电子制造业术语

GRR Gauge Repeatability Reproducibility 量测的再现性与再生性FPI First Piece Inspection 首件检查Sampling without replacement 不放回抽样SQA: Source(Supplier) Quality Audit 供货商品质审核1. QC : quality control 质量管理2. IQC : incoming quality control 进料质量管理 3. OQC : output quality control 出货质量管理4. PQC : process quality control 制程质量管理也称IPQC : in process quality control .5. AQL : acceptable quality level 允收标准 6. CQA: customer quality assurance 客户品质保证7. MA : major defeat 主要缺点8. MI : minor defeat 次要缺点9. CR :critical defeat 关键缺点10. SMT : surface mounting technology 表面粘贴技术11. SMD :surface mounting device 表面粘贴程序 SMC : surface mounting component 表面粘贴组件12.ECN : engineering change notice 工程变更通知 13.DCN : design change notice 设计变更通知14.PCB : printed circuit board 印刷电路板15.PCBA : printed circuit board assembly 装配印刷电路板16. BOM : bill of material 材料清单 17. BIOS : basically input and output system 基本输入输出系统18. MIL-STD-105E : 美国陆军标准,也称单次抽样计划.19. ISO : international standard organization 国际标准化组织20. DRAM: 内存条21. Polarity : 电性22. Icicles : 锡尖23. Non-wetting : 空焊24. Short circuit : 短路25. Missing component : 缺件 26. Wrong component :错件27 . Excess component :多件 28. Insufficient solder : 锡少29 . Excessive solder :锡多30. Solder residue: 锡渣31. Solder ball : 锡球32. Tombstone : 墓碑33 . Sideward：侧立 34. Component damage :零件破损35. Gold finger:金手指36. SOP : standard operation process 标准操作流程 37. SIP : standard inspection process 标准检验流程38 .The good and not good segregation :良品和不良品区分39. OBW : on board writer 熸录 BIOS40 . Simple random sampling : 简单随机抽样41. Histogram : 直方图42 . Standard deviation : 标准差43. CIP : Continuous improvement program 持续改善计划 44. SPC : Statistical process control 制程统制45 . Sub-contractors : 分包商 46. SQE: Supplier quality engineering47. Sampling sample :抽样计划 48. Loader : 治具49. QTS: Quality tracking system 质量追查系统50. Debug : 调试51. Spare parts: 备用品 52. Inventory report for : 库存表 53. Manpower/Tact estimation 工时预算 54. Calibration : 校验55. S/N :serial number 序号56. Corrugated pad : 波纹垫57.Takeout tray: 内包装盒 58. Outer box : 外包装箱59. Vericode : 检验码 60. Sum of square : 平方和61. Range : 全距62. Conductive bag : 保护袋63. Preventive maintenance :预防性维护 64. Base unit : 基体65. Fixture : 制具 66. Probe : 探针67. Host probe : 主探针 68. Golden card : 样本卡69. Diagnostics program : 诊断程序 70. Frame : 屏面71. Lint-free gloves : 静电手套 72 .Wrist wrap : 静电手环73. Target value : 目标值 74. Related department : 相关部门75. lifted solder 浮焊 76.plug hole 孔塞77. Wrong direction 极性反 78.component damage or broken 零件破损79.Unmeleted solder 熔锡不良 80.flux residue 松香未拭81.wrong label or upside down label 贴反 82. mixed parts 机种混装83. poor solder mask 绿漆不良 84. oxidize 零件氧化85.stand off height 浮高 86. IC reverse IC 反向87.supervisor 课长 88. Forman 组长89. WI=work instruction 作业指导 90. B.P. 非擦除状态91. Internal notification: 内部联络单92. QP :Quality policy 质量政策93. QT: Quality target 品质目标 94. Trend:推移图95.Paret 柏拉图 96. UCL: Upper control limit 管制上限97.LCL:Lower control limit 管制下限 98. CL: Center line 中心线99.R.T. Rolled throughout yield 直通率100. PPM: Parts per million 不良率101.DPU: Defects per unit 单位不良率102.Resistor: 电阻 103.Capacitor:电容 104. Resistor array : 排阻105. Capacitor array: 排容 106. DIODE: 二极管 107.SOT: 三极管 108. Crystal:震荡器109.Fuse:保险丝 110.Bead: 电感111.Connector:联结器112.ADM: Administration Department 行政单位113. CE: Component Engineering 零件工程 114. CSD :Customer Service Department 客户服务部115. ID: Industrial Design 工业设计 116.IE: Industrial Engineering 工业工程117. IR: Industrial Relationship 工业关系118. ME: Mechanical Engineering 机构工程119. MIS :Management Information System 信息部 120. MM: Material Management 资材 121. PCC: Project Coordination/Control 专案协调控制 122. PD: Production Department 生产部123. PE: Product Engineering 产品工程 124. PM: Product Manager 产品经理125. PMC: Production Material Control 生产物料管理 126. PSC: Project Support 辅助存储器 161.Silicon chip:硅片162Diskette drive:软驱163.Display screen/Monitor:显示器 164.Foreground:前面 165.Montherboard:母板 166.Mermory board: 内存板167.Slot:插槽 168.Busata-bus/address-bus/Control bus: 总线/数据总线/ 地址总线/控制总线169.Plotter:绘图170.MPC:Multimedia personal computer 多媒体171.Oscillator:振荡器 172.Automatic teller terminal:自动终端 (出纳)机173.Joystick port:控制端口174.VGA: Video Graphics Array 显示卡175.Resolution:分辨率 176.Register:寄存器 177.ISA: Industry Standard Architecture 工业标准结构178.EISA: Extended Industry Architecture 扩展工业标准结构179.Adapter: 适配器 180.Peripheral:外部设备 181.Faxmodem:调制解调器 181.NIC:Network interface card 网络接口卡182. SCSI: Small computer system interface 183.VESA: Video Electronic Standards Association184. SIMM: Single in-line memory module 单排座存储器模块(内存条) 185.Casing:外箱 186.Aluminum:铝质 187.Ceramic: 陶瓷的 188.Platter:圆盘片 189.Actuator:调节器 190.Spindle:轴心 191.Actuation arm: 存取臂192.Default code: 缺省代码 193.Auxiliary port:辅助端口194.Carriage return : 回车 195.Linefeed:换行 196.ASCII: American Standard Code for Information Interchange 美国信息互换标准代码197.Video analog: 视频模拟 198.TTL: Transistor- Transistor logic 晶体管- 晶体管逻辑电路199.Three-prong plug:三芯电插头200.Female connector:连接插座201.Floppy disk:软盘202.Output level: 输出电平203.Vertical/Horizontal synchronization: 场/行同步 204.H(Horizontal)-Phase:行相位205.Compatible:兼容机 206.Hardware Expansion Card: 硬件扩充卡207.Buffer:缓冲 208.CRM:Customer relationship Management 客户关系管理 209.WIP: Work in process 半成品 210.Waiver:特别采用 211.CXO 系列CEO: Chief Executive Office 首席执政官；执行总裁COO: Chief Operating OfficeCFO: Chief Finance Officer CBO: Chief Business OfficerCTO: Chief Technology Officer CIO: Chief Information OfficerCGO: Chief Government Officer 212. NASDAQ: 纳斯达克证券市场NASDAQ Automated Quotation system 213.VC: Venture Capital 风险投资 214. PDA: Personal Date Assistant 个人数字助理PLA: Personal Information Assistant 个人信息助理215. PPAP: Advanced Product Quality Planning and Control Plan 生产性零组件核准程序216. FMEA: Potential Failure Mode and Effects Analysis 失效模式与效应分析217. MSA: Measurement Systems Analysis 量测系统分析218. QAS: Quality System Assessment 质量系统评鉴219. Cusum: 累计总合图220. Overall Equipment Effectiveness 设备移动率221. Benchmarking: 竞争标杆Analysis of motion/Ergonomics 动作分析/人体工程学222. Roka Yoke 防错法 MCR: machine capability ratio 机器利用率 223. Mistake Proofing 防呆法 Taguchi methods 田口式方法224, Vertical integration 垂直整合Surveillance 定期追踪审查225. EMS: Electronics Manufacturing Supply-chain226. Cause & Effects charts 特性要因图227. Scatter: 散布图 Fool-Proof System 防呆系统 228. VE: Value Engineering 价值工程 QFD: Quality Function Development 质量机能展开229. Arrow Chart 箭头图法Affiliate Chart 亲和图法230. PDPC: Process Decision Program ChartSystem Chart 系统图法231. Relation Chart 关边图法Matrix Chart 矩阵图法232. Matrix Data Analysis 矩阵数据分析法234. Brain-storm 脑风暴法JIT: Just In Time:及时性生产模拟235. Deming Prize: 戴明奖Prototype 技术试作236. BPM: Business Process Management 业务流程管MBO 目标管理 237. MBP:方针管理FTA:故障树分析 QSC 服务质量238. IPPB: Information 情况planning 策划Programming 规划 Budget 预算239. EQ: Emotion Quotient:情商 IQ: Intelligence Quotient:智商240. Implied Needs:隐含要求 Specified Requirement:规定要求241. Probation:观察期Incoming Product released for urgent production 紧急放行242.Advanced quality planning 先进的质量策划 243. AOQ: Average Outgoing Quality 平均检出质量 AOQL: Average Outgoing Quality Limit 平均检出质量界限244.Approved Supplier List 经核准认可的供应商名单245.Attribute date 特征Benchmarking 基准点 Calibration 校准246.Capable process 工序能力 Capability Index 工序能力指数Capability ratio 工序能力率247.CHANGE CYCLE TIME 修改的时间周期Continuous improvement 持续改进248. Control plans 控制策划 Cost of quality 质量成本249. Cycle time reduction 减少周期时间250. Design of experiments 实验设计 Deviation / Substitution 偏差 / 置换251. ESD: Electrostatic discharge 静电释放252. EH&S: Environmental, Health, and Safely 环境,健康.安全253. ESS: Environmental Stress Screening 环境应力筛选254. FMEA: Failure Mode Effect Analysis 失误模式效应分析255. First Article approval 产品的首次论证 256. First pass yield 一次性通过的成品率257. First sample inspection 第一次样品检验258. FMECA: Failure mode effect and critically analysis 失误模式 ,效应及后果分析259. Gauge control 测量仪器控制 260. GR&R: Gauge repeatability and reproducibility 测量仪器重复性和再现性261. HALT: Highly Accelerated Life Test 高加速寿命试验262. HAST: Highly Accelerated Stress Test 高加速应力试验263. IN-CONTROL PROCESS 受控制工序 264. INDUSTRIAL AVERAGE 工业平均数265. JIT (just in time) manufacturing (实时) 制程266. Key characteristic 关健特征 267. Key component 关健构件 268. Life Testing 寿命试验269. Lot traceability 批量可追溯性270. Material review board 原材料审查部门 MCR: machine capability ratio 机械能力率271. NONCONFORMANCE 不符合272. OUT-OF-CONTROL PROCESS 失控工序273. Pilot Application 试产(试用) 274. PPM: Parts per million 百万分之一275. Preventive VS detection 预防与探测 Preventive maintenance 预防维护276. Process capability index 工序能力指数277. Process control 工序控制 278. Process improvement 工序改进279. Process