落基山研究所RMI：解锁低碳半导体晶圆市场化机制初步评估报告2026

RMI

Unlocking

Low-Carbon

SemiconductorWafers

Aninitialassessmentofmarket-basedmechanismstosupport

decarbonization

IndustryBriefing/October2026

AuthorsandAcknowledgments

Authors

HyllaBarbosa

SravanChalasani

TJConway

WenjuanLiu

HaoWu

IrisWu

Authorslistedalphabetically.AllauthorsfromRMIunlessotherwisenoted.

Contacts

HaoWu,hwu@rmi.org

WenjuanLiu,wliu@

TJConway,tconway@

CopyrightsandCitation

HaoWu,WenjuanLiu,IrisWu,SravanChalasani,HyllaBarbosa,andTJConway,UnlockingLow-Carbon

SemiconductorWafers:Aninitialassessmentofmarket-basedmechanismstosupportdecarbonization,RMI,2026,

/resources/unlocking-low-carbon-semiconductor-wafers.

RMIvaluescollaborationandaimstoacceleratetheenergytransitionthroughsharingknowledgeand

insights.Wethereforeallowinterestedpartiestoreference,share,andciteourworkthroughtheCreativeCommonsCCBY-SA4.0license.

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Acknowledgments

Thisreportwasdevelopedthroughacollaborativeeffortwithpartnersacrossthesemiconductorsupply

chain.WegratefullyacknowledgeHemlockSemiconductor,MicronTechnology,Microsoft,andShin-Etsu

Handotai(SEH)America,andthefollowingindividualsfortheirvaluablecontributions,expertise,andinsights:

Hemlock

Semiconductor:

CalebWalker,MatthewDeeg,andStevenHolty

micron

MicronTechnology:CraigMurphy,

DaleStump,and

MarshallChase

Microsoft:AviAllison,BranislavCuranovic,

InesSousa,JoshLasky,KaliFrost,KatieRoss,

andSamJohnston

Shin-EtsuHandotai(SEH)America:

NeilWeaver

UnlockingLowCarbonSemiconductorWafers,

UnlockingLow-CarbonSemiconductorWafers,

AboutRMI

RockyMountainInstitute(RMI)isanindependent,nonpartisannonprofitfoundedin1982thattransformsglobalenergysystemsthroughmarket-drivensolutionstosecureaprosperous,resilient,cleanenergy

futureforall.Incollaborationwithbusinesses,policymakers,funders,communities,andotherpartners,RMIdrivesinvestmenttoscalecleanenergysolutions,reduceenergywaste,andboostaccesstoaffordablecleanenergyinwaysthatenhancesecurity,strengthentheeconomy,andimprovepeople'slivelihoods.

RMIisactiveinover50countries.

TableofContents

ExecutiveSummary 5

WhySemiconductorWaferDecarbonizationMatters 7

Theurgencyofsemiconductorwaferdecarbonizationinthecontextoftheenergy

transitionanddigitalization 7

Keyemissionssourcesacrossthesemiconductorwafersupplychain 8

Decarbonizationleversforthesemiconductorwafersupplychain 9

TheEmergingMarketforLow-CarbonWafers:

Progress,Barriers,andtheNeedforNewApproaches 10

Themarketforlow-carbonwafersremainsnascent 10

Whyanewmarketmechanism,suchasBookandClaim,isneeded

totacklethechallenges ………11

HowDoesB&CWorkfortheSemiconductorWaferSupplyChain?.12

ThelandscapeofB&Csystems 12

B&Capplicationsinthesemiconductorindustry 13

DesignApproachforaSemiconductorWaferB&CSystem 15

Objectivesandapproach ………15

Keysystemdesignelementsandwhytheyarerelevant 16

Keyrecommendationsforeachdesignelement 21

PathForwardandCalltoAction 23

Endnotes …………24

ExecutiveSummary

Therapidgrowthofartificialintelligence,cloudcomputing,andcleanenergytechnologiesisincreasingsemiconductordemandandtheurgencyofreducingemissionsacrosssemiconductorsupplychains.

Waferproductionishighlyelectricity-intensive,makingcarbon-freeelectricity(CFE)thelargestnear-termemissionsreductionlever,complementedbyenergyefficiency,lower-carbonmetallurgical-gradesilicon,andprocessinnovation.

Yetupstreamdecarbonizationremainsdifficult.Scalingtheseleversrequiresconsistentandtransparentemissionsaccountingalongsidemarketsignalsthatconnectdownstreamclimatecommitmentswith

upstreaminvestment.Marketmechanismscanhelpbridgethisgapbyaggregatingdemand,recognizinglower-carbonproduction,andcreatingcrediblecommercialincentivesforsupplierstoinvestin

decarbonization.

Thisindustrybriefingexploreshowbook-and-claim(B&C)canincentivizedecarbonizationatthepolysilicon

andwaferproductionstagesbyenablingverifiedenvironmentalattributestobetransferredseparately

fromphysicalproducts.Itistheoutcomeofacollaborativeprojectdrawingontheindependentexpertiseofsemiconductorsupply-chainpartnersHemlockSemiconductor,apolysiliconproducer;Shin-EtsuHandotaiAmerica,awafermanufacturer;MicronTechnology,asemiconductormanufacturer;andMicrosoft,a

downstreamtechnologybuyer.AninitialB&Csystemdesignisproposed,coveringfunctionalunits,

eligibilitycriteria,transactionrules,claimsandinventoryaccounting.ItpositionsB&Casatransitionalmechanismthatcancomplementlonger-termimprovementsinemissionstransparency,traceability,andphysicalsourcing.

TheindustrybriefingalsoidentifiesprioritiesforatheoreticalpilotimplementationofaB&Csystem

forpolysiliconandwaferproductionstagesaswellaslonger-termmarketdevelopment.Itsfindingsarerelevanttosemiconductorbuyers,suppliers,industryassociations,standardsbodies,andpolicymakersseekingtostrengthendemandsignals,improveemissionsdataandstandards,andbuildcrediblemarketinfrastructureforscalinglower-emissionswaferproduction.Learningsfromapotentialfuturepilotcouldalsoinformtheapplicationofmarket-basedmechanismssuchasB&Ctodecarbonizeotherpartsofthesemiconductorsupplychain.

UnlockingLow-CarbonSemiconductorWafers,

PurposeofThisIndustryBriefing

Thisindustrybriefingisintendedtostimulateindustrydiscussion,highlightkeydesign

considerations,andidentifyareasrequiringfurthercollaborationandtestingtoadvanceapproaches

forcreatingandscalingbuyerdemandforlow-carbonsemiconductorwaferproduction.Itdoesnotproposeorendorseafinalmarketframeworkorindustrystandard,andthedesignconsiderationsandrecommendationsdescribedinthispapershouldnotbeunderstoodasrepresentinga

positionorcommitmentofanyparticipantregardingfuturetransactions,investments,accountingapproaches,ormarketframeworks.

Animportantnotice

Thisindustrybriefingisprovidedforinformationalanddiscussionpurposesonly.Itreflectstheoutcomesofalimitedcollaborationprojectanddoesnotestablish,endorse,orapproveafinalB&Cframework,marketstandard,methodology,orclaimsprotocolforsemiconductorwafersorenvironmentalattributecertificates.Nothinginthispapercreatesanycontractualcommitment,representation,warranty,orobligationforanyparticipant,norshoulditbeinterpretedasa

commitmenttoenterintofuturetransactions,makeinvestments,adoptanysystem,orsupportanystandard.

Thisindustrybriefingincludesinformationobtainedorderivedfrompubliclyavailableand/or

third-partysourcesthathavenotbeenindependentlyverified.Norepresentationorwarrantyismadeastotheaccuracy,completeness,reliability,orcurrencyofthisinformation.Thisindustrybriefingshouldnotberelieduponasarecommendationorforecastbytheauthors,contributors,orprojectparticipants.

Anystatementsregardinglow-carbonwafers,environmentalattributes,GHGemissionsaccounting,additionality,emissionsreductions,orEAC-relatedclaimsaresubjecttoapplicablelaws,reportingstandards,assurancerequirements,registryrules,andapprovedclaimsguidance.Norepresentationorwarrantyismadethatanymethodology,certificate,accountingtreatment,orclaimdescribedinthispaperwillbeacceptedbyregulators,auditors,standardsetters,customers,orotherthirdparties.

Thisindustrybriefingmayincludeestimates,assumptions,scenarios,andforward-looking

statementsthatareinherentlyuncertainandmaychange.Tothemaximumextentpermittedbylaw,theauthors,contributors,andprojectparticipantsdisclaimliabilityforanyrelianceonthisindustrybriefingortheinformationcontainedinit.

UnlockingLowCarbonSemiconductorWafers

WhySemiconductorWaferDecarbonizationMatters

Theurgencyofsemiconductorwaferdecarbonization

inthecontextoftheenergytransitionanddigitalization

Semiconductorsarefoundationaltothemoderneconomy,enablingdigitalization,artificialintelligence(Al),electrification,andthecleanenergytransitionacrossapplicationsincludingdatacenters,cloud

computing,electricvehicles,carbon-freeelectricity(CFE)systems,industrialautomation,and

communicationsinfrastructure.AccordingtotheWorldSemiconductorTradeStatistics,theexplosive

expansionofAlinfrastructureisexpectedtobeakeygrowthdriverforsemiconductorproductswithsalesexpectedtoreachUSS975billionin2026.¹

Despiteclimatecommitments,thesemiconductorindustryfacesincreasingdecarbonizationchallenges.Growingdemandforadvancedsemiconductors,particularlythoseenablingAlandotherdigital

technologies,isdrivingcontinuedexpansioninmanufacturingcapacity.Industryanalysesprojectthatsemiconductormanufacturingemissionswillcontinuerisingthrough2030,underscoringtheneedforacceleratedemissionsreductioneffortsacrossthesemiconductorsupplychain.²

Atthesametime,technologycompanies,includingcloudserviceprovidersandconsumerelectronics

companies,facegrowingpressuretoreducesupply-chainemissionsassociatedwithpurchasedgoods

andservicesandcapitalgoods,includingsemiconductorchips.Thisindustrybriefingistheoutcome

ofacollaborativeprojectofpartnersrepresentingkeystagesofthesemiconductorvaluechain,from

upstreamsiliconandbarewaferproductionthroughchipmanufacturingtotechnologycompanies

purchasingandusingthosechips(seeExhibit1,nextpage).Aschipmanufacturersmakeprogresson

theiroperationalemissionsreductions,upstreamemissionsfromtheirsupplychainpurchases(e.g.,barewafers,processchemicals,etc.)mayrepresentagrowingshareofresidualemissionsthatend-customersofsemiconductorchips(suchascloudserviceprovidersandconsumerelectronicscompanies)would

needtotackletoachievetheirScope3net-zerotargets.Basedoncurrentindustrytrends,end-customersofsemiconductorchipsarelikelytoplaceincreasingemphasisondatatransparencyforemissions

upstreamofchipmanufacturinganddecarbonizationofinputmaterialssuchasthewafersusedinchipmanufacturing.3

iCFEisdefinedasincludingtechnologieswithzerodirectCO₂emissionsandbiogenictechnologieswithlife-cycleemissionsequivalenttothoseofotherrenewables.

UnlockingLow-CarbonSemiconductorWafersmi.org/

Exhibit1Semiconductormanufacturingsupplychainandupstreamwaferemissionsprofile

INPROJECTSCOPEOUTSIDEPROJECTSCOPE

PolysiliconmanufacturerWafermanufacturer

IIII1

Wafer

Production

Baresiliconwafers

36%

Chip

Fabrication

Deposition,

lithography,etch,andclean

AssemblyandPackaging

Dice,package,andtest

Final

Application

Serversand

electronicequipment

Inputmaterials

Industrialheat

(fossilfuel-based)

Electricity

30%75%ofcombinedemissionscomefromelectricity

2%

QuartzMining

High-purity

silicondioxide

(SiO₂)from

quartz

MG-Si

Production

Reductionin

electricarc

furnaceto

produce

98%-99%

puresilicon

PolysiliconRefining

Chemical

purificationand

depositionto

producehigh

purity(~11N)

polycrystalline

silicon

Ingot

Growth

Single-crystalsilicon

0.07%

(nottoscale)

SHAREOFEMISSIONSBYSTAGE

3%

29%

18%

25%

5%

Note:Thisrepresentstheproject'sfindingsonemissionsassociatedwith300millimeterbarememorywaferproduction.Quartzminingemissionsare

notshownbecausetheyrepresentonly0.07%oftheoverallmine-to-waferproductionemissions.Thepercentvaluesshowninthegraphrepresentthe

contibutionofanemisionssourcetotheoverallmine-to-waferemissions(e.g,electricityuseattheingotgrowthstagecontributes18%oftheoverllmine-to-waferemisions).Percentagesmaynotsumto100%duetorounding.Upstreamprocessesuseavarietyofiputmaterials,andspecificprocesschoices

bythewafersuppliermayaffetthetotalemissionsfrominputmaterials.Forexample,slicingmaybeaccomplishedbydiamond-encrustedwireorbywirewithasiliconcarbideslurry.Thepercentagesdonotreflectanyparticulargeographiclocationorprocesschoice.Thetotalemissionsassciatedwithinputmaterialsarelikelyunderrepresented.

RMIGraphic.Source:RMIanalysisbasedoninputsfromprojectpartners

Keyemissionssourcesacrossthesemiconductorwafersupplychain

Thesemiconductorwafersupplychainspansmultipleenergy-intensiveproductionstagesthatheavilyrelyonelectricity(seeExhibit1).Intheproductionprocess,high-purityquartzisminedandthen

refinedtoproducemetallurgical-gradesilicon(MG-Si),typicallythroughcarbothermicreductionin

anelectricarcfurnace.MG-Siisthenconvertedintoelectronic-gradepolysilicon(EG-Si)throughan

energy-intensiveprocessinaSiemensreactor.Tobeusedforsemiconductorchips,polysiliconneedstobefurtherpurifiedintomonocrystallinesiliconingotsthroughtheCzochralskicrystalgrowthprocessandthenslicedintowafers.Thewafersgothroughaseriesoffinishingstepsincleanrooms,including

etching,polishing,andcleaningaswellasepitaxialgrowth(particularlyforlogicwafers)beforebeingsuppliedtosemiconductormanufacturers.

UnlockingLow-CarbonSemiconductorWafers

Overall,basedonthisproject'sfindings,electricityaccountsforapproximately75%oftotalmine-to-waferemissions,reflectingthehighlyelectrifiednatureofwaferproduction.Additionalemissionsarisefrom

naturalgasuseforindustrialheat(~7%);productionofargonusedduringingotgrowth(~9%);'"chemicalsusedinwaferslicing,etching,andpolishing(~3%);andprocessemissionsassociatedwithusingcarbon-basedreducingagentsduringMG-Siproduction(~2%).

Decarbonizationleversforthesemiconductorwafersupplychain

Thisemissionsprofilesuggeststhatdecarbonizingtheelectricityusedinsemiconductorwaferproductionrepresentsasignificantemissionsreductionopportunity,whilelow-carboninputmaterialsandinnovativetechnologiestoreduceprocessheat-relatedemissionscanprovideadditionalreductions."

Basedonthisproject'sfindings,transitioningtoCFEislikelyaneffectivelevertoreducewaferproductionemissions,includingbothdirectsourcingandleveragingmarketinstrumentslikeRECs,representingthemostfeasiblenear-termactionsforachievingthesepotentiallysignificantdecarbonizationoutcomesfortheentiresupplychain.Otherdecarbonizationoptionsincludeenergyefficiencyimprovementsacross

polysiliconpurification,ingotgrowth,andwafermanufacturingprocesses.Theprojectpartnersalso

highlightedthatequipmentupgrades,useofgreenhydrogen,andwasteheatrecovery(usingindustrial

heatpumps)mayalsoreduceemissionswhilemaintainingproductqualityandyield.Sourcinglow-carbonMG-SiproducedusingCFEandbio-basedreductants,aswellasnovelhydrogenplasmareduction-basedMG-Siproductiontechnologies,mayfurtherreduceupstreamemissions.4

Thisproject'ssupply-chainpartnersassessedthesedecarbonizationoptionsacrossfactors,including

emissionsreductionpotential,scalability,catalyticinfluence,additionality,andcost,andidentified

CFEasanimpactfulandactionableopportunitybasedontheabove-mentionedfactorsandthevarious

assumptionsspecifictothisproject.Basedonthisproject'sfindings,switchingtoCFEforthepolysiliconrefiningprocessmayreducemine-to-waferproductionemissionsbyanestimated25%.Similarly,using

CFEforingotgrowth,waferslicingandpolishingprocessesmayreducethemine-to-waferproduction

emissionsbyupto48%basedondataassumptionsmadeinthisproject.Inaddition,sourcinglow-carbonMG-SiproducedwithCFEandbio-basedreductantsmayreduceemissionsbyanadditional4%inthe

shorttermbasedonassumptionsmadeforthisproject.Collectively,thesedecarbonizationmeasuresmayreduceoverallmine-to-waferemissionsbyanestimated77%.

Acceleratingdeploymentofthesedecarbonizationoptionsrequiresmoreinvestments,strongerdemandsignalsfromdownstreambuyers,andcrediblemechanismsthatenablerecognitionanddifferentiationoflow-carbonsemiconductorwafers.

iiThemajorityofemissionsassociatedwithargonproductionisalsotiedtoelectricityconsumption.

iiiInthisreport,“low-carbon”referstoproductsorinputmaterialsproducedwithlowergreenhousegasemissionsthan

conventionalalternatives.“Low-carbon”productionherecanincludetheuseofcarbon-freeelectricityaswellasnewerlessemissions-intensiveproductiontechnologies.Establishingaquantitativethresholdfor“Iow-carbon”productsinthesemiconductorsupplychainisbeyondthescopeofthisreport.

UnlockingLow-CarbonSemiconductorWafersmi.org

TheEmergingMarketforLow-Carbon

Wafers:Progress,Barriers,andthe

NeedforNewApproaches

Themarketforlow-carbonwafersremainsnascent

Decarbonizingsemiconductorwafersrepresentsanimportantopportunitytoreducesupply-chain

emissions.Asoutlinedintheprevioussection,measuressuchascarbon-freeelectricity(CFE)procurementandlower-carboninputmaterialsmayreduceemissionsassociatedwithpolysiliconandwaferproduction.Scalingthesemeasures,however,requiresnotonlytechnicalsolutionsbutalsotheabilitytomeasure,

recognize,andsupportemissionsreductionsacrossacomplex,multi-tiervaluechain.

Greatertransparencyandconsistencyinemissionsdatacanhelpcompaniesbetterunderstandthecarbonimpactoftheproductstheypurchaseandrecognizelower-carbonproductionpractices.Industrytools

suchasproductcategoryrules(PCRs)andenvironmentalproductdeclarations(EPDs)cansupportthisbyestablishingmoreconsistentapproachestoquantifyingandcommunicatingenvironmentalperformance,enablingmoreinformedprocurementdecisions.

However,transparencyalonemaynotfullyaddressthechallengeofaligningincentivesacrossthevalue

chain.Companiesseekingtoreducesupply-chainemissionsmaybeseveraltiersremovedfromthepolysiliconandwafermanufacturersmakingdecarbonizationinvestments.Asaresult,downstreamdemandforemissionsreductionsmaynotalwaystranslatedirectlyintosufficientmarketsignalsorcertaintyforupstreamsuppliersconsideringinvestmentsinlower-carbonproduction.

Thesebarriersreinforcetheneedformarketmechanismsthataggregatedemand,createcredible

recognitionforlow-carbonproduction,andtranslatedownstreamclimatecommitmentsintocommercialincentivesforupstreamsuppliers.

“Wearecommittedtodecarbonizingpolysilicon

productionthroughmultiplepathways,includingCFEandbio-basedreductants.Thechallengeisnotidentifying

opportunitiestoreduceemissions,butcreatingamarketthatrecognizestheseinvestmentsandprovidesthe

demandcertaintyneededtoscalethem.”

-PhilRausch,VicePresidentofCommercial,HemlockSemiconductor

UnlockingLow-CarbonSemiconductorWafers

/10

Whyanewmarketmechanism,suchasBookandClaim(B&C),

isneededtotacklethechallenges

Amorefit-for-purposemarketmechanismisneededtoenablesupplierstogenerateverifiedproduct-levelattributesfromCFEandotherdecarbonizationactionsandtransferthemtodownstreambuyers.Two

commonlyusedapproachesaremassbalanceandbook-and-claim(B&C).Massbalanceallocatesattributesacrossphysicalproductvolumesusingpredefinedrules,whereasB&Cseparatestheattributesfromthe

physicalproductandtransfersthemthroughenvironmentalattributecertificates(EACs)representingtheverifiedemissionsperformanceofaquantityofproduct.Buyerscanretirethesecertificatestosubstantiatesupply-chainemissionsclaimswithoutreceivingtheassociatedlow-carbonmaterial.

Bothapproacheshavepotentialapplicabilitywithinthesemiconductorwafersupplychain.Massbalance

preservessomephysicaltraceabilitybutrequiresattributesandassociatedpremiumstopassthrough

eachintermediary.Thisbecomesincreasinglycomplexwhereemissionsreductionsoccurfarupstreamandconfidentialitylimitsdatasharingamongwafermanufacturers,chipfabricators,andtechnologycompanies.

B&CverifiesperformanceatthepointofproductionandallowstheresultingEACtobetransferreddirectlytoadownstreambuyerwithouttrackingtheattributethrougheveryphysicaltransaction.Thisoffersamorescalablenear-termpathwayforrewardingupstreamdecarbonizationinconfidentiality-sensitivesupply

chains.Morephysicallylinkedapproachesmaybecomeincreasinglyfeasibleasaccountingpractices,traceabilitysystems,andindustrystandardsmature.

"ReducingScope3emissionsrequiresustoinnovateand

createthesolutionsneededtodrivedecarbonization

throughoutourvaluechain.Thiscollaborationexplored

howwecantackleembodiedcarbonfurtherupstreamin

thehardwaresupplychain,includingadvancinglow-carbonwafersinthesemiconductorindustry.”

-LeoAspauza,SeniorDirectorCloudSupplyChainandSustainability,Microsoft

UnlockingLow-CarbonSemiconductorWafers1

HowDoesB&CWorkforthe

SemiconductorWaferSupplyChain?

ThelandscapeofB&Csystems

B&Csystemsareincreasinglybeingusedtosupportdecarbonizationinsectorswherephysicaltraceabilityisdifficult,supplychainsarecomplex,orlow-carbonsupplyremainsconstrained.ThismodelisalreadywellestablishedinCFEmarketsthroughinstrumentssuchasRECsandguaranteesoforigin,andin

emissionsreductionsrelatedtotransportationfuelinspecificjurisdictions(e.g.,California'sLowCarbonFuelStandardprogram).5TheB&Cmodelhasalsobeengainingtractionintheaviationsectorthroughsustainableaviationfuel(SAF).⁶Morerecently,industrialsectors,includingsteel,cementandconcrete,8andchemicals,9havebegunexploringsuchanapproach.

OnecompellingexampleofB&CinactionistheSAFmarket.TheSustainableAviationBuyersAlliance

(SABA)offersascalablesolutionfordecarbonizingaviationbyaggregatingdemandacrossmorethan30membercompaniesandenablingthemtopurchaseSAFcertificates(SAFc)withoutneedingtophysicallyaccessthefuelsupplychain.TheenvironmentalattributesofSAFaredecoupledfromthephysicalfuel,allowingairlinestoblendSAFatthepointoffueldistributionwhilecorporatebuyersretirecertificates

againsttheirScope3emissions.SABAmembershavejointlycommittednearlyS200milliontowardSAFcpurchases,contributingtomorethan500,000tonsofCO₂eabatedthroughthemarket.10

AfunctioningB&Csystemtypicallyreliesonthreeinterconnectedcomponents.First,aproductcertificationschemeisneededtoverifythatlow-carbonproductsmeetcredibleandconsistentenvironmental

requirementsthroughrobustsustainabilitystandardsandthird-partyverification.Second,aB&Csysteminfrastructure(includingasystemmanual,registryrulebook,andgoverneddigitalregistry)isrequiredtosecurelyissue,transfer,andretirecertificatesaccordingtodefinedrules.Third,claimreportingguidanceisneededtosupportbuyersincrediblyaccountingforandcommunicatinggreenproductclaimswithincorporateclimatedisclosuresandtopreventdoublecounting.

Standard-settingandcarbonaccountingorganizations,includingtheGreenhouseGasProtocol

(GHGProtocol),1theScienceBasedTargetsinitiative(SBTi),²andtheInternationalOrganizationforStandardization(ISO),³aredevelopingguidancetoclarifytheroleofEACs,establishqualitycriteria,andstrengthenreportingrequirements.Inaddition,theyareimprovingsafeguardsagainstdoublecountingtoensurethatthesameemissionsattributescannotberepresentedinmorethanone

certificateorsoldorclaimedoutsideanapprovedco-claimingarrangement.Thesedevelopmentsprovideanimportantfoundationfordesigninghigh-integrityB&Csystemsandinformthedesignprinciplesconsideredinthisproject.

UnlockingLow-CarbonSemiconductorWafers

/

B&Capplicationsinthesemiconductorindustry

Whichproductionstagesandproductsshouldbeeligible?

Oneofthefirstdesignquestionsiswhereincentivesaremostneededinthesupplychain.Insemiconductors,significantdecarbonizationopportunitiesexistatboththepolysiliconandwafermanufacturingstages.

PolysiliconproducerscanreduceemissionsthroughCFEprocurementandlow-carbonMG-Sisourcing,

whereaswafermanufacturerscanreduceemissionsthroughCFEprocurementandprocessimprovements.Becauseinsomecaseswafermanufacturingisnotverticallyintegrated(i.e,ingotgrowthandwaferslicing/polishingoccuratdifferentcompanies),EACgenerationatthewaferstagewouldlikelysitwithwaferslicingandpolishingproducersandrequireclosecoordinationwiththeirtier1ingotgrowthsupplierstoensure

consistentemissionsdata,reductionactions,andallocationmethods.CreatingEACsateitherstagecouldprovideasystemtorecogni