杜邦產品介紹.ppt

introductiontoflexiblecircuitmaterials,presentedby:jonathanc.li,m,partii:(40minutes),簡報大綱,軟性電路板基材之介紹基材的主要compositiondielectricsubstrates(絕緣體)adhesive(膠質)conductor(導體),m,簡報大綱(continue),杜邦產品壓克力膠系列(modifiedwaacrylic)之基材環亞樹脂膠系列(modifiedepoxy)之基材杜邦料號解說pyraluxtelcam,m,軟性電路板之主要基材,coppercladlaminates(銅箔基材)single-sidedc.c.l.(單面銅箔基材),adhesive,conductor,dielectricsubstrate,m,double-sidedc.c.l.(雙面銅箔基材),conductor,dielectricsubstrate,adhesive,軟性電路板之主要基材,m,adhesive-lessc.c.l.(無膠銅箔基材),dielectricsubstrate,conductor,軟性電路板之主要基材,m,coverlay(覆蓋膜),軟性電路板之主要基材,m,stiffner(補強材),軟性電路板之主要基材,dielectricsubstrate,adhesive,m,bondply,dielectricsubstrate,adhesive,adhesive,軟性電路板之主要基材,m,mylar,adhesive,kapton,adhesive,sheetadhesivephotoimageablecoverlay(pic)dryfilmfine-lineapplicationcameraautomotiveothers,軟性電路板之主要基材,m,dielectricsubstrates,definitionabasefilmonwhichtheprintedconductorsarelaid.afilmwhichprovideselectricalinsulationbetweenconductors.afilmwhichprovidesmechanicalstrengthofthecircuit.,m,必備之特性mechanicalstrengthflexibilitydimensionalstabilitydielectricpropertiesthermalpropertieschemicalresistancemoistureabsorptioncost,dielectricsubstrates,m,substrates之種類polyimidepolyesterfluorocarbonaramidpapercomposite,dielectricsubstrates,m,polyimide:popularizedbydupontunder“kapton”alsoknownaspifirstchoiceoffilminmostfpcinfusibleandflameretardanthightg(約260c-280c)gooddimensionalstability,substrates,m,substrates,polyester:popularizedbydupontunder“mylar”alsoknownaspetlowestcostdielectricmaterialmostlyusedinlow-costconsumerapplicationgoodmechanicalpropertiesbadthermalproperties,m,substrates,aramidpaper:soldunderduponttradename“nomex”usedinspecializedapplicationgoodthermalinsulationmaterial,m,propertypolyesterpolyimidefluorocarbonaramidpapercomposite,tensilestrengthexcellentexcellentfairgoodbest,flexibilityexcellentexcellentexcellentgoodfair/good,dim.stabilityfair/goodgoodfairgoodfair/good,dielectricstr.goodgoodverygoodverygoodgood,solderibilitypoorexcellentfairexcellentexcellent,c.o.t.(c)105200-230150-180220105-180,thermalexp.lowlowhighmoderatelow,chem.resist.goodgoodexcellentverygoodfair,moistureabsorp.verylowhighverylowveryhighlow,costlowhighhighmoderatemoderate,tradenamemylarkaptonteflon/tedlarnomex,dielectricsubstrates,m,adhesive,definitionmaterialthatbondslayerstogetherthermosettingthermoplastic,m,adhesive,必備之特性adhesionstrengthflexibilitychemicalresistancethermalresistancemoistureabsorptionelectricalpropertiescost,m,adhesive,adhesive之種類polyesteracrylicepoxypolyimidebutyralphenolic,m,adhesive,polyester:usedwherethedielectricisalsopolyesterusedwherenosolderingisneededtypicalapplication:instantcamerafilminterconnectsinstrumentclusterconnectioninautomobiles,m,adhesive,acrylic:usedindemandingtemperaturerequirementapplicationmostpopularacrylicsystemispyraluxbydupontexcellentadhesion,m,adhesive,epoxy:widelyusedadhesivesystemgenerallylowercostthanacrylicabletostandwavesolderinggoodinhightemperatureforlongperiodoftime(400to450f),m,adhesive,polyimide:usedinadhesivelesscclandcoverlayusedwheredimensionstabilityiscriticalusedinhightemperatureapplicationhighmoistureabsorption,m,adhesive,polyester,acrylic,epoxy,polyimide,butyralphenolic,temp.resist.,chem.resit.,elec.prop.,adhesion,flexibility,cost,moisture,fair,good,excellent,excellent,excellent,low,fair,verygood,good,good,excellent,verygood,good,good,good,good,good,excellent,excellent,excellent,good,good,good,good,good,good,moderate,fair,fair,veryhigh,poor,fair,fair,high,moderate,poor,m,conductors/foil,majortypesofconductorsmetalsmetalalloysconductiveinkscopper(themostcommonlyusedconductorinfpc)electrolyticallydepositedcopper(ed)rolledannealedcopper(ra),m,conductors/foil,必備之特性current-carryingcapacityflexibilityservicetemperaturechemicalresistancemechanicalstrengthcost,m,conductors/foil,electricalproperties,thermalproperties,mechanicalproperties,relativecost,aluminum,copper,gold,nickel,silver,excellent,good,excellent,excellent,excellent,excellent,excellent,excellent,good,good,good,good,good,fair,fair/good,fair,fair,verygood,verygood,best,m,軟板基材製造過程,copperroll,kaptonroll,coppercladlaminate,heater1,heater2,liquidadhesive,aging,m,introductiontodupontproducts,m,partiii:(15minutes),dupontproductfamily,pyraluxpyraluxfrpyraluxlfpyraluxappyraluxpc,teclamteclamfncteclamdnc,pyralux,fr-series(acrylicbased)copper-cladlaminatespanelformpackaging.(24”x36”)ulapproved.(file#e124294)verygoodflexureenduranceex.fr9111,fr9110,fr8510,fr8515coverlayrollformpackaging.(24”x250)ulapproved.(file#e124294)excellentdimensionalstabilityex.fr0110,fr0210,m,pyralux,frcontinue.sheetadhesiverollformpackaging.(24”x250)ulapprovedex.fr0100,fr0200bondplyrollformpackaging.(24”x250)ulapprovedex.fr0111,fr0212,m,pyralux,lf-series(acrylicbased)militaryspecificationsexcellentflexureenduranceverygoodforhigh-densitycircuitrysameproductofferingsasfr-seriespc-series(acrylic,urethane,&imide-based)dryfilmphotoimageablecoverlaycameras&automotiveapplications,m,pyraluxp/ns,fr9111,cupicu,7-specialconstruction8-1/2oz.c.c.l.9-1ozormorec.c.l.,5-1/2oz.cu1-1oz.cu2-2oz.cu,1-1milpi2-2milpi3-3milpi,frlfap,copper-cladlaminates,m,pyraluxp/ns,fr0111,adh.piadh.,frlfap,7-specialconstruction0-coverlayorsheetadhesive,1-1miladhesive2-2miladhesive3-3miladhesive,1-1milpi2-2milpi3-3milpi,coverlay&sheetadhesive,m,teclam,fnc-seriescopper-cladlaminatesulapprovedgoodflexureendurancerollformpackaging(250/500mmx100m)ex.fncra110,fnc110coverlayulapprovedrollformpackagingex.fncc510,fncc510-20,m,dnc-seriesulapprovedleastrepellencygoodpeelingstrengthexcellentheat&humidityresistanceexcellenttransparencysam