FiberXon-OSA产品及零件简介.ppt

1、1,OSA產品及零件簡介,Maxim Ma RD Group Component/Fiberxon,2,Content,(1) OSA簡介 (2) 相關元器件介紹 (3) OSA製程注意事項 (4) OSA的分类,3,(1) OSA簡介,OSA 的位置 Transceiver的組成 1. OSA 2. IC 3. PCB 4. 殼件 Transceiver的成本 OSA佔TRx的成本普遍 70%,4,縮略語,TOSA: Transmitting Optical Sub-Assembly, 光发射组件 ROSA: Receiving Optical Sub-Assembly, 光接收组件 BOS

2、A: Bi-Directional Optical Sub-Assembly, 光发射接收组件 LD: Laser Diode, 激光二极管 PD: Photo-Diode, 光电二极管 FP: Fabry-Perot, 法布里-珀罗激光二极管 DFB: Distributed Feedback Laser, 分布反馈式激光二极管 VCSEL: Vertical Cavity Surface Emitting Laser, 垂直腔面发射激光器 PIN: Positive Intrinsic Negative, 同质PN结光电二极管 APD: Avalanche Photo-Diode, 雪崩光

3、电二极管 TIA: Transimpedance Amplifier, 跨阻放大器 TO-can: A kind of package method for active component OLT: Optical Line Termination光线路终端 ONU: Optical Network Unit光网络单元 SDH: Synchronous Digital Hierarchy, 同步数字体系 SONET: Synchronous Optical Network, 光同步网络 GBE: Gigabit Ethernet, 千兆以太网,5,ITU 下行采用广播方式、上行采用时分多址方

4、式，可以灵活地组成树型、星型、总线型等拓扑结构; 在光分支点不需要节点设备，只需要安装一个简单的无源光分路器，光信号在传输过程中不再经过放大和再生，网络的分路由光分路器来实现。,8,1550 DFB,Voice+Data (continuous),ONU,Up stream (burst),Video (analog),PD module,DFB LD module,APD module,DFB LD module,PIN-TIA,LD,Dual-band FWDM,Tri-band FWDM,1x8 Splitter,1x4 Splitter,Tri-band FWDM,BOSA,Up st

5、ream (burst),Video (analog),Voice+Data (continuous),1490 DFB,1310 FP,PON 系統示意圖,OLT,9,10,11,PON 系統元件,MELCO B-PON Product,12,PON Application,13,Media Converter 系統架構(P2P),100Mbps,14,1550nm,1310nm,45 filter,45 filter,Tx,Rx,Tx,Rx,Receptacle BOSA,Pigtail BOSA,Media Converter 系統示意圖,15,光路示意图,16,BOSA基本结构,LD

6、To-Can,Engine Base,Pigtail Holder,Filter,PD To-Can,Filter Holder,Pigtail,17,(2) 相關元器件介紹,18,器件分類,Active Component Passive Component Metal& Plastic Housing,19,Active Component,20,LD TO-can,Chip,Monitor PD,Submount,21,TOSA基本结构,SiOB,Lens cap with 8O facet,Header,Z-Bushing,Receptacle,Isolator,Lens,Window

7、-cap,PD Chip,LD Chip,Fiber Stub,Split Sleeve,PD Submount,PD Chip,LD Chip,LD Submount,Header+SiOB+LD Chip+PD Chip+Cap =To-Can To-Can+Isolator+Z-Bushing+Receptacle =TOSA,To-Can,22,TOSA/ROSA常见问题介绍(To-Can),镀金层划伤、缺损或粘有焊锡等,管脚粘有焊锡或镀金层缺损,镀金层氧化,To-Can封盖开缝,To-Can封盖焊带缺陷,To-Can Cap玻璃开裂,To-Can玻璃封装碎裂或脱落,To-Can玻璃封

8、装碎裂或脱落,23,Caps characteristic,24,TO-56F,TO-56B,25,TO-56C,TO-56A,26,Offset design of TO-can,27,Coupling Characteristics of Offset,28,PIN,应用：Triplexer，PD module,29,PIN-TIA（4pin）,应用：GE ONU BOSA，ROSA,30,PIN-TIA（5pin）,应用：GE PON BOSA，ROSA,31,APD-TIA,应用：GE PON OLT ，GPON ONU，Triplexer，ROSA,32,PIN Chip,PIN:

9、Positive-Intrinsic-Negative,33,Real case for PINs specification,34,APD Chip,APD: Avalanche PhotoDiode,35,Real case for APDs specification,36,Real case for APD in PON application,Result: X direction 50um Y direction 55um Z direction 800um,37,Passive Component,Fiber Filter Lens Isolator Receptacle,38,

10、Fiber,39,Connect type,SC connect LC connect FC/PC connect MU/MUJ connect ST connect,40,Connect type,FC/PC,SC/PC,FC/APC,SC/APC,41,Fiber Inspection,外觀,42,Fiber Inspection,外觀,43,End,較輕微的情況,較為嚴重的情況,44,End,光芯(core)與覆層(cladding)端面破損次嚴重的情況,45,Filter,TR0 Edge filter,46,RTR0 cut-off filer,47,Isolator,48,Isol

11、ator Inspection,49,50,51,Metal& Plastic Housing,Engine Base Filter Holder LD Lens Holder Pigtail Holder,52,(3) OSA製程注意事項,Assembly Laser Welding PD Alignment Testing,53,BOSA关键工艺简介,Filter Assembly 滤波片装配,LD Assembly LD To-Can装配,PD Align PD耦合,Laser Welding 激光点焊,54,Assembly,Filter有正反之分 Filter有入射角的限制 Lens

12、需注意L1的距離 LD TO Pin根部的保護 膠的保存條件及固化顏色,55,Laser Welding,焊点的外观：颜色，位置，大小 焊点的剪切力 Post Weld shift (20%),56,XY laswer welding,Z laswer welding,57,Defective Laser welding,58,Defective Laser welding,激光焊点开裂,激光焊点位置过低,激光焊点位置过高,激光焊点开缝,激光焊点离Z-Bushing太近,穿透焊点过浅,穿透焊点过深,焊点变色,59,PD Alignment,輸入光源是否飽和 不帶電帶光插拔TO PD反偏先開再開Vcc TO腳位的正確,60,Testing,Output Power TE at low and high temp. Spectrum (WL, width and SMSR) Sensitivity Over Load,61,产品测试项目,62,If(mA),P(mW),Ith,逻辑1,逻辑0,输入电脉冲,Ib,Im,Io=I