半导体制造专业英语术语

1、.a1st level packaging第一级封装2ndlevel packaging第二级封装aberration象差 /色差absorption吸收acceleration column加速管acceptor受主accumulatev.积聚 ,堆积acid酸acoustic streaming声学流active region有源区activate激活activated dopant激活杂质active component有源器件adsorption吸附aerosol悬浮颗粒air ionizer空气电离化器alignment mark对准标记alignment对准alloy合金.alte

2、rnateadj.交替的 , 轮流的 , 预备的v.交替 , 轮流, 改变aluminum铝aluminum subtractive process铝刻蚀工艺ambient环境ammonia(nh3)氨气ammonium fluoride(nh4f)氟化氨ammonium hydroxide(nh4oh)氢氧化氨amorphous非晶的，无定型analog模拟信号angstrom埃anion 阴离子anisotropic etch profile各向异性刻蚀剖面anneal退火antimony(sb)锑antirelective coating(arc)抗反射涂层apcvd常压化学气向淀积ap

3、plication specific ic(asic)专用集成电路aqueous solution水溶液area array面阵列argon （ ar ）n. 化 氩.arsenic(as)砷arsine(ash3)砷化氢，砷烷ashing灰化，去胶aspect ratio深宽比，高宽比aspect ratio dependent etching(arde)与刻蚀相关的深宽比asphyxiant窒息剂assay number检定数atmosphericadj.大气的atmospheric pressure大气压atmosphericpressurecvd(apcvd)常压化学气向淀积atomi

4、c force microscopy(afm)原子力显微镜atomic number原子序数attemptn.努力 , 尝试 , 企图 vt.尝试 , 企图auger electron spectroscopy(aes)俄歇电子能谱仪autodoping自掺杂automatic defect classification(adc)缺陷自动分类bback-end of line(beol)（生产线）后端工序backgrind减薄.backing film背膜bafflevt.困惑 , 阻碍 , 为难（挡片）baffleassemblyn.集合 , 装配 , 集会 , 集结 , 汇编（挡片块）ba

5、ll grid array(bga)球栅阵列ballroom layout舞厅式布局，超净间的布局barrel reactor圆桶型反应室barrier metal阻挡层金属barrier voltage势垒电压base基极，基区batch批bay and chase layout生产区和技术夹层区beam blow-up离子束膨胀beam current束流beam deceleration束流减速beam energy离子束能量beol（生产线）后端工序best focus最佳聚焦bga球栅阵列biasing电压拉偏bicmos双极 cmos.bincode number分类代码号bin

6、map分类图bipolar junction transistor(bjt)双极晶体管bipolar technology双极技术（工艺）bird s beak effect 鸟嘴效应blanket deposition均厚淀积blower增压泵boat 舟boe氧化层刻蚀缓冲剂bon voyage法 再见 , 一路顺风 平安 bonding pads压点bonding wire焊线，引线boron(b)硼boron trichloride(bcl3)三氯化硼boron trifluoride(bf3)三氟化硼borophosphosilicate glass(bpsg)硼磷硅玻璃borosi

7、licate glass(bsg)硼硅玻璃bottom antireflective coating(barc)下减反射涂层boule单晶锭bracketn.墙上凸出的托架 ,括弧 , 支架 v.括在一起.breakthrough step突破步骤，起始的干法刻蚀步骤brightfield detection亮场检查brush scrubbing涮洗bubbler带鼓泡槽buffered oxide etch(boe)氧化层腐蚀缓冲液bulk chemical distribution批量化学材料配送bulk gases大批气体bulkhead equipment layout穿壁式设备布局b

8、umped chip凸点式芯片buried layer埋层burn-box燃烧室（或盒）burn-in老化cca化学放大（胶）cantilevern. 建 悬臂cantileverpaddle悬臂桨cap oxide掩蔽氧化层capacitance电容capacitance-voltage test(c-vtest)电容 -电压测试capacitive coupled plasma电容偶合等离子体capacitor电容器.carbon tetrafluoride(cf4)四氟化碳caro s acid 3 号液carrier载流子carrier-depletion region载流子耗尽层ca

9、rrier gas携带气体cassette（承）片架cation阳离子caustic腐蚀性的cavitation超声波能cd关键尺寸cd-sem线宽扫描电镜celsiusadj.摄氏的center of focus(cof)焦点 焦平面center slow中心慢速central processing unit(cpu)中央处理器ceramic substrate陶瓷封装cerdip陶瓷双列直插封装channel沟道channel length沟道长度channeling沟道效应charge carrier载流子.chase技术夹层chelating agent螯合剂chemical ampl

10、ification(ca)化学放大胶chemical etch mechanism化学刻蚀机理chemical mechanical planarization(cmp)化学机械平坦化chemical solution化学溶液chemical vapor deposition(cvd)化学气相淀积chip芯片chip on board(cob)板上芯片chip scale package(csp)芯片尺寸封装circuit geometries电路几何尺寸class number净化级别cleanroom净化间cleanroom protocol净化间操作规程clearfield mask亮场

11、掩膜板cluster tool多腔集成设备cmos互补金属氧化物半导体cmp化学机械平坦化coater/developer track涂胶 /显影轨道cobalt silicide钴硅化合物.coefficientn.数 系数coefficient of thermal expansion(cte)热涨系数coherence probe microscope相干探测显微镜coherent light相干光coil v.盘绕 , 卷cold wall冷壁collector集电极collimated light平行光collimated sputtering准直溅射compensate v. 偿还

12、 , 补偿 , 付报酬compound semiconductor化合物半导体concentration浓度condensation浓缩conductor导体constantlyadv. 不变地 ,经常地 ,坚持不懈地confocal microscope共聚焦显微镜conformal step coverage共型台阶覆盖contact接触（孔）contact alignment接触式对准（光刻）contact angle meter接触角度仪contamination沾污、污染.conti boat连柱舟conticaster 冶 连铸机continuous spray develop连续

13、喷雾显影contour maps包络图、等位图、等值图contrast对比度、反差contributionn. 捐献 , 贡献 , 投稿conventional-line photoresist常规 i 线光刻胶cooks theory库克理论copper cvd铜 cvdcopper interconnect铜互连cost of ownership(coo)业主总成本covalent bond共价键critical dimension关键尺寸cryogenic aerosol cleaning冷凝浮质清洗cryogenic pump(cryopump)冷凝泵crystal晶体crystal

14、activation晶体激活crystal defect晶体缺陷crystal growth晶体生长crystal lattice晶格crystal orientation晶向.cte热涨系数current-drivencurrentamplifier电流驱动电流放大器cvd化学气相淀积cycle time周期cz crystal pullercz 拉单晶设备czochralski(cz) method切克劳斯基法ddamascene大马士革工艺darkfiled detection暗场检测darkfiled mask暗场掩膜版dc bias直流偏压decompose v.分解 , (使 )腐

15、烂deep uv(duv)深紫外光defaultn. 默认 (值), 缺省 (值 ),食言 ,不履行责任 , 律 缺席 v. 疏怠职责 , 缺席 ,拖欠 ,默认defects density缺陷密度defect缺陷deglaze漂氧化层degree of planarity(dp)平整度dehydration bake去湿烘培，脱水烘培.density密度deplention mode耗尽型degree of focus焦深depositn.堆积物 ,沉淀物 , 存款 , 押金 , 保证金 , 存放物vt.存放 , 堆积vi. 沉淀deposition淀积deposited oxide lay

16、er淀积氧化层depth of focus焦深descum扫底膜design for test(dft)可测试设计desorption解吸附作用develop inspect显影检查development显影developer显影液deviationn.背离device isolation器件隔离device technology器件工艺di water去离子水diametern.直径diameter grinding磨边diborane（b2h6 ）乙硼烷.dichlorosilane(h2sicl2)二氯甲硅烷die 芯片die array芯片阵列die attach粘片die-by-di

17、e alignment逐个芯片对准dielectric介质dielectric constant介电常数die matrix芯片阵列die separation分片diffraction衍射diffraction-limited optics限制衍射镜片diffusion扩散diffusion controlled受控扩散digital/analog数字 /模拟digital circuitdiluentdirect chip attach( dca)directionalitydiscretedishingdislocationdissolution rate.dissolution rat

18、e monitor(drm)溶解率监测dnq-novolak重氮柰醌酚醛树脂donor施主dopant profile掺杂刨面）doped region掺杂区doping掺杂dose monitor剂量检测仪dose,q剂量downstream reactor顺流法反应drain漏drive-in推进dry etch干法刻蚀dry mechanical pump干式机械泵dry oxidation干法氧化dummyn.哑巴 ,傀儡 ,假人 , 假货adj.虚拟的 ,假的 , 虚构的n. 计 哑元dynamicadj. 动力的 , 动力学的 ,动态的eeconomies of scale规模经济

19、edge bead removal边缘去胶edge die边缘芯片.edge exclusion无效边缘区域electrically erasable prom电可擦除 epromelectrode电极electromigration电迁徙electron beam lithography电子束光刻electron cyclotron resonance电子共振回旋加速器electron shower电子簇射，电子喷淋electron stopping电子阻止electronic wafer map硅片上电性能分布图electroplating电镀electropolishing电解抛光ele

20、ctrostatic chuck静电吸盘electrostatic discharge(esd)静电放电ellipsometry椭圆偏振仪，椭偏仪emitter发射极endpoint detection终点检测engineering n. 工程 (学)electrostatic discharge(edx)能量弥散谱仪enhancement mode增强型epi外延epitaxial layer外延层.epoxy underfill环氧树脂填充不足erasable prom可擦除可编程只读存储器erosion腐蚀，浸蚀establishvt.建立 ,设立 , 安置 , 使定居 , 使人民接受

21、,确定v.建立etch刻蚀etch bias刻蚀涨缩量etch profile刻蚀刨面etch rate刻蚀速率etch residue刻蚀残渣etch uniformity刻蚀均匀性etchant刻蚀剂etchback planarization返刻平坦化eutectic attach共晶焊接eutectic temperature共晶温度evaporation蒸发even adj. 平的 , 平滑的 ,偶数的 , 一致的 , 平静的 ,恰好的 ,平均的 , 连贯的adv.加强语气 甚至 (.也 ),连. 都 , 即使 ,恰好 ,正当vt.使平坦 , 使相等vi.变平 , 相等n.偶数 ,

22、偶校验exceedvt.超越 , 胜过vi.超过其他.excimer laser准分之激光exposal n. 曝光 , 显露exposure曝光exposure dose曝光量extraction electrode吸极extreme uv极紫外线extrinsic silicon掺杂硅ffables 无制造厂公司fabrication制造facilities设施factor n.因素 ,要素 ,因数 , 代理人fast ramp furnaces快速升降温炉fault model失效模式fcc diamond面心立方金刚石feature size特征尺寸feol 前工序fick s law

23、s fick定律field-effect transistor场效应晶体管field oxide场氧化field-by-field alignment逐场对准.field-programmable prom现场可编程只读存储器film 膜film stress膜应力final assembly and packaging最终装配和封装final test 终测first interlayer dielectric(ild-1)第一层层间介质fixed oxide charge固定氧化物电荷flats 定位边flip chip倒装芯片float zone区熔法fluorosilicate gla

24、ss(fsg)氟化玻璃focal length焦距focal plane焦平面focal point焦点focus 聚焦focus ion beam(fib)聚焦离子束footprint占地面积formulan. 公式 , 规则 ,客套语forward bias正偏压four-point probe四探针frenkel defectfrenkel 缺陷.front-opening unified pod(foup) 前开口盒 functional test 功能测试furnace flat zone恒温区gg-lineg 线gallium(ga)镓gallium arsenide(gaas)砷

25、化镓gap fill间隙填充gas 气体gas cabinet气柜gas manifold气瓶集装gas phase nucleation气相成核gas purge气体冲洗gas throughput气体产量gate栅gate oxide栅氧化硅gate oxide integrity栅氧完整性germanium(ge)锗getter俘获glass玻璃glazing光滑表面.global alignment全局对准global planarization全局平坦化glow discharge起辉放电gray area灰区，技术夹层gross defect 层错grove n.小树林grown

26、oxide layer热氧化生长氧化层hhalogen卤素hardbake坚膜hardwaren.五金器具 ,(电脑的 ) 硬件 , (电子仪器的 )部件hepa filter高效过滤器hermeticsealing密封heteroepitaxy 异质外延heterogeneous reaction异质反应hexamethyldisilazane(hmds) 六甲基二硅氨烷high-density plasma(hdpcvd)高密度等离子体化学气相淀积high-density plasma etch高密度等离子刻蚀high-pressure oxidation高压氧化.high-tempera

27、ture diffusion furnace高温扩散炉high vacuum高真空high vacuum pumps高真空泵hillock小丘（铝）尖刺homoepitaxy同质外延homogeneous reaction同质反应horizontaladj. 地平线的 , 水平的horizontal furnace卧式炉hot electron热电子hot wall热壁hydrochloric acid(hcl)盐酸hydrofluoric acid(hf)氢氟酸hydrogen(h2) 氢气hydrogen chloride(hcl)氯化氢hydrogen peroxide(h2o2)双氧水

28、hydeophilic亲水性hydrophobic憎水性，疏水性hyperfiltration超过滤ii-linei 线ic packaging集成电路封装.ic reliability集成电路可靠性iddq testing静态漏电流测试image resolution图象清晰度图象分解力implantv.灌输（注入）impurity杂质incrementn.增加 , 增量initialadj.最初的 , 词首的 ,初始的n.词首大写字母in situ measurements在线测量index of refraction折射率indium铟inductively coupled plasma

29、(icp)电感耦合等离子体inert gas惰性气体infrared interference红外干涉ingot 锭ink mark墨水标识in-line parametric test在线参数测试input/output(i/o)pin输入 / 输出管脚instituten.学会 , 学院 , 协会vt. 创立 , 开始 , 制定 , 开始 (调查 ), 提起 (诉讼 )insulator绝缘体.integratevt.使成整体 ,使一体化 , 求 .的积分 v.结合integrated circuit(ic)集成电路integrated measurement tool集成电路测量仪int

30、ervaln.间隔 , 距离 , 幕间休息 n.时间间隔interconnect互连interconnect delay互连连线延迟interface-trapped charge界面陷阱电荷interferometer干涉仪interlayer dielectric(ild)层间介质interstitial间隙（原子）intrinsic silicon本征硅invokev.调用ion 离子ion analyzer离子分析仪ion beam milling or ion beam etching(ibe)离子铣或离子束刻蚀ion implantation离子注入ion implantation

31、 damage离子注入损伤ion implantation doping离子注入掺杂ion implanter离子注入机ion projection lithography(ipl)离子投影机.ionization离子化ionized metal plasma pvd离子化金属等离子 pvdipa vapor dry异丙醇气相干燥isolation regions隔离区isotropic etch profile 各向同性刻蚀刨面jjeft结型场效应管junction(pn) pn结junction depth结深junction spiking结尖刺kkelvin绝对温度killer def

32、ect致命缺陷kinetically controlled reaction功能控制效应llaminar air flow层状空气流，层流式lapping抛光latchup闩锁效应lateral diffusion横向扩散law of reflection反射定律ldd 轻掺杂漏leadframe引线框架.leakage cuttent漏电流len 透镜lens compaction透镜收缩light 光light intensity光强light scattering光散射lightly doped drain(ldd)轻掺杂漏linear线性linear accelerator线性加速器l

33、inear stage线宽阶段，线性区linewidth线宽liquid液体lithography光刻loaded brush沾污的毛刷loaded effect负载效应loadlock真空锁local interconnect(li)局部互连local planarization局部平坦化local oxidation of silicon(locos) 硅局部氧化隔离法 logic 逻辑lot批.low-pressure chemical vapor deposition (lpcvd) 低压化学气相淀积lsi大规模集成电路mmagnetic cz （mcz ）磁性切克劳斯基晶体生长法ma

34、gneticallyenhancedrie(merie) 磁增强反应离子刻蚀magnetron sputtering磁控溅射magnificationn.扩大 , 放大倍率magnificentadj. 华丽的 , 高尚的 , 宏伟的majority carrier多子make-up loop补偿循环mask 掩膜版n. 面具 ,掩饰 ,石膏面像vt. 戴面具 ,掩饰 , 使模糊vi. 化装 , 戴面具 , 掩饰 , 参加化装舞会mask-programmable gate array掩膜可编程门阵列mass flow controller(mfc)质量流量计mass spectrometer

35、质谱仪mass-transport limited reaction质量传输限制效应mathematicaladj. 数学的 , 精确的mean free path(mfp)平均自由程medium vacuum 中真空.megasonic cleaning超声清洗melt 熔融membrane contactor薄膜接触器，隔膜接触器membrane filter薄膜过滤器，隔膜过滤器merchantn.商人 , 批发商 , 贸易商 , 店主adj.商业的 , 商人的mercury arc lamp汞灯mesfet 用在砷化镓结型场效应晶体管中的金属栅metal contact金属接触孔met

36、al impurities金属杂质metal stack复合金属，金属堆叠metallization金属化metalorganic cvd金属有机化学气相淀积metrology度量衡学microchip微芯片microdefect微缺陷microlithography微光刻microloading微负载，与刻蚀相关的深宽比micron微米microprocessorn.计 微处理器microprocessor unit微处理器.microroughness微粗糙度miller indices密勒指数minienvironment微环境minimum geometry最小尺寸minority c

37、arrier少子mix and match混合与匹配mobile ionic contaminants(mic)可动离子沾污mobile oxide charge可动氧化层电荷module n. 模数 , 模块 , 登月舱 , 指令舱modifyvt.更改 , 修改v.修改molecular beam epitaxy (mbe)分子束外延molecular flow分子流monitor wafer(test wafer)陪片，测试片，样片monocrystal单晶monolithic device单片器件moores law摩尔定律mos金属氧化物半导体mosfet金属氧化物半导体场效应管mo

38、tor curreant endpoint电机电流终点检测（法）msi中规模集成电路multipliern. 增加者 , 繁殖者 , 乘数 , 增效器 , 乘法器.multichip module(mcm)多芯片模式multilenel metallization多重金属化murphys model墨菲模型nnanometer(nm)纳米native oxide自然氧化层n-channel mosfetn 沟道 mosfetnegatine resist负性光刻胶negativen.否定 ,负数 ,底片 adj.否定的 , 消极的 ,负的 , 阴性的vt.否定 , 拒绝 (接受 )negati

39、ne resist development负性光刻胶显影neutral beam trap中性束陷阱next-generation lithography下一代光刻技术nitric acid(hno3)硝酸nitrogen(n2)氮气nitrogen trifluoride(nf3)三氟化氮nitrous oxide (n2o)一氧化二氮、笑气nmosn 沟道 mos 场效应晶体管noncritical layer非关键层nonvolatile memory非挥发性存储器normality归一化.notch定位槽novolak苯酚甲醛聚树脂材料npn npn 型（三极管）n-type sili

40、conn 型硅nuclear stopping离子终止nucleation成核现象，晶核形成nuclei coalescence核合并numerical aperture(na)数值孔径n-welln 阱oobjective（显微镜的）物镜off-axis illumination(oai)偏轴式曝光，离轴式曝光ohmic contact欧姆接触op amp运算放大器optical interferometry endpoint光学干涉法终点检测optical lithography光学光刻optical microscope(light microscope)光学显微镜optical pro

41、ximity correction(opc)光学临近修正optical pyrometer光学高温计optics光学organic compound有机化合物.out-diffusion反扩散outgassing除气作用overdrive过压力overetch step过刻蚀overflow rinser溢流清洗overlay accuracy套准精度overlay budget套准偏差overlay registration套刻对准oxidation氧化oxidation-induced stacking faults(oisf)氧化诱生层积缺陷，氧化诱生堆垛层错oxide 氧化物、氧化层、氧化膜oxidezer氧化剂oxide-trapped charge氧化层陷阱电荷ozone(o3)臭氧ppackage封装管壳pad conditioning垫修整pad oxide垫氧化膜paddle 悬臂n.短桨 , 划桨 , 明轮翼vi. 划桨 , 戏水, 涉水vt.用桨划 , 搅, 拌.parabolic stage抛物线阶段parallel-plate(planar)reactor平板反应parallel testing并行测试parameter参数parametric test参数测试parasi