[信息与通信]ATCA introduce for internal.ppt

ATCA Product Introduction Internal proposal 2004-10-29 NETWORK ELEMENT Agenda Introduction to ATCA UTS ATCA Product Overview ATCA Platform Application Introduction to ATCA What does ATCA deliver? Scalable capacity to 2.5Tbps Multi-protocol support for interfaces up to 40Gb/s High levels of modularity and configurability The ability to host large pools of NPUs, processors, and storage Convergence of telecom access, core, optical, and datacenter functions Advanced software infrastructure providing APIs and OAM&P World-class element cost and operational expense A healthy, dynamic, multi-vendor, interoperable “eco-system” Why dont existing standards meet these needs Board areas are too small for emerging applications Board spacing is too narrow Heat dissipation is inadequate for next generation semiconductors Back-plane capacity is limited Signal integrity and electromagnetic compatibility are becoming problems Mechanical standards dont support I/O requirements Power distribution systems need modernization Hardware management is often inadequate Existing platforms are often optimized for a limited set of applications, where convergence requires more universal platforms Poor scaling of capacity, performance, and reliability Cost is too high Compare between CPCI and ATCA AdvancedTCA* Emphasizes I/O Scalability Independent of host processor capacity Back-plane capacity with todays Gig Ethernet Star technology allows (19” rack with 12 nodes): 48 Gbps with dual star (bi directional) 1Tbps with full mesh Carrier grade reliability 5-10 year architectural design life Broad solution availability Competitive supply base Reduced time-to-market Overview of PICMG* and AdvancedTCA* PICMG*: PCI Industrial Computer Manufacturers Group Specifications body (700+ members) AdvancedTCA* is the name for PICMG 3.x standards and programs around it PICMG 3.0 Specification was ratified in 2002 PICMG 3.1 ratified in 2003 PICMG 3.2 ratified in 2003 PICMG 3.3 ratified in 2003 PICMG 3.4 ratified in 2003 PICMG 3.5 in development Potential to be 10x as prevalent as CompactPCI standards AdvancedTCA and Fabrics PICMG 3.0 SpecificationPICMG 3.0 Specification Power DistributionPower Distribution Mechanical ElementsMechanical Elements System ManagementSystem Management Regulatory GuidelinesRegulatory Guidelines Connector Zones and typeConnector Zones and type Fabric TopologyFabric Topology Thermal Management GuidelinesThermal Management Guidelines PICMG 3.1PICMG 3.1 SpecificationSpecification Ethernet &Ethernet & Fibre Fibre ChannelChannel PICMG 3.2PICMG 3.2 SpecificationSpecification InfiniBand*InfiniBand* PICMG 3.3PICMG 3.3 SpecificationSpecification StarFabric*StarFabric* PICMG 3.4PICMG 3.4 SpecificationSpecification PCI-Express* PCI-Express* & Advanced & Advanced SwitchingSwitching PICMG 3.5PICMG 3.5 SpecificationSpecification Advanced Advanced Fabric Fabric Interconnect Interconnect / S-RapidIO*/ S-RapidIO* Backplanes are fully defined in the PICMG 3.0 specification Interoperable Boards are defined in Subsidiary specifications AdvancedTCA* Specification Snap shot Form Factor and Connectors 8U x 280mm blade ZD connectors for Fabric Positronic* connectors for power Power -48 V DC to each blade Fabrics 1000BASE-T base interconnect (Star) Separate fabric interconnect (Mesh) Management Dual IPMI/IPMB connections to each node ZD connectors (6.25 Gbps) Positronic connector ATCA* Blade Form Factor Rear Access Door 280 mm25 mm5 mm5 mm Front Board (8U x 280 mm) (140 in2, 903 cm2) 1.2” (3cm) pitch 322.25 mm Zone 2: Keying/alignment Synch. Clocks Update Channels Fabric Interface Base Interface 280mm depth allows rear transition module Up to 4 standard PMCs 385 mm faceplate-to-faceplate 90mm Optical Cabling/ Air Plenum 75mm Metallic Cabling/ Air Plenum Front Access Door 90 mm75 mm25 mm25 mm 600 mm Cabinet 70 mm Zone 3 Rear panel IO Interconnect Zone 2Z1 Rear Transition Module (8U x 70 mm x 1.2”) (35 in2 , 226 cm2) Zone 1: Power Management Mechanical-Board Front Board 8U x 280 mm RTM 8U x 105mm Board width 6HP(1.2”) PCB thickness 2.4mm Provisions for 4 AMC(ATCA Mezzanine Card) Alignment/Key Pin UTS ATCA product overview Chassis Back-plane Power Distribution Chassis Management Switch Card Single Board Computer Line Card Chassis Chassis: Overview Switch Slot(logic1&2) Node1-6 Node7-12 Filter Tray Fan Tray PEM1&2 SHMC 1&2 Chassis: introduction There are five fixed boards inside the chassis Main Back-plane Zone3 Back-plane Data Riser Board Power Riser Board Distribution Board(CMM Back-plane) There are three other boards located on FRU Fan Tray Controller PEM(Power Entry Module) Filter and Monitor Board CDM(Chassis Data Module) Chassis: cooling system N+1 fan redundancy Inlet and outlet temperature sensor Back-Plane Back-plane: Overview Zone 2 Zone 1 Filter Tray Connector PEM Connector Power Riser Connector Power Riser Connector Back-plane: introduction Zone1 (PICMG3.0 compatible) - IPMB0 and IPMB1(Bus and Star) - -48V DC Power - Ring/Test Lines Zone2 (PICMG3.0 compatible) - Base Interface, Dual Star, with the center two switch slots - Fabric Interface, Dual Star, with the center four switch slots - Update Channels, supporting single-slot and double-slot board - Timing Clock Other Connector - Chassis Riser Board Data Connector - Chassis Riser Board Power Connector - Power Entry Module Connectors - Filter Tray Connector Power Distribution Power Distribution Redundant power inputs Power connector with sequenced pins the architecture allows the system survive the following types of power feed failures without any loss in functionality: the loss of any power feed: 1A, 1B, 2A or 2B 1.The loss of PEM1 2.The loss of PEM2 3.The loss of feed A 4.The loss of feed B 5.Power requirements 6.-48/-60 VDC power input 7.Redundant power input 8.Capacity of over 3000 watts per chassis 9.Local power conversion, DC-DC power converter on each board PEM2PEM1 2B -48V B-48V A 2A1B1A Main Back-Plane (14 slots) Slot 1 Slot 2 Slot 14 Zone 1 Power Connector Chassis Management Chassis Management: introduce Monitor &control low-level aspects of ATCA boards and other field replaceable units (FRUs) within a shelf Watch over basic health of the shelf, report anomalies, take corrective action when needed Retrieve inventory information & sensor readings Receive event reports and failure notifications from boards and other intelligent FRUs Manage power, cooling and interconnect resource in the shelf Chassis Management: Hardware feature 800MHz PQIII processor 5-pair of Peer-to-Peer control pins(NGO,HLY,PRES,RST,PWR) Up to 20x2 connections of I2C to FRU, Full dual-star Y style Dual Peer-to-Peer I2C, for HA state synchronization Peer-to-Peer GE port as independent sync-path for Application One GE to rear IO as inter-chassis sync-path or OAM path Dual 10/100/1000M Ethernet to Switch card One FE option to front panel or rear IO as maintenance port Legacy HSC compliance pins Optional fast message signal pins Chassis Management: architecture introduce Chassis Management: architecture introduce STANDBY shMng ACTIVE shMng Hardware Drivers/HA library HA manager/Middleware Hardware Switch 2xGE2xGE Peer-to-Peer I2C Bus Peer-to-Peer GE Application 1xGE 1xFE Logic Sync Path 20 x Dual Y style IPMB architecture Drivers/HA library HA manager/Middleware Application HA control pins Node1 Node2 Node3 Node4 Node5 Node6 Logic slot 1 Logic slot 2 Node7 Node8 Node9 Node10 Node11 Node12 PEM1PEM2 Fan Tray CDM 1&2 Reserved 1xGE 1xFE Switch Card Switch Card: CA team develop it Node 8 Node 7 SHMC Standby SHMC Active Node 9 Node 10 Node 11 Node 12 Node 1 Node 2 Node 3 Node 4 Node 5 Node 6 GE 10G GE 10G Switch Card: OEM version Line Card Line Card Shelf Mngr Standby Shelf Mngr Active Line Card Line Card Line Card Line Card Line Card Line Card Line Card Line Card Line Card Line Card GE 10G GE GE (2 x) 14 x 1G base switch + (2 x) 1 GE uplink for control/management path (2 x) 12 x 1G base switch Dedicated for Data path SBC SBC SBC solutions X86 Architecture(AP3000 series) PPC Architecture(AP8000 series) recommend x86 and PPC is used on high performance server application or general protocol processing application MIPS Architecture (AP9000 series) recommend MIPS is used on high performance gateway application or specific application engine(firewall,VPN) SBC X86: Dual xeon + e7501 Intel MPCBL0001 2.0GHz Xeon, Up to 4G memory, Power consumption: 110W158W Target for Transaction sever, Call server, SG Dual Xeon + E7501 chipset GE MAC FCC DDR memory MUX Back plane 2xGE to Base2xFibre Channel to Fabic 2xFibre Channel to panel HDD PCIX BUS Front Panel SBC X86: Dual nocona + e7520 As proposal 3.2GHz nocona, Up to 32G memory, 90nm Power consumption: 110W158W Target for Transaction sever, Call server, SG Dual nocona + E7520 chipset GE MAC DDR2 memory MUX 2xGE to Base2 x GE/Hig to Fabic Back plane 2x GE/Hig to panel HDD PCI express GE MAC Front Panel SBC Dothan + E7520 system 2xGE to Base 2 x GE or 1xHig to Fabic Back plane 1x Hig to panel as optionFront Panel Dothan + E7520 system Dothan + E7520 system Dothan + E7520 system VLAN AVLAN B 12 GE + 1Hig Switch(5691) X86: 4 x (Dothan + e7520) As proposal 2.0GHz Dothan, Up to 4x1G memory, 90nm Power consumption: 140W185W On board GE switch, VLAN partition for separate the management and data path Test prove that Dothan has better real-time performance than Xeon/Nocona Target for Call server, SG, RNC, MSC X86: Other solutions(Just for reference) INTEL: Dual sossaman(4 core) + e7520, for server solution (20052006) INTEL: itamium2(2 core) + e8870, for server solution INTEL: Dual thick Blade for 2 x itamium2, for server solution AMD: Dual Optron (4 core) , for server solution Transmeta: 8 x TM8820(1.8GHz) , for Call server, SG, RNC, MSC SBC News LinuxAID.站点最新信息：Sun公司近日宣布，将从明年开始销售新系列的大片服务器。引人注目 的是，这些服务器都将使用AMD公司的Opteron芯片以及Linux操作系统,新的刀片系统将在明年的上半年 问世，遵循AdvancedTCA电信设备规范。 (2004-09-20) NEC从7月8日开始上市配备安腾2处理器的新款服务器系列-“NX7700i系列”。为NX7700的后续产品，原 机型运行的OS仅为UNIX，新款产品新增了Window和Linux。与NX7700系列一样，CPU和内存均配备于 名为“Cell Card”的板卡上，可在每块Cell Card板卡上构筑不同的运行环境。最多可配备4个CPU的 “NX7700i/3010L-4”（从346万日元起价，约合人民币27万元）、最多可配备2个CPU的“NX7700i/301L-2” （从59万日元起价，约合人民币4.5万元）。 (日经BP) SBC PPC: 4 x (MPC7447A or 970FX) As proposal 1.5GHz MPC7447A or 2.0GHz 970FX, Up to 4 x1G memory Power consumption: 130W180W On board GE switch, VLAN partition for separate the management and data path Target for Call server, SG, RNC, MSC MPC7447A or 970FX 2xGE to Base 2 x GE or 1xHig to Fabic Back plane 1x Hig to panel as optionFront Panel MPC7447A or 970FX MPC7447A or 970FX MPC7447A or 970FX VLAN AVLAN B 12 GE + 1Hig Switch(5691) SBC PPC: 12 x MPC8540/8541 As proposal 833MHz MPC8540/8541, Up to 12 x512M memory Power consumption: 150W190W On board Dual GE switch, for separate the management and data path Integrated security engine for 8541 configuration Target for Call server, SG, RNC, MSC, SBG, GSN, firewall, VPN, 2xGE to Base 1(2)xHig to Fabic Back plane 1(2)x Hig to panel as optionFront Panel MPC8540/8541 12 GE + 1/2Hig Switch(5691) MPC8540/8541 MPC8540/8541 MPC8540/8541 MPC8540/8541 MPC8540/8541 MPC8540/8541 MPC8540/8541 MPC8540/8541 MPC8540/8541 MPC8540/8541 MPC8540/8541 12 FE + 2GE Switch or 16GE Switch SBC PPC: Other solutions(Just for reference) Motorola: 4x8641(e600 dual core,up to 1.8G20W), for SG, RNC, MSC, SBC News IBM本周二宣布，它将在其JS20刀片式服务器中采用性能更高的Power处理器，系统运行的操作系统为AIX 版的UNIX。IBM 公司负责BladeCenter战略的主管Tim Dougherty表示，这意味着JS20刀片式服务器在性能 方面将能与p610、p615这样的低端Unix塔式服务器相当。Tim Dougherty透露，新系统将在10月29日发售 ，价格为2699美元。 2004-10-10 07:14:08 SBC MIPS: 4 x BCM1250(8 x 64MIPS core) As proposal 1.0GHz BCM1255, Up to 4 x1G memory Power consumption: 120W170W On board GE switch, VLAN partition for separate the management and data path Target for GSN,SBG, firewall, VPN, BLS 2xGE to Base 1(2)xHig to Fabic Back plane 1(2)x Hig to panel as option Front Panel VLAN AVLAN B 12(16) GE + 1(2)Hig Switch BCM1250 BCM1250 BCM1250 BCM1250 HT Sec engine SBC MIPS: 2 x XLR800 (16 core 64 threads), just for reference As proposal 1.2/1.5GHz XLR800, Up to 16 x512M memory Power consumption: ? Integrated Security engine, for 20Gbps DES/AES, 7100/sec 1024bit RSA Target for ultra high performance GSN,SBG, firewall, VPN, BLS 2xGE to Base 1(2)xHig to Fabic Back plane 1(2)x Hig to panel as option VLAN AVLAN B 12 GE + 1Hig Switch XLR800XLR800 SBC MIPS: 2 x XLR850 (16 core 64 threads), just for reference As proposal 1.2/1.5GHz XLR850, Up to 16 x512M memory Power consumption: ? Integrated Security engine, for 20Gbps DES/AES, 7100/sec 1024bit RSA Target for ultra high performance GSN,SBG, firewall, VPN, BLS 2xGE to Base 2xHig to Fabic Back plane 4 Hig Switch XLR850XLR850 24Gbps HT 1 x 10G 1 x 10G 2 x 10G to panel 12 GE Switch SBC Line Card 12 port GEPON line card Each EPON blade has 12 OLT ports All optical transceivers are located in rear IO board through Zone 3 backplane SFP-like EPON transceivers are expected Processor daughter card (PrPMC) includes MPC8250 The PrPMC provides 3 MII interfaces addition to PCI interface, two of them for Base Interface, rest one for EPON chips control interfaces A fast Ethernet switch is utilized for EPON chips control paths (MAC-to-MAC connection) Two HiGig ports are connected to Switch Fabric Board A and B, respectively. Line Card 24 port GE line card GE blade is used for EPON uplink It provides 24 GE ports, either fiber optical interfaces (SFPs) or copper interfaces (RJ45s) 2 port 10GE line card 10GE blade is used for EPON uplink It provides two 10GE ports, either fiber optical interfaces (XFPs) or copper interfaces (Infiniband cable) Line Card ATCA Platform Application Overview GEPON Call Server Overview: Network Architecture today Overview: Network architecture tomorrow Overview: Network Architecture Day After Tomorrow GEPON New Business - New Architecture Voice ServiceMultimedia Service DSL AccessFTTH(GEPON) 384K/2M30M/1G Normal PPUHigh performance SBC PICMG2.xPICMG3.x Low Deployment and Operation Cost Industry Standard, End to End IP, Multiple Vendors Support Advanced QoS Capability for Differentiated Broadband Services Naturally Broadcasting in Downstream, Suitable for Multicast Video/Audio Services Highest Speed PON 1Gb/s Downstream and 1Gb/s Upstream 10km Reach, 32 Splits, Average Bandwidth 60Mb/s (16 Splits), 30Mb/s (32 Splits) Yellow block is the NE that based on ATCA platform GE /10G GEPON Card In-Chassis Fabic Switch 2 x 12 x 10G GE /10G GE /10G GE /10G GEPON Card GEPON Card GEPON Card GEPON Card GEPON Card GEPON Card GEPON Card Management/Control/Signaling path Data path SHMC In-Chassis Base Switch 2 x 12 x 1G OSS ODN 96Port IN/ PSTN/ V-srv 96 GE or 8x10G PICMG3.x Application - Call Server Call Server Call Server Network Unit RM - Routing Manager, takes the charge of selecting an appropriate route to offer the call. This Unit can be implemented on MPU pair. MGC - Media Gateway Controller, control one or more MGs for connection of media endpoints. The function of a MGC includes MEGACO and MGCP. This Unit can be implemented on one pair of PPU pair. AS - Application server, processes the call traffic, services, signaling and access. The function of an AS includes CP (Call Processing: BCP, ACP, IN, etc.) and SP-Signaling Protocol (ISUP, SIP-T, PRI, PHS, etc.). Thi