SMT生产流程与制程简介.ppt

1、2020/7/30,1,SMT Process Introduce,課程的目的與目標 期望能對SMT製程有初步了解與認識 SMT(Surface Mount Technology)的英文縮寫,中文意思就是 表面貼裝技術 。是新一代的組裝技術,他將傳統電子元件 體積壓縮為大約十分之一,大大減少設計面積.,2020/7/30,2,Process Flow Chart,SMT,印刷機,SPI,高速機,泛用機,ICT,入庫,AOI,QC Chart,x-ray,迴焊爐,Visual,2020/7/30,3,Machine Type,收板機 AOI 迴焊爐 泛用機 高速機 SPI 印刷機 送板機,收板機

2、 AOI 迴焊爐 泛用機 高速機 SPI 印刷機 送板機,2020/7/30,4,Solder Printing,Pick & place,Reflow,Turn Over,Bare Board,SMT Process Flow Diagram,2nd Side SMT,2020/7/30,5,SMT Layout Setup,印刷機,錫膏檢測機,高速機,泛用機,2020/7/30,6,SMT Equipment Introduction,Screen Print Solder Paste Maximum Size 510 x 508 mm /(610 x 508mm*) Minimum Si

3、ze 40 x 50 mm Thickness range 0.2 6 mm Underside component clearance 3- 42 mm Alignment: Stencil to Board Repeatability 1.6 Cpk +/- 25m Product Changeover: 2 minutes New Product Setup: 10 minutes Support 2D(Coverage) Inspection,DEK Infinity API,2020/7/30,7,DEK(Screen Print Solder Paste),作業內容：將錫膏印刷於P

4、CB上 工作原理：PCB經過設備定位後,與鋼板接觸,透過鋼板開孔藉由刮刀將錫膏給擠壓自PCB的正確位置,2020/7/30,8,SMT Equipment Introduction,TRI 7006,Solder Printing,Pick& Place,Reflow Soldering,AOI Inspection,ICT Test,X-Ray Inspection,Solder Paste Inspection,Solder Paste Inspection 12.345600 M Points/sec (9,645 fps x 1280 pixel) In-Line 100% Scree

5、ning Scan Speed 160 mm/sec (193 mm/sec max) Gage Repeatability and Reproducibility Resolution 20 um Optical Resolution, 10 100 um Scanning Pitch Warp Coverage Scan Height Range 1.28 mm 32 pixel (16 64 suggested),2020/7/30,9,SPI(Solder Paste Inspection),錫膏膜厚測量儀,工作內容：透過光學檢測判定印刷製程穩定度，預防不良發生 工作原理：利用三角量測

6、原理檢查錫膏厚度，藉由錫膏厚度的量測可算出錫點的體積，面積，同時藉由量測出之高度分布情形的加以分析後，可了解錫點的偏移以及是否橋接,Volume = Solder area * Height,2020/7/30,10,SMT Equipment Introduction,High-speed pick&place machine Maximum cassette mounting capacity: 216component feeds Maximum board size: 510 x460mm Minimum board size: 50 x50mm PC board thickness

7、0.54.0mm X-Y table的精度: 0.075mil NC program step number: maximum 10000 steps/ 1 programs) Maximum number of nozzles: max.32 nozzles Placement tact time 0.06sec/point Reliable placement component from 0201 microchips to 100 x90mm QFP,BGA.,Panasonic CM402-L,Solder Printing,Pick& Place,Reflow Soldering,

8、AOI Inspection,ICT Test,X-Ray Inspection,Solder Paste Inspection,2020/7/30,11,High-speed pick&place machine,Cm402 X, Y Moving axis,Cm402 Nozzle,CM402,備注：對一些較小零件的貼裝，速度較 快 工作內容：將元件置放於PCB正確的位置上 工作原理：透過機器手臂吸取供料器上的元 件,經過視覺辨識後.裝於PCB正確的PAD上,2020/7/30,12,SMT Equipment Introduction,Multi-functional pick&plac

9、e machine Maximum cassette mounting capacity: 56 component feeders Maximum board size: 508 X 457 mm Minimum board size: 51 X 51 mm PC board thickness 0.5 5 mm Placement precision +/- 0.05 mm Placement tact time 0.36 sec/component Reliable placement component from 0201 microchips, QFP, BGA to odd sha

10、ped component X-Y Table精度: +/-9m 3 sigma,Universal Genesis,Solder Printing,Pick& Place,Reflow Soldering,AOI Inspection,ICT Test,X-Ray Inspection,Solder Paste Inspection,2020/7/30,13,Multi-Functional Pick&place Machine,GSM,Feeder料架,備注：進行一些較大零件的貼裝，速度較慢 工作內容：將元件置放於PCB正確的位置上 工作原理：透過機器手臂吸取供料器上的元 件,經過視覺辨識

11、後.裝於PCB正確的PAD上,2020/7/30,14,Reflow Solder System Length：6500mm 10 Zone Heater Panel 2 Zone Cooling Conveyor Speed：25-152cm/min Conveyor Adjustable Width：50-460mm Hot Air N2 Oven For Lead-Free Process Heater Setup Maximum：400oC Small Delta T O2 Analysis & Control 100ppm5000ppm,BTU Pyramax 150,Solder

12、Printing,Pick& Place,Reflow Soldering,AOI Inspection,ICT Test,X-Ray Inspection,Solder Paste Inspection,SMT Equipment Introduction,2020/7/30,15,Reflow,爐溫曲線圖,Reflow過程經四個溫區，每溫區都有其時間溫 度控制，例如：,工作內容：將元件焊接於PCB上 工作原理：透過迴銲爐四個區段高溫將錫膏溶融.經過固狀=液狀=固狀的過程將PCB的PAD與元件結合在一起,2020/7/30,16,SMT Equipment Introduction,Auto

13、matic optical inspection；AOI Field of View:0.7”x0.53” Warp compensation across panel:+/-200mil Number of Camera:1 Top 4 Angle Camera resolution:33m/square pixel Inspection area:50 x75500 x400mm Position resolution 2.4m Board imaging rate:5 square inches/sec PCB Size 50 x70500 x400mm PCB Thickness:0.

14、6mm5mm Reliable 0201 micro chip Lead Free Process Easy Programming,TRI 7100,Solder Printing,Pick& Place,Reflow Soldering,AOI Inspection,ICT Test,X-Ray Inspection,Solder Paste Inspection,2020/7/30,17,AOI(Automatic Optical Inspection),自動光學檢測機,工作內容：透過光學檢測判定良品或不良品 工作原理：透過可程式控的的光源變化經截取影像後區分出良品或是不良品,2020/

15、7/30,18,SMT Equipment Introduction,Inspection BGA ，CSP and Flip-Chip Soldering X-Y Scanning area 610mm x 410mm Maximum sample size:710 x 560 mm Maximum sample weight:5 kg Maximum tube voltage:160kv X-AIP VISO Easy Operator 1D/2D Scanning,MXR-160,Solder Printing,Pick& Place,Reflow Soldering,AOI Inspe

16、ction,ICT Test,X-Ray Inspection,Solder Paste Inspection,2020/7/30,19,SMT Equipment Introduction,In Circuit tester；ICT Short、Open and Power Test Low MDA Entry Price Conduct function test with Advanced PXI Module Architecture Optional Digital Components Test Optional On Board programming and Boundary

17、Scan Test Two Stage Fixtures Available,TRI TR5001,Solder Printing,Pick& Place,Reflow Soldering,AOI Inspection,ICT Test,X-Ray Inspection,Solder Paste Inspection,2020/7/30,20,表面粘著技術是什麼?,輕薄短小的實現 快穩準自動化的實現 標準化大量生產的實現 零件、材料、設備、製程的整合 高可靠度與高品質的表現,2020/7/30,21,The component Comparison,插件元件,表面貼裝的元件,2020/7/30,22,Surface Mount Technology,与传统工艺相比SMA的特点：,Surface Mount Technology,PIN-Through-Hole,SMT,SMT的優缺點,2020/7/3