsexecutetheFFN(FeedforwardNetwork)stagetoimproveinferenceefficiency(9NVL72racks=648VeraRubinGPUsto5LPUracksx256LPUs(32traysof8LPUsx5racks=1,280LPUs)).BasedonfeedbackfromGTC,webelieverackpartnersfortheLPUserverareHonHaiandWistronandat10-15%oftherevenuecouldbeUS$50bnofincrementalhardwarerevenueata~2-3%OpM).

CPUscomplementingGPUcomputetodeliveragenticandmultimodalinference

NVIDIAreleasedaseparateCPUrackserverwith32traysof8CPUstohandletheincreasingcomputedemandsfororchestratingAIandalsohandlingtraditionalcomputetasksexecutedbyagents.TheCPUvolumeisseeingapick-upfortheseusesandconsolidationofolderlessefficientserverswiththeindustrystillcomputeconstrainedacrosschannels.CPUdemandisliftingsuppliersupstreamincludingAspeedrecentlyrevisingupguidance(link)andshouldsupportODMsmoreheavilytiltedtotraditionalserversincludingWiwynn(45%ofsales),Inventec(25%ofsales),Quanta(20%ofsales)andHonHai(10-15%ofsales).

NextgenrackdesignswithRubinUltra/Feynmanadjustingtoaccommodate

powerdensityandoptical

NVIDIAmodifiedandextendeditsroadmapvs.the2025GTC.TheRubinUltraKyberarchitecturehascompressedsincelastyearfrom4cannistersandmidplanePCBsto2cannistersandmidplanePCBseachcontaining4cabinetsof18computeblades,cuttingtheGPUsinthecabinetfrom288to144.WhileNVIDIA’sroadmapstillshowedadieshotwith4diesperGPU,powerandcoolingvendorsaredrivingtowardamoremanageable2-3xpowerupgradefrom227kWwithRubinto500-600kWpowerand

288diesforRubinUltrasupportedby660kWpowerrack.Thevendorsstillhaveonofferracksscalingover1MWsocouldindicatewestillseea576dierackin2027oritpushestoFeynmanin2028.NVIDIAalsointroducedanewNVL576‘scale-up’optionwithRubinUltraconnectingtogether8NVL72OberonrackswithopticaltransceiverandaNVL1,132optionwithFeynmanusingCPOtoconnect8NVL144Kyberracks.UBSviewsopticalgrowthfromthatlayoutadvancingforthemanyracktorackcommunicationsin2028withcopperstillusedforthebetweenrackconnections(link).WealsoseeKyberintroducingamidplaneconnectormodulesuppliedbyFIT,TEConnectivity,AmphenolandLuxshareversusthecartridgecablesinplaceforBlackwellandRubin.

StockoutlookintheAsiatechsupplychain

NVIDIA’sGTCkeptuspositiveontheAIsupplychainbarringprotractedMiddleEastconflictwithrelativepreferenceforsupplychaincomponentsandsemiconductorswithtightsupplyandrisingpricesversushardwarebrandsandtolesserextendODMshavingtopassthroughhighercomponentcostwithsomemarginpressure.WekeeppositiveonadvancedfoundrythroughTSMC,advancedpackaging(ASE,KYEC,HonPrecision),GPU/ASIC(Mediatek,Alchip,Aspeed),memory(Samsung,SKHynix,Micron),datacenterpowerupgrades(Delta),PCB/substrate(Unimicron,ShennanandShengyiTech).

Withinhardware,westillseepositiveperformancealbeitlaggingsemiswithearningsgrowthandsupportiveP/EforHonHai,Quanta,WistronandWiwynn.

APACTechnology23March2026a§4

Figure1:NVIDIAroadmap

Source:NVIDIA

Figure2:NVIDIAMGXreferencedesignsstandardizingcomponentassembly

Component

InRowL2LCDUColdPlate

RackManifoldInnerManifoldUQD/MQD

SlideRail

LiquidCooledBusbarHPMBusbar

PowerWhipChassis

PowerShelf

PowerSidecar

VoltageRegulatorModule

Supplier

Beehe,Boyd,Delta

AVC,CoolerMaster,Delta,Foxconn,JenTech

AVC,Boyd,CoolerMaster,CoolIT,Delta,Foxconn,LeadWealth,LiteOn,Pinda

Auras,AVC,Boyd,CoolerMaster,CoolIT,Delta,Foxconn,Readore

Auras,Beehe,Danfoss,Envicool,Fositek,LeadWealth,Lotes,Netonx,Nidec,Parker,Readore,Staubli,TaichengAccuride,ChengFwa,Fositek,Kingslide,Repon,YuansTech

Amphenol,Bizlink,Delta,Foxconn,Interplex,LeadWealth,Pinda

Amphenol,Bizlink,Foxconn,JPC,Lotes

Bizlink,Foxconn,JPC,Longwell

AVC,Chenbro,Foxconn,Interplex,Karrie,

Delta,Flex,LeadWealth,LiteOn,Megmeet,Schneider,Vertiv

APC,Delta,Eaton,Flex,LeadWealth,LiteOn,Megmeet,LeadWealth,Vertiv

ADI,Delta,Infineon,Innoscience,Megmeet,MonolithicPower,Navitas,OnSemi,Renesas,STM,TI

Source:CompanyData,UBS.Note:Vendorsondisplayonly-listnotexhaustiveofallsuppliers

APACTechnology23March2026a§5

APACTechnologyUBSResearch

PowerandCoolingPresentations

CoolIT:LiquidCooling:HowtoAchieve100%HeatCaptureon500kW+Racks

Speaker:AndrewBuckrell,PhD,SeniorThermalMechanicalEngineer,CoolITSystems

CoolITsolutions.CoolIThassolutionsrangingfromcoldplates,coldplateloops,manifolds,CDUsandpipingbetweenCDUandmanifolds.Itisworkingon100%heatcapturedesignsforHBM,voltageregulatormodules,SSDsandNICs.Itsportfolioincludescoldplatesthatcansitonprocessorsupto4kW,serverboardswith20kWpowerandCDUsthatcanhandle2MW+ofpowerandinthenextgenerationwouldscaleto3-4MW.

Coolingtheprocessor.CoolITdiscussedtechniquestoimprovethecoldplateincludingathermalinterfacematerial(TIM)madeofliquidmetal,finbondingwith50micronverticalfinsandlidbondingaroundthecoldplate.CoolIThasasplitflowtechnologytodirectcoolanttothehotspotsonachipandaunibodyprocessforreliability.Thecompanyalsooffersdoublesidedcoldplatesthatcancoolthetopsideandbottomsideofcomponents.Theindustryisalsomovingtoward2-phasecomponentswhichintegratevaporchamberandheatpipes.ThecompanyusesvaporchamberstocoolmemoryDIMMswhicharenowapproaching40W.

Coolingtheserver.Thecompanyoffersamonolithiccoldplateassemblywithmachinedchannelsforhigherflowratesandbettercontacttothecomponents.Ithasanallaluminumdesignforweightreduction.

Singlephasecoolingstillthebestapproachforheatcaptureinthenextdecade.

Thecompanyseessinglephasecoolingasthepathforwardforthenextdecadewithstrengthsofbestheatcaptureacrossdie(300W/cm-squared),chip(4kWTDP),server(20kW+)andrack(500kW+)plusbenefitsofinteroperability,multi-vendorusageanddifferentcoolantoptions.CoolITalsoexpectstointroducea15kWcoldplateasits6thgenerationinH126with100%heatcapture.

Capabilitiesadvancing.CoolITplanstoincreasedieheatfluxfrom300Wto500W/squarecentimeterinQ326,from4kW+to15kW+forcoldplatesinQ126,forserversfrom20kW+to50kW+inQ126andCDUsfrom2MW+to10MW+inrowin2027.

Eaton:ASafe,EfficientandScalableApproachto800VDCArchitecture

Speaker:JoshuaBuzzell,VP,DataCenterChiefArchitect

Eatonvisionforthedatacenter.Eaton’svisionissystemlevelco-designintegratingpower,ITandcoolingforhighdensitydeployments.Eatonnotedtrendsforrackpowertorampupfrom10-50kWperrackupto1MWanddatacenterpowerto1GW,requiringmodular,scalableandfaulttolerantinfrastructure.

Modulararchitecturestrategyfordatacenters.Eaton'sstrategytobuilddatacentersbyblocks:1)powergeneration/gridconnection,2)grayspacepowerconditioning(generation,substations,BESS),3)isolationandstability(switchgear,mediumvoltagetransformers,UPS,cablemanagement),4)whitespacepowerconditioning/delivery/stability(800VDCsidecar,busbars,supercapacitors),5)cooling.Sidecaraninterimsolution.ThecurrentgenerationdatacenterhasaUPSwhichrequiresAC-DCandDC-ACconversionat97.5%efficiency.ThenextphaseisanAC-DCsidecartotransfer480VACto800VDCpowerat98%efficiency.Thefinalstepisthemediumvoltagesolidstatetransformerat98.5%efficiencytoconvertthemediumvoltACtolowvoltageDCandthenhaveDCdistributionthroughoutthedatacenter.EatonseesthisSSTdeliveringpowertotherackoramoduleinthewhitespace.

APACTechnology23March2026婚§6

Eaton’splanforamediumvoltageSST.Eatonisdesigningamediumvoltagesolidstatetransformertotakein9-500kV,transformthatvoltagedownto9-35kVandthenuseaSSTtoconvertthevoltageto800VDCpower.ThebenefitofanSSTisthatitcanfitinthebackofatruckandconsolidatealotofdevices(padmountedtransformer,mainswitchboard,UPS,lowvoltagedistribution).FeaturesofEaton’sSSTwillincludeintelligentpowermodule,reconfigurableandselfhealingpowerdeliverywithredundancy,abilitytowithstand2xvoltagesurgefor2minutes,magneticlink/synchronousswitchingandlowcapacitanceintheDCbuswithArcflashfreefortheoutputports.Challengeshistoricallyincludecost,reliabilityandstressesfrominternalandexternalfaultslikepowersurgesandshortcircuits.Largeloadsathighvoltagecancreaterisksoffaultcurrents,arcflashenergy,malfunctionofdeviceprotection,andfaults.

Buswaydistributionsystem.Ahighcapacitybusbarcandistributethe800VDCacrossthedatahallwithplug-inrackfeeds.Thebuswaycansupportthousandsofamps,plugandplayrackfeesandlesscablingcomplexity.ThedistributionpointcandeliverthepowereithertoaDCremotesidecarorremotepowerpaneltosplitthe800VDCfeedintodifferentcircuitsfortheracks.Rackdensityisgoingfrom150kWto250-350kWbutwilleventuallygetto1.5MW.Todeliverthat,abuswaysystemwithplug-intapboxescouldbeusedtodeliverpowertoracksalongthebuswayorremotepowerpanelscanbeusedtoservegroupsofsmallerracks.

Delta:800VDCPowerandModularDataCenterSolutions

forNextGenAIInfrastructure

Speakers:RalfPieper,R&DDirector(26yearsatDelta)andJasonAgee,DirectorofDataCenterSolutions&Architecture(25yearsindatacenterinfrastructure)

Evolutionofthepowersupplyinthedatacenter.Deltadiscussedtheevolutionofthepowerdistributioninthedatacenter,startingwithFacebook’sOpenComputeProjectwithitsOpenRackversion2(ORV2)whichpoweredarackwith12voltstodeliver25-30kWofpower.TheORV3upgradedthatto50Vtoraisethepowerlevelto200-250kWnowinmassproductionforBlackwellandthecomingRubingenerations.

ThespeakernotedtheplanswithRubinUltraandbeyondtoreachupto1MWofpowertotherackmakes50Vinsufficient,asitwouldrequire20,000ampstodeliverthatmuchpower.Anupgradeto800VDCisnowintheworkstobringthoseampstoamorerealisticlevel.Deltaviewsitselfaleaderforthistransitionas#1inpowersupplyandbrushlessfanswithUS$17.9bnsalesin2026(upfromUS$13bn)and>8%ofrevenuereinvestedinR&D.

ScaleupoftheAIserverrequiringhigherdensitypowershelvesand800VDC

Power.TheAIserverrackpoweriscurrentlydeploying33kWpowershelveswithsinglephasepowersuppliersx4shelvesfor120kWofpower.ForVR200,itwillupgradeto110kWx4shelvestodeliver440kWofpower.WithaclusterofITracksinthefutureat

576GPUs,itwillrequire800Vdatacentertodeliverover1MWofpower.

Chiptodatacenterpowerdemandallscalingup.ThepowerlevelscalesupfromtheAIchipwhichhas500W-1.5kW,AIserverboardwith4-8chipsontheboardwith2-10kW,AIserverrackwith18boardsat30-120kWandaclusterforthedatacenterreaching30-120MW.Inthefuture,theselevelswillincreaseforthechipto2kW,serversto15kW,racksfrom250kWto1MWandthedatacenterupto1GW.Arackisnowtheequivalentof100housesand1datacenterupto100,000houses.Delta’spowersuppliesnowreach98%efficiency,up2%vs.the12Vunitsadecadebacktohelpconservesomeofthispower.

800Vdatacentertransitionplan.Thecurrentdatacenterstepsdownfromalinefrequencytransformerfrom34.5kVto400-480VAC.AGB300singlephasepowershelfconvertsthe480VACto50VDCtodeliverappropriatepowertherackbusbartothengointotheservertodownconverttoa12Vandthen<1VtodeliverthepowertotheGPU.ForVeraRubin,unitswillmovetoa3phaseACunitat18kWand50Voutputtothebusbar.Forover250kWracksfromRubinUltra,Deltarecommendsthe800Vsidecarforthe3phaseACtogenerate800V.ThatisdistributedthroughacrosslinkcableratherthanbusbartotheITrack.Intherack,itwillneedanewDCtoDCconvertertoconvertthe800Vto50Vandthencandownconvertto50V/12Vand0-1VtotheDatacenter.Inthefinalstage,anSSTtransceiverdirectlyconvertsthe34.5kVACpowerdirectlyto

APACTechnology23March2026a§7

800VDCwhichthenisdistributedinsidethedatacentertoaDCtoDCconvertertolowerthevoltagefrom800Vdownto12Vand0-1V.

Delta’sproductfamilytoNVIDIA.Deltashoweditsroadmapforpowerdelivery:1)GB200/30033kWpowershelfmadeupof5.5kWx6powersuppliersat50Vwith75Jperpowersupply,2)VeraRubin100kWpowershelfmadeupof18.5kWpowershelvesand1,200JperPSU(10xincrease)andRubinUltra+with110kWpowershelfx6andintegrated5integrated16kWBBUs.The110kWpowershelfis3RU(3.3xthe33kWlevelofBlackwellinthesamespace)forthe400-480kWinputvoltageconversionto52-54Vwith12Vand6Ampsstandbyvoltageandcurrentand1,200Jenergybuffertoflattentheinputcurrentperfectly.

Gridtochippowersolutions.Deltamappedoutthepowerconversionforthedatacenter.Thepowerisdeliveredfromthegridat34.5kVACfromthegridtotransformertostepdownto400-480VACintoanATSmodule,storedasACtoACintheUPSmodulebackedbyLi-Ionbatteries,thendeliveredtoapowerdistributionunittothepowershelvestoformtheconversionfromACtoDCandthenonvoltageregulatormodulesmaketheconversiondownfrom50Vto6/12Vto1Vonthecomputeboard.

Optionstosmoothoutthecurrent-highenergypowersupplyunitanew

solutiontosmoothvoltage.Oneoptionforasmoothcurrentistoaddanoptionalpowercapunit(PCS)orcapacitorback-upunit(CBU)whichcanbehookeduptosmooththeinputoftheACpower.Itdoeshavedisadvantageofconsumingrackspaceandisalsoexternaltotherackwhichsometimeshasabitoflatency.TheotheroptionbeingpromotedbyDeltaistouseahighenergypowersupplyunitwhichadds16energystoragealuminumcapacitorsinthePSUandsoftwarecontroltosmooththehighfrequencydynamicloadandflattenthepowervariationsdeliveredtotheGPU.

Powershelvesunabletoscalefurtherup,requiringaseparatepowerrack.AtypicalAIracknowhas4powershelvesatthetopandbottomaroundthe18computetraysand9switchtrays.Thechallengescalingforwardisnoroomleftforadditionalshelves,batteryback-uporsupercapacitorPCSshelvestopowerbufferforsmoothpowertotheGPU.Thesolutionistheseparatepowerrackorsidecarcontainingpowershelf,powerdistributionunit,batteryback-upunitandcapacitorback-upunit.

Delta’s800VDC660kWpowersystemwithBBU.Deltaisqualifyingits660kWpowersystemthatcantake415-480VACpowerandconvertto800VDCpowerinaseparatesidecarnexttotherack.Thesystemcontains6110kW(6piecesof18.5kW)powershelves(660kWpower)and5shelveswith518kWbatteriesfor450kWback-uppower,hotpluggablepowersupplyandbatteryback-upand98%efficiencyinarackat600x1,200,2,235mmdimensions.Eachshelfis6Uhighwith3rowsofPSUsandDCfanforairflowand5rowsofBBUs.Forconversiontolowervoltageintherack,DeltaisalsoofferinganIT-racklevel800VDCto50Vconversionina1RUconceptthatoutputtoabusbarclipandcontrolledthroughEthernet.

Long-termevolutiontoaGWdatacenter.Delta’slong-termvisionfortheAIdata