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1SMT PROCESS SPECIFICATION CONTENTS1SHIPPING, STORAGE and PRODUCTION ENVIRONMENT 41.1General41.2General shipping and storage conditions51.3Storage and handling conditions for solder paste61.4Storage and handling conditions for printed wiring boards PWBs 61.5Storage conditions for underfill epoxy materials71.6Shelf life time for different component categories81.6.1Expired material handling81.7Moisture sensitivity levels81.8Drying (baking) moisture sensitive devices91.8.1Drying (baking) restrictions 91.9DRY STORAGE CONDITIONS102STENCIL PRINTING PROCESS SPECIFICATIONS112.1Paste specification 112.2Squeegee122.3Stencil122.4Support tables132.5Printing process parameters (stencil printing)132.6Print result validation143Process control and monitoring 153.1Automated Optical Inspection, AOI153.2Location of the machine in the production line153.3Utilization of inspection results153.4Component and paste alarm limits163.5Specification limits for capability analyses 174PLACEMENT PROCESS SPECIFICATIONS 184.1Nozzles184.2Feeders184.3NC-Programs 184.4Part Data / Vision processing194.5Placement process management data compatibility table195Dipping process205.1Dipping flux specification and handling instructions205.1.1Storage and handling instructions205.1.2Flux specifications205.2Dipping process specifications215.2.1Dipping device215.2.2Dipping process parameters216Reflow soldering profile measurement226.1Profile measurement equipment 226.2Reflow profile measurement method with standard calibration board227Standard, lead containing soldering process237.1.1Recommended reflow oven settings248Lead free soldering process258.1Reflow profile definition for Pb-free process258.2General Pb-free reflow soldering profile specification268.3Basic profile specification for standard calibration board in Pb-free process278.4Start-up settings for Pb-free process298.5Reflow profile measurement on product PWBs3029UnderfiLl process319.1General3110NK ACA SMT Process Specification3310.1ACA Technology Introduction3310.2ACA Process 3310.3Anisotropic Conductive Film3510.3.1ACF Material Specification 3510.3.2ACA Process Parameters3610.3.3Cooplanarity measurement 3710.3.4Measurement of bond line temperature3710.3.5Interposer 3810.4ACA Storage Conditions3810.5Interconnection Area Designing for Hitachi Chemical AC-2056T-45 ACF3910.6Bonding Force Calculation4011MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA4112Specifications for visual inspection; error criteria, faults classification and training material.4113Related Documents4131SHIPPING, STORAGE AND PRODUCTION ENVIRONMENT1.1GeneralGlobal NK Workplace Resources (NWR) organization specifies and takes care of general environmental conditions in material storage and factory hall, containing:-heating-ventilation-air conditioning-water/sewage-fire extinguishing systems-cooling-special HVAC (vacuum, soldering exhaust etc.)-electrical & ESD protectionSpecial process related matters like local machine/process step related filtering, lightning; AC and ESD protection should be take care by Time Zones and factories. Environmental conditions should be continuously monitored. Longer than four hour weighted average out-of-specification situations should trigger corrective actions.If tighter conditions are required or if these specifications/limits cant be remain local air conditioning (AC) systems like cooler/heater and laminar flow cabins must be used.More detailed and up-to-date environmental specifications can be found from Global NK Workplace Resources Intranet pages.4 1.2General shipping and storage conditions Expected shipping conditions (components and materials) 1Relative humidityRH 15 % - 70%Temperature -5C.+40CGeneral NK Storage conditions 2Relative humidityRH 10%-70%TemperatureTemperature 15C - 30C 3Component packing levelComponents must be at least in the first level, so called intimate delivery packing:-MBB (Moisture Barrier Bag) for humidity sensitive components-ESD (Electro Static Discharge) protective packing-Air flow preventive plastic packing (vacuum or not, but tightly closed)-Cardboard box if nothing of above mentioned packing are usedGeneral storage requirements Materials are not allowed to be stored:-in direct sun shine, not even through windows-close to heater/cooler/humidifier/light source-close to outdoors so that temperature/humidity limits are repeatedly exceeded NK production conditionsRelative humidity35%-55%Temperature20.5C 26.5C1External environment. Materials should be packed so that special requirements like maximum temperatures for underfill epoxy is not exceeded. Solder paste has its own specified shipping condition.2. Look special storage conditions for solder paste and underfill epoxy below3Components, esp. those having high mass (e.g. PWBs), should reach factory room temperature before entering process.51.3Storage and handling conditions for solder pasteSolder paste storage and handlingStorage temperatureRefrigerator, 0 8 C or paste specific requirementsShelf storage time6 months max.Storage time in room temperatureGeneral: 4 weeks (T= 20,5 - 25C),Alpha Metals OM 338T: 2 weeksStabilization time before usage4 hoursEnvironment in shippingTemperature +5+25 CHandling instructionsDo not store cartridges nozzle-end upPaste should warm up in room temperature without extra heating at least 4 hoursDo not put paste into refrigerator if it has reach room temperature1.4Storage and handling conditions for printed wiring boards PWBsPWB delivery, handling and storage conditionsDelivery package and storageAir evacuated (vacuum) Moisture Barrier Bag (MBB) according EIA-583 class 2, 50 panels/bag, all from same manufacturing lot.X-out marked panels should be packed separately and marked according separate documentHumidity Indicator Card (HIC), 5 levels, on the top of PWB stackDesiccant optional, must be placed so that panels dont bendIncoming inspectionCheck that MBB is not broken or HIC reading is 40% RHActions if NOK:-return to vendor or-bake in 60 C, 5 hours, RH 5%, soldering within 24 hoursShelf timeLook table below . Panels must be stored on flat shelf to prevent warpage(see section 1.5)Open time for bare PWBsNiAu plating: Soldering within 48 hoursOSP plating: floor life limit 48 hours, time between solderings 24hCleaning/ washingNot allowed61.5Storage conditions for underfill epoxy materialsMaterial name and typeLoctite 3593Emerson&Cuming E 1216Material Codes7520029 (30 cc, 30 ml)7520025 (55 cc, 50 ml)7520031 (6 oz, 150 ml)7520027 (20 oz, 500 ml)7520033 (30 cc, 30 ml)7520035 (55 cc, 50 ml)7520037 (6 oz,150 ml)7520039 (20 oz, 500 ml)Max transportation timeGoods must be received within 4 days after shipmentGoods must be received within 4 days after shipmentPackage typeSyringe, EFD compatible 6 oz or 20 oz only available at the momentSyringe, EFD compatible 50 cc, 6 oz or 20 ozStorage conditionSyringes must be transferred immediately from transportation package to intermediate storage cartridges tip down (freezer/refrigerator -20 C - +8 C)Following items must be recorded:- product type, package size- color (black) without deformation- lot number- date of shipment- amount of coolantSyringes must be transferred immediately from transportation package to intermediate storage cartridges tip down (freezer, -20 C)Following items must be recorded:- product type, package size- color (black) without deformation- lot number- date of shipment- amount of dry iceMax storage time6 months -20C - +8C 6 months -20 C Stabilization time before usageMaterial should reach room temperature before usage3 h for 6 oz cartridgePot life5 weeks +25C5 days +25C1.6Shelf life time for different component categoriesTable below specifies shelf time at NK or NKs suppliers storages starting from the date when material is received. Elapsed time between component manufacturing and receiving at NK is not calculated. 7General maximum shelf time is 12 month. Semiconductor packing materials should fulfill NS025 and EAI-583 & JESD625 standards and FIFO- principle should be applied.Component typeComponent intimate packageShelf timeGeneral for all components if not otherwise stated on delivery packageOpen shelf, components in their intimate delivery package12 monthPrinted Wiring Boards (PWBs)Vacuum package with dryer6 monthsComponents having silver plated terminations packed into MBBComponents should be packed into vacuum package with dryer6 monthsComponents having silver plated terminations in cardboard box or open plastic bagLonger storage time, if components are not packed into vacuum package will destroy solderability and affect to reliability3 months1.6.1 Expired material handlingIf above-mentioned shelf times are exceeded material is not allowed to be used in normal productionHandling of waist solder pasteExpired, defective or waist solder paste material is environmentally harmful and it should be handled according ISO14001 and local/global EMS (Environmental Management System) instructions and directives.1.7Moisture sensitivity levelsNK applies following JEDEC moisture sensitivity level classification:FLOOR LIFELEVELTimeConditions1Unlimited30C/85% RH21 year30C/60% RH2a4 weeks30C/60% RH3168 hours30C/60% RH472 hours30C/60% RH548 hours30C/60% RH5a24 hours30C/60% RH6Time on Label (TOL)30C/60% RH1.8Drying (baking) moisture sensitive devices8The components that typically are moisture sensitive are PWBs, semiconductors, especially CSP packages, most optical devices (IR modules, all LEDs), special plastic capsulated integrates structures (power devices, RF power amplifier, packages including polyimide tape or equivalent (FR-4) substrates).JEDEC MSL level is marked on components intimate packing. If component has been in open environment longer that MSL level specifies it should be baked before useage.The purpose of baking is to decrease the amount of humidity from plastic packages prior soldering. As absorbed water inside package vaporizes during reflow soldering, internal vapor pressure can cause cracks and other, visible or hidden, damages like delamination. This is commonly known as Popcorn phenomenon. Note standards and instructions for moisture sensitive components regarding protective packing in shipping and storage together with this specification.NK applies IPC/JEDEC J-STD-033A Bake Conditions for drying SMDs packed into T&R:Bake 40 C, RH 5%MSL open environment (max. 30C/60% RH) between Floor Life Limit and FLL+72h open environment (max. 30C/60% RH) more than Floor Life Limit +72hLevel 2a 2 days5 daysLevel36 days9 daysLevel 46 days9 daysLevel 57 days10 daysLevel 5a7 days10 daysNote: Prevent direct contact of reels to drying chamber side and bottom walls, since these may be at significantly higher temperature than oven controller indicates. Verify feasibility of drying oven to component moisture removal and effect of various loading conditions by careful study of oven temperature control system.1.8.1Drying (baking) restrictionsBaking components may cause solder oxidation and/or intermetalic growth, which, if excessive, can result solderability problems during board assembly. The temperature and time for baking components is therefore limited by solderability considerations. Normally, one bake cycle is allowable. If more than one bake cycle is needed, Manufacturing Solutions should be consulted. Note: Moisture sensitive components exposed for anytime less than their stated floor life, dry packing or placing the components in a dry cabinet maintaining not greater than 5% RH, the floor life clock will stop/pause, but the cumulative floor life must meet specified limit.Note 2: PWBs, esp. OSP plated PWBs, should be considered as moisture sensitive. Total allowable open time for these is 72 hours, and time between first and second reflow soldering is limited to 24 hours. If these times are exceeded board should be baked as described earlier. Look section ”1.3 Storage and handling conditions of PWBs”PWB assembles entering to major rework phases like CSP change, should be dried beforehand or WIP should be stored in dry cabins or vacuum packs.9Note 3: Rework process should be compared to reflow soldering so all precautions should be take into account: assemblies (WIP) and components should be dry or those must be baked beforehand.1.9DRY STORAGE CONDITIONSDry storage is an interim, short-term storage for humidity sensitive components and assemblies (WIP) during production line stoppages and short breaks like weekends if these materials are not protected by Moisture Barrier Packages.Dry storage is meant only for storage purposes, not for drying. In case of double-sided assemblies, which have OSP surface finishing, time between first and second soldering process must be within specified limit; dry storage time should be included.Dry storage specificationTemperature25 5 CHumidity15 min), if more than 50% of paste volume is refilled or after paste collection together outside squeegee area paste should be kneeded112.2SqueegeePropertySpecificationSqueegee blade materialNi or Titanium plated stainless steel with adequate stiffness for high speed printing.Thickness 275 10 mSqueegee holder angle* (critical parameter)60 2.5Squeegee width for DEK&MPM and equivalent printersPanel length rounded up to closest std widthPaste retainersRequired, adjust close to stencil surface, but retainers must not touch stencil during printing operations if not spring loadedNote: Squeegee flexural strength is a critical parameter.*) Method of measurement: Bevel protractor2.3StencilPropertySpecificationScreen materialNormal grade polyester screen 55T-66T (140-167 mesh/inch), equivalent stainless steel acceptedAlso interchangeable stencils corresponding frames can be usedScreen tension (measurements on stencil foil will give erroneous, but indicative results) after stencil attachment at any point*min 25N/cmStencil aperture opening dimensional variationmax 10 m or 5% deviation maximumStencil thickness 0.10mm 0.01mmStencil material/manufacturing processElectroformed nickel or laser cut stainless steel or nickelStencil rejection criteria by tension in production measured at screen at any point*25N/cmFiducials2x1mm dia sphere etched half-way on stencilStep stencilsMax step thickness /= 25% of nominal stencil thickness (e.g. 100m stencil, step area 125m12*) Method of measurement: Fabric Tension Gauge, for example ZBF Tetkomat, CH-8803 Rschlikon, Switzerland, fax. 01/724 15 25, or equivalent.Note: If polyester screen is used then proper ESD precautions should be done2.4Support tablesPropertySpecificationMaterialMachined construction metal as steel or Al alloy. High friction surface on the top recommended. Used materials shall be ESD compatibleSupport table parallelism to stencil Max 0.2mm on support table areaSupporting surface smoothness 0.025mm on whole areaMachining depth for side 2 supportMax component height + min 5 mmModule edge support (for side 2 support only)Module edge supported 1.5mm 0.5mm from edge towards module center, max span around critical areas without support max 15mm. The support table must be such that maximum area is supportedVacuum holes on support tablePrimarily locate at non-printable area and prevent vacuum leakage to print area. If vacuum can be limited to 100-200 mbar reliably, vacuum assistance over whole area may be possible with careful process adjustment.Panel alignmentMechanical, so called “Hard Stopper” have to be used if exist especially for products having 0.5 mm pitch CSP components2.5Printing process parameters (stencil printing)ParameterSettingPrint speed10030mm/s for both normal and LF pasteSqueegee pressure for 200mm wide squeegee* in constant force mode (force automatically adjusted, print head floating)Minimum pressure that will wipe stencil surface clean +5N as safety margin, normally between 40 50 N Squeegee adjustment for (constant squeegee distance (negative) from PWB surface, force against down stops)Minimal adjustment that will wipe stencil surface clean +0.5mm as safety marginSnap-off distance -0.5 - 0.0mm on whole panel area (negative snap-off recommended to give margin against machine misadjustments)Separation speedMax. speed which quarantees that a panel keeps in contact with support table during separation phase Automatic wipe rate. Standard pasteAfter every 10 5 prints Note: Under non-conforming situations caused by temporary technical problems more frequent wipe may be applied.13Automatic wipe rate. Lead free paste3 6 printsPaste amount on stencilThumb rule: paste roll diameter max. 20 mm, min. 12 mm.Paste refillingRefilling before paste roll has reach 12 mm diameter. Paste reusePaste on stencil can be transfer to other stencil or it can be interim stored in clean plastic jars. Total paste lifetime on stencil and interim storage is 6 hours together. Paste on stencil should be covered with plastic foil during line stoppages longer than 15 min.If paste has been on stencil without protection over 1 hour, it should be changed and old one scraped.Cleaning fluid for printer automatic wiping and automatic stencil cleaningMulticore Prozone SC-01, Kiwoclean or equivalent high flash point solvent officially accepted by printer manufacturer. Use of isopropanol (IPA) or equivalent solvents is not allowed due to fire safety resons.Cleaning fluid for cleaning of misprinted boards and for manual stencil and equipment cleaningPWBs ARE NOT ALLOWED TO BE WASHED! Cleaning solvent traps into PWB structures and reduces esp. CSP components joint reliability.2.6Print result validationPrint result validation is defined in chapter 3, Process Control and Monitoring143PROCESS CONTROL AND MONITORING3.1Automated Optical Inspection, AOI3.2Location of the machine in the production lineAOI system must locate between last high-speed placement machine and depending on line setup, before or between IC placement machine(s). In this stage all chip components are placed and paste deposits of most critical integrated circuits are still visible. AOI inspection must cover all components placed before AOI system considering false call requirement ( 1.33) based on AOI alarm limits or fixed (150um) process tolerances.Repair loop is required to enable repairs for defects found in AOI inspection. Optimum location of repair phase depends on line layout. Reporting of made corrective actions and defect modes is mandatory part of repair loops. Analyses of verified defect modes should 15be utilized in optimization of AOI inspection process in order to achieve lower than 50ppm false call level with all products.3.4Component and paste alarm limitsNext table describes recommended alarm limits and acceptable range of alarm limits for different component types and for paste deposits. Alarm limits are used in AOI systems as pass/fail limits. The objective is to detect defects that cant be fixed by self-alignment during reflow process and to avoid unnecessary alarms. Therefore alarm limits are recommended values that can be changed based on self-alignment properties or false call/accept levels.Component typeRecommended alarm limitsAcceptable range0402chip componentsX & Y Offset: 180 m Offset: 15 X & Y Offset m: 150 200 Offset: 10 30 0603 chip componentX & Y Offset: 220 m Offset: 15 X & Y offset m: 180 250 Offset: 10 30 Component X & Y Offset: 130 m Offset: 10Component X & Y Offset: 120 m 150m Offset 8 150.5 mm pitch CSP Paste X & Y Offset: 120 mArea: 35% - 150%Bridging: 20%Paste X & Y Offset: 100 m 150m Area: 35% - 180%Bridging: 15% - 30%ComponentX & Y Offset: 120 m Offset: 10Component X & Y Offset: 120 m 160m Offset 8 150.4 mm pitch CSPPasteX & Y Offset: 100mArea: 45% - 150%Bridging: 20%Paste X & Y Offset: 100m 150m Area: 35% - 170%Bridging: 15% - 30%Other paste depositsPaste X&Y Offset: 150 mArea: 50%-150%Bridging: 0.4x aperture dim.Paste X&Y Offset: 100m 200mArea: 35%-200%Bridging: 0.3 0.5 x aperture dim.Generic tolerances for other components X & Y Offsets: 200 m Offset: 15 X & Y Offset m: 180 250 Offset: 10 30 16Specification limits for capability analysesTable below describes specification limit values for capability studies. The objective is to define process window for most critical processes and use these values in machine capability monitoring and control to optimize paste printers and placement machines.Process phaseSpecification limitsPaste printing(275m diam. apertures)X & Y Tolerances: 100 mTarget: Cp1.33 (sigma level 3)Chip placement(0402 R &C)X & Y Tolerances: 150 mTarget: Cp1.33 (sigma level 3)IC placement(0.5 & 0.4 mm CSP)X & Y Tolerances: 75 mTarget: Cp1.33 (sigma level 3):174PLACEMENT PROCESS SPECIFICATIONS4.1NozzlesRecommended nozzle sizes for some package types:0201 (0603)Fuji CP series: 0.4 mm circular nozzleSiplace: type 7020402 (1005)Fuji CP series: 0.7 mm circular nozzleSiplace: type 901 or 925Odd-shape components (connectors, duplexers, power modules, etc.)As large nozzle as possible shall be used (usually min diameter 5mm /area min 20mm ) in order to 2maintain placing speed and accuracy4.2FeedersHigh Speed machines7” Tape&Reel is a standard for Fuji. 13” reels can be used for 0402 resistors and capacitors (13” with paper tape, blister tape not allowed).For Siplace 13 and 15 Tape&Reel can be used.Low Speed machines13” Tape&Reel is a standard, 7” and 15” may also be used. Sticks and trays are not allowed. 4.3NC-ProgramsPlacing sequence of 0402In high-speed machines it is generally recommended to assembly first all low parts (0402 resistors 0.3mm), then parts, the height of which is 0.3 - 0.5 mm (usually 0402 capacitors) and then the rest of the components.Independent / connected feeder tablesIt is always recommended to use feeder tables independently in high-speed machines, thus eliminating undesirable stoppages when a part runs out. If connected tables must be used, it is advisable to use “Next Device” function or/and 13” reels to decrease component shortages of “high-runner” codesNC-program optimization / All modules mixedThis is usually the fastest way to assembly a panel (all modules assembled mixed at the same time as one big PWB) and is thus recommended.NC-program optimization / Step and repeatIf “step and repeat” mode (offset) is used, then every other module must be assembled using reverse placement sequence, so that the feeder table doesnt have to move unnecessarily from left to right at each offset.184.4Part Data / Vision processingChip componentsBinary vision is recommended whenever possible.IC-type componentsEvery lead shall be checked for pitch and lead length.CSP componentsAs general recommendation use outermost balls for component alignment.Complex connectorsAs general recommendation use outermost leads for component alignment. Pls, check “lead insertion depth tolerance” from components specifications, since this affects in positioning of component body.Placing speed100 % placing speed is always the target. This can be achieved with most package types by selecting the proper nozzle (see 8.1, Nozzles).4.5Placement process management data compatibility tableFujiReadings from F4G (Production Data - Analyzer - Device) shall be used to manually generate following rates:Pick-up Rate = 1- Total Errors / Total PartsMount Rate = 1- Total Errors / (Total Parts - Total Errors)SiplaceRates from the line computer MaDaMaS system:Comp. ok = Total count id. err. vac. errMount Rate = Comp. ok195DIPPING PROCESS5.1Dipping flux specification and handling instructions5.1.1Storage and handling instructionsAll fluxes shall be stored in a cool and dark (10C ) dedicated refrigerator. Maximum acceptable shelf storage time in stable conditions is 6 months. Flux can be stored in normal production environment for 4 weeks. Before use flux has to be stabilized to ambient temperature minimum 2 hours. Do not accelerate warming-up by heating! Environmental conditions during transport have to be controlled and within 15-25C.5.1.2Flux specificationsSPECIFICATIONALMIT BM1 - RMA FLUXNCM Codes7561025 (30 cc, 30 ml)PropertyVery fine, fine and low pitch dipping applicationsStateHigh viscosity liquidColorLight yellowSpecific gravity1.081 0.005 (26 C)Viscosity25000 5000 cp Solids content60 %Copper plate corrosion testPass (JIS-Z-3197)Copper mirror corrosion testPass (MIL-F-14256E)Cloride and bromide testPass (MIL-F-14256E)Insulating resistance1 x 1012 (JIS-Z-3197)Humidity resistance at high voltage1 x 1012 (JIS-Z-3197)Solution resistance 100 000 cmSpreadability on copper plate80%Open time 18 hFlash PointAbove 120 C open cup 1 Time during which the same flux (without any addition) can be used on the open dipping device.205.2Dipping process specifications5.2.1Dipping deviceSqueegee blade materialCorrosion protected spring steel or stainless steel Recommended typesSiemens Cleaning period and method is described in the Work Instructions to Dipping Module5.2.2Dipping process parameters Film thickness 50 70 % of bumps height. Measuring instructions in the Work Instructions to Dipping Module 216REFLOW SOLDERING PROFILE MEASUREMENT6.1Profile measurement equipmentReflow profile shall be measured using a temperature measurement equipment specifically designed for pass-through reflow profile measurements.Recommended profiling equipments (data loggers)Datapaq 9000SlimKIC seriesThe profiling equipment shall be calibrated regularly according to the maintenance instructions by the supplier.Also needed:-Thermal Barrier blanket -Thermocouple/ calibration board combination -Computer with logger interface softwareOnly the thermocouples recommended and approved by the measurement equipment supplier shall be used.6.2Reflow profile measurement method with standard calibration boardItemOven calibration and verificationPurposeTo evaluate oven functionality against specified profile and settings (preventive maintenance)Measurement frequencyMin. once in week, after every major maintenance or whenever deviation is suspectedMeasurement piece100x100x1.5 mm FR4 laminate , std NK calibration boardNumber of thermocouples2Position of thermocouples1 thermocouple attached to PWB (PWB surface temperature). This profile shall conform to specification in section 5.3.1 thermocouple above the PWB surface or glued by tape over hole (air temperature near the PWB). Thermocouple attachment methodPWB thermocouple shall be attached by M2x5 stork screw and washer (outer dia 4.7mm, inner dia 2.2mm, thickness 0.2 mm) to a 3x3 mm Cu area. Air temperature thermocouple attached above 14 mm dia hole. Hole covered from bottom side by Kapton tape.Repeatability and Reproducibility (Gage R&R) of thermocouple attachment shall be verified when taking new thermocouples in use. Critical parameters are time above 179C (ref. 5), peak temperature (ref. 6) and temperature gradients in preheat (ref. 1) and reflow (ref. 4)Data storageResults should be stored to specified place (server/folder/file) for later usage. Latest result should be present near oven.It is recommended to follow-up variation of some parameters (for example peak temperature) by using SPC style charts: this will help to identify deviations and trends in oven stability. 227STANDARD, LEAD CONTAINING SOLDERING PROCESSThese specification values apply to standard calibration board screw thermocouple specified in previous section. The profile within this specification produces acceptable product board profile for typical mobile phone boards with 0.91.1 mm thickness and component counts and types.If board is significantly different (thinner, thicker, only a few components etc.) different specification may be needed to achieve acceptable profile on the product board. Therefore it is recommended to measure reflow profile on different locations of a product board when a new product is ramped up. Basic instructions for profile measurements on products boards are defined in section 8.1.RefParameterSpecificationMethod of heat transferForced convectionMeasurement methodOven calibration board screw thermocouple 1Average temperature gradient in preheat (T= 40140C)1.83 C/sMax temperature gradient in preheat10 C/s2Soak time in preheat (T= 140170C)6080 s3Max temperature in preheat175C4Average temperature gradient in reflow (T= 175200C)1.32 C/sMax temperature gradient in reflow5C/s5Time above 179C4060 sTime above 200C2545 s6Peak temperature in reflow215225C7Average temperature gradient in cooling (T=200120C)-1.5-3.5C/sMax temperature gradient in cooling-5C/sTotal length of profileMax 300 sPWB temperature at oven outputMax 40 C23Time/sTemperature/C1234567Figure 1. Illustration of critical reflow process parameters. 7.1.1Recommended reflow oven settingsThe following tables show typical setting range which should result a reflow profile within the specification. The settings shall be verified for each oven using oven calibration method (section 6.2) and settings shall be adjusted if necessary to achieve a profile within the specification in section 8.2 BTU VIP98Zone1234567CoolingTop120C135C150C165C175C215C245CBottom120C135C150C165C175C215C245CConveyor speed0.78 m/minStatic pressure1.2ERSA Hotflow2/14TOP1801601601601752452556050Zone123456789BOT1801601601601752452556050Conveyor speed90 cm/minBlower top80%Blower bot80%Blower cooling100%248LEAD FREE SOLDERING PROCESS8.1Reflow profile definition for Pb-free processProcess window of Pb-free reflow soldering will be smaller than conventional SnPb process due to smaller superheat (difference between peak temperature and alloy melting point). Therefore reflow profile shall be optimized separately for each product-oven combination.The procedure for defining correct reflow profile and settings is as follows1.The basic Pb-free reflow profile for standard calibration board is specified in section 7.2 and typical set-up values for different oven types in sections 8.4. This profile and settings shall be used as a starting point for product specific profile definition.2.Set-up basic Pb-free profile to the oven and measure the profile with standard calibration board.3.Attach necessary amount of thermocouples to a product board on appropriate positions. Guidelines for thermocouple attachment are described in section 8.5. Correct attachment of thermocouples is essential for the accuracy and reliability of temperature measurements. 4.Measure the reflow profile with the product board. Several measurement on different locations (components) should be done so that sufficient information of hottest and coolest locations is acquired.5.Analyze profiles of the product against requirements described in section 8.26.If profiles measured from the product do not meet the requirements, adjust oven settings accordingly and repeat the measurement with product board. Continue optimization until acceptable profile is achieved. 7.When profiles measured from the product meet the requirements measure the profile with standard calibration board.8.Define the tolerance graph based on standard calibration board profile and create the specification including all set-up parameters for the oven and product in question. Tolerance graph shall be such that product board profiles stays within specification.9.Measure oven profile regularly once per week with standard calibration board. The profile shall stay within the tolerance defined previously. If deviations occur root cause shall be analyzed and problem corrected before any adjustments in oven settings are made.258.2General Pb-free reflow soldering profile specificationThe following reflow profile specification is a general specification for product board profile. All the profiles measured from the product board shall fulfill these requirements unless otherwise specified in detailed product specifications.The linear preheat reflow profiles shall be used in all reflow ovens (Ersa HotFlow7, Electrovert OmniFlo7 and BTU VIP98, ERSA Hotflow2/14) for lead-free soldering process.Pb-free reflow profile specification for product boardParameterSpecificationMethod of heat transferControlled forced hot air convectionMeasurement methodThermocouples attached to different locations on product board. Profile typeLinear ramp in preheat from 70 to 180CTemperature gradient in preheat (T=70180C)0.81.0 C/sTemperature gradient in reflow (T=200225C)0.93.0 C/sMax temperature gradient in reflow5 C/sTime above 217C 3565 sTime above 230C2550 sPeak temperature in reflow232250 CDelta T target (between critical components) ThicknessT = TR-type of interposer5 = Width38Consumption of interposer can be considered as follows:5 bondings per the same place of interposer Example calculation. If interconnection length is 5mm and number of interposer per reel in meters is 2 = allows 220 bondings10.4 ACA Storage ConditionsAll storage specific information is illustrated in 39表 14.Table 7 ACF storage conditionsParameterSpecificationPacked6 months after date of manufacture when stored at -10C to 5C.Unpacked1 month at 25C or below and 70%RH or below.Storage Conditions Shelf LifePre-bonded2 months at -10C to 5C. 1 month at 25C or below and 70%RH or below.10.5 Interconnection Area Designing for Hitachi Chemical AC-2056T-45 ACFIn order to maximize interconnection conductivity, is recommended to use oblong-shaped interconnection pad design instead of, e.g. square to guarantee maximum conductivity ands mechanical adhesion. Some recommendations are given in 表 15.Table 8 Pad area recommendationsParameterSpecificationMinimum pad length0.5mmMinimum pad area0.25mm2Minimum pitch for mechanical alignment 0.8mmMinimum width of trace in interconnection area0.5 mmUse of micro-via-in-padNot recommended unless FV-1 technology can be usedInterconnection pad areaPad finishImmersion AuIn interconnection area design the following matters must be taken into account such as film width vs. tool size vs. surrounding area. The next Figure 7 illustrates designing recommendations previously described.40Figure 7 Interconnection area10.6 Bonding Force CalculationCalculation of optimal bonding pressure can be obtained by using the following model. F = C x AWhere F = force, C = constant and A = area a.k.a. pressure equals required pressure per cm2 x thermode area in cm2.For Hitachi AC-2045T-45, recommended pre-bonding pressure is 1MPa and for final-bonding 3MPa. Force for pre-bonding: 1MPa (100N/cm2) x thermode area in cm2 = xx NForce for final-bonding: 3MPa (300N/cm2) x thermode area in cm2 = xx N 4111MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA All rework issues are specified in separate document, NS0265, SMD Rework Specification for Manufacturing. It can be found from Operation Global DocMan R4 Lotus Notes database. 12SPECIFICATIONS FOR VISUAL INSPECTION; ERROR CRITERIA, FAULTS CLASSIFICATION AND TRAINING MATERIALVisual inspection criteria applied at NK is defined in document NS055, SMD Workmanship Standard. This standard in mainly based on ANSI/IPC-A-610B, class 2, telecommunications.Same criteria are used also for assemblies manufactured by subcontractors.Applicable international standardANSI/IPC-A-610B, class 2, telecommunicationsError criteria and fault classification“SMD Workmanship Standard”, NS055.Training packageNK training package “SMD Workmanship Standard”, NS055 or equivalent training material conforming to ANSI/IPC-A-610B.13RELATED DOCUMENTSNS055, SMD Workmanship Standard stored in Operation Global DocMan databaseEIA-583 Packing Material Standards for Moisture Sensitive ItemsEIA-541 Packing Material Standards for ESD Sensitive ItemsBoth above mentioned standards are available also in NK Intranet. Lead Free Process specification in Operations Global DocMan database42SMT 工艺说明书工艺说明书 目录目录1 运送运送、存储和生产环境存储和生产环境31.1 概述概述 31.2 普通运送和储藏条件普通运送和储藏条件 41.3 锡膏的存储和处理条件锡膏的存储和处理条件 51.4 印刷线路板印刷线路板PWBsPWBs 的存储和处理条件的存储和处理条件 51.5 环氧树脂的储藏条件环氧树脂的储藏条件 61.6 不同种类的元件的搁板寿命期不同种类的元件的搁板寿命期 61.7 潮湿灵敏性级别潮湿灵敏性级别 71.8 烘干（烘焙）潮湿敏感器件烘干（烘焙）潮湿敏感器件 71.9 干货存贮条件干货存贮条件 82 丝网印刷工艺说明丝网印刷工艺说明102.1 锡膏规格锡膏规格 102.2 刮刀刮刀 112.3 丝网丝网 112.4 支撑台支撑台 122.5 印刷工艺参数（丝网印刷）印刷工艺参数（丝网印刷） 122.6 印刷结果确认印刷结果确认 133 印刷工艺控制和监控印刷工艺控制和监控143.1 自动光学检测：自动光学检测：AOIAOI 143.2 机器在生产线的位置机器在生产线的位置 143.3 检测结果的利用检测结果的利用 143.4 元器件和锡膏的报警极限元器件和锡膏的报警极限 143.5 能力能力分析的规格限制分析的规格限制164 贴装过程规范贴装过程规范174.1 吸嘴吸嘴 174.2 飞达飞达 174.3 数控程序数控程序 174.4 零件数据零件数据/ /视觉处理视觉处理 184.5 贴装进程数据管理兼容表贴装进程数据管理兼容表 185 点胶点胶工工艺艺195.1 点胶量规范和操作说明点胶量规范和操作说明 195.2 点胶工艺规范点胶工艺规范 206 回流焊曲线测量回流焊曲线测量216.1 曲线测量设备曲线测量设备 216.2 校准结合板的回流曲线测量方法校准结合板的回流曲线测量方法 217 有铅焊工艺有铅焊工艺标标准准218 无铅工艺无铅工艺238.1 无铅工艺曲线无铅工艺曲线 23438.2 普通无铅回流焊曲线规格普通无铅回流焊曲线规格 258.3 在无铅过程中标准校准板的基本的曲线规格在无铅过程中标准校准板的基本的曲线规格 268.4 无铅工艺启动设置无铅工艺启动设置 288.5 PWBsPWBs 产品回流曲线的测量产品回流曲线的测量299 点胶过程点胶过程309.1 概述概述 3010 NKNK ACAACA SMTSMT 工艺规格工艺规格3210.1 ACAACA 技术介绍技术介绍 3210.2 ACAACA 工艺工艺 3210.4 ACAACA 贮藏条件贮藏条件3710.5 日立化学制品日立化学制品 AC-2056T-45AC-2056T-45 ACFACF 互联设计的面积互联设计的面积 3710.6 结合力计算结合力计算 3811 手工焊接的过程和手艺标准手工焊接的过程和手艺标准3912 视觉检测的规格：错误标准、故障分类和培训材料视觉检测的规格：错误标准、故障分类和培训材料3913 相关文档相关文档39441 运送、存储和生产环境1.1 概述全球 NK 工作场所资源 (NWR) 部门指定和照顾材料存储和工厂环境条件, 包括:-加热-通风-空调-水/污水-灭火系统-冷却-特殊 HVAC (真空, 焊接排气等.)-电力& ESD 防护各个时区和工厂应该关注特殊工艺涉及的问题像局部的机器或工艺步骤相关的过滤器和灯光以及交流电和 ESD 防护。 环境条件应该不间断地监控，在规范范围外平均长于四个小时的境况应该进行纠正行动。如果条件允许或者这些规范和界限不能保持当地的空调（交流）系统，必须使用像冷却器和加热器和层流舱。更多的细节和最新的环境规范可以从全球 NK 工作场所资源部门企业内部网页找到。1.2 普通运送和储藏条件期望的运送条件期望的运送条件 ( (元件和原料元件和原料) ) 1 1相对湿度RH 15 % - 70%温度 -5C.+40C45全球全球 NKNK 储藏条件储藏条件 相对湿度RH 10%-70%温度温度 15C - 30C 元件包装级别元件必须至少在第一级别, 正所谓亲密递送包装:-MBB (防潮袋) 用于潮湿敏感元件-ESD (静电释放) 防护包装-空气流动塑封包装 (真空与否，但一定要紧紧密闭)-纸箱如果没有提到上面的包装也可以使用一般的储藏要求 原料不允许如此存储:-直接在阳光下-接近加热器、冷却器、湿度调节器、光源-接近户外以致重复地超越温度和湿度界限NKNK 生产条件生产条件相对湿度35%-55%温度20.5C 26.5C1 外部环境：像胶水不能超过最高温度，锡膏也有它自己特定的运送条件，由于有这些特殊要求的存在，因此原料应该包装。 2 注意锡膏和胶水的特殊存储条件。3 元器件, esp：那些持有高产量(例如 PWBs)应该在达到工厂室温之前进行处理。1.3 锡膏的存储和处理条件锡膏的存储和处理存储温度冰箱 0 8 C 或锡膏特殊要求搁板存储时间最大六个月室温下存储时间一般: 4 周 (T= 20,5 - 25C),Alpha 金属 OM 338T: 2 周运送环境温度 +5+25 C处理指南不能贮藏在管口针尾；锡膏在没有额外加热时应该在室温下置放至少 4 小时；如果锡膏已经回温到室温不能再放回冰箱461.4 印刷线路板PWBs 的存储和处理条件PWBPWB 递送递送, , 处理和存储条件处理和存储条件递送包装使用的抽空（真空）防潮袋(MBB)依照 EIA-583 二级标准，来自同一制造批次的 50 块板装成一袋。X-out 标记的板应该依照隔离文件分开包装和标记。湿度指示卡 (HIC),共分 5 个等级，放在 PWB 板堆顶部。只要板不被折弯干燥剂可以随意放置。引入检测检查 MBB 没有否损坏或 HIC 值小于 40% RH如果 NOK 进行动作:退回供应商或者在 60 C ，RH 5%下烘焙 6 小时，且在 24 小时内焊接搁板时间从工作台往下看，板必须存储在平板架上以防止翘曲。(参阅 1.5 节)裸 PWBs 置空时间镀镍金板:在 48 小时内焊接镀 OSP 板: 堆板时间限制在 48 小时内，在 24 小时之间焊接。清洁洗涤不清洁洗涤1.5 环氧树脂的储藏条件原料名字和型号原料名字和型号乐泰乐泰 35933593爱玛森康明爱玛森康明 1 1216216原料代码7520029 (30 cc, 30 ml)7520025 (55 cc, 50 ml)7520031 (6 oz, 150 ml)7520027 (20 oz, 500 ml)7520033 (30 cc, 30 ml)7520035 (55 cc, 50 ml)7520037 (6 oz,150 ml)7520039 (20 oz, 500 ml)最大运送时间货物必须出货 4 天后接收货物必须出货 4 天后接收包装类型注射器，EFD 兼容 6 oz 或 20 oz 最好可同时利用注射器，EFD 兼容 50 cc, 6 oz 或 20 oz存储条件注射器管必须马上从运送包装中转移出来且立即使筒顶倒立存储(电冰箱 -20 C +8C)必须记录下面的项目：- 产品型号, 包装大小注射器管必须马上从运送包装中转移出来且立即使筒顶倒立存储(电冰箱 -20 C)必须记录下面的项目：- 产品型号, 包装大小47- 颜色 (黑色) 无变形-批号-发料日期-冷却液型号- 颜色 (黑色) 无变形-批号-发料日期-冷却液型号最大存储时间6 个月 -20C+8C 6 个月 -20 C 使用前稳定时间原料使用前必须达到室温6 oz 3 小时罐装寿命5 周 +25C5 天 +25C1.6 不同种类的元件的搁板寿命期下表指定的是 NK 或 NK 的供应商从原料接收存储的时间起计算的搁板时间，不计算元件制造和接收所耗费的时间。一般来说最大的搁板时间是 12 个月。半导体封装材料应该履行 NS025 和 EAI-583 & JESD625 标准以及应用 FIFO 法则。元件类型元件类型元件封装元件封装搁板时间搁板时间一般指对于没有另外规定的运送包装元件开架，元件就在包装袋子中12 个月印刷线路板 (PWBs)干燥真空包装6 个月端头镀银的元件装入 MBB元件必须装入干燥真空包装袋里6 个月端头镀银的元件在纸箱或敞开的塑料袋里长时间存储时如果元器件没有装入真空包装袋会损坏可焊性和影响可靠性3 个月1.6.1 过期元件的处理如果上述提到的原料超过了搁板时间是不允许在正常生产中使用的。1.6.2 细窄锡膏的处理过期的、有缺陷的和细窄的锡膏原料是对周围的环境有害的以及它应该依据 ISO14001 标准和当地或全球 EMS（环境管理系统）的指导和指示。1.7 潮湿灵敏性级别NK 应用如下 JEDEC 潮湿灵敏性级别分类：48产品失效的保底时间产品失效的保底时间级别级别时间时间条件条件1 1无限制30C/85% RH2 21 年30C/60% RH2a2a4 周30C/60% RH3 3168 小时30C/60% RH4 472 小时30C/60% RH5 548 小时30C/60% RH5a5a24 小时30C/60% RH6 6贴标签时(TOL)30C/60% RH1.8 烘干（烘焙）潮湿敏感器件有代表性的潮湿敏感元件是 PWBs、半导体，特别是 CSP 封装的，大部分光学器件（IR 模块，所有 LED），特殊塑胶集合结构（功率器件，RF 功率放大器，含聚酰亚胺封装带或者同质(FR-4)基板）。JEDEC MSL 级别被标记在元件紧密包装上。如果元件已经敞开于露天环境下长于 MSL 所指定级别时间时应该在使用前烘焙。烘焙的目的是为了减少焊接前塑料封装湿度量。相当于封装里的冷凝水回在回流焊时蒸发出来，内部的水蒸气压会产生裂缝或者其他的，可见或隐蔽的层纹。这就是众所周知的爆裂现象。注意潮湿敏感元件关于在运送和存储的防护包装标准和用法以及规格。烘焙烘焙 4040 C,C, RHRH 5%5%MSLMSL 露天环境 (最大 30C/60% RH 在产品失效时间和 72 小时之间露天环境(最大 30C/60% RH)产品失效时间大于 72 小时2a 级2 天5 天3 级6 天9 天4 级6 天9 天5 级7 天10 天5a 级7 天10 天49NK 应用 IPC/JEDEC J-STD-033A 烘焙条件来进行干燥装入的 T&R SMDs：注注: : 防止卷轴直接接触到干燥室内边和底壁防止卷轴直接接触到干燥室内边和底壁, , 因为这些也是比烤箱控制器高温的显著象征。由因为这些也是比烤箱控制器高温的显著象征。由烤箱温度控制系统的仔细研究中可以校验烤箱各样的负荷状态下对元件除湿效果的可行性。烤箱温度控制系统的仔细研究中可以校验烤箱各样的负荷状态下对元件除湿效果的可行性。1.8.1 干燥（烘焙）的约束烘烤元件可能导致焊剂氧化并且（或者）助长合金成长, 如果过量, 可能在组装板期间产生可焊性问题。烘烤元件的温度和烘烤时间应考虑到可焊性的限制。通常一个烘烤周期是允许的。如果超过烘烤周期是必需的,应该咨询制造商。注: 潮湿敏感元件被暴露空气中无论何时小于指定的产品失效时间, 干燥包装或安置元件在一个不大于 5% RH 的干燥箱烘焙， 产品失效时间时钟会暂停， 但累计的产品失效时间必须对应在指定的极限。特别是镀 OSP 的 PWBs, 应该被认为具有潮湿敏感性。允许敞开的总时间为 72 个小时, 并且第一次和第二次回流焊接时间之间被限制在 24 小时内。如果超过这时间板子应该按照前述要求进行烘烤。参阅1.3 节 PWBs 的存贮和处理条件。PWB 装配进入像更换 CSP 的主要返修阶段, 应该予先烘干或 WIP 应该被存放在干燥箱或真空袋里。注 3: 返修过程应该与回流焊接一样，因此所有防备措施应该考虑周到， 组装(WIP) 与元件应该是干燥的或那些必须予先被烘烤。1.9 干货存贮条件干燥存贮是潮湿敏感元件的过度时期, 短期存贮和装配(WIP) 在生产线停止和像周末这样的短期暂停期间，如果这些材料没有被防潮袋保护。干燥存贮只意味存贮目的, 不是为了干燥。在双面装配的情况下, 有 OSP 表面精整, 在首次其次焊接的过程之间的时间必须是在指定的极限内，应该包括干燥存储时间。干货存储规格温度25 5 C湿度15 分钟),如果多于锡膏量的 50%要求补充或者在刮刀外区域收集锡膏后应该进行搅拌。512.2 刮刀性质性质规格规格刮刀刀片材料适应高速印刷且有足够的硬度的镀镍或钛的不锈钢。厚度 275 10 m刮刀架角度 (临界参数)60 2.5DEK&MPM 印刷机的刮刀宽度板长由最接近的标准宽度决定锡膏固定器必需调整紧挨丝网表面, 但如果没弹簧支撑，在打印的操作期间固定器不能接触丝网。注: 橡皮刮刀板挠曲强度是一个重要参数测量方法: 二面对切的分度器2.3 丝网性质性质规格规格丝网材料常态聚酯丝网 55T-66T (140-167 网眼/ 英寸), 等效不锈钢接受了互换性的丝网对应的结构可能被使用丝网张力（测量丝网将给错误, 但可表示结果） 在丝网表面上任一点最小 25N/cm丝网开口尺寸变化最大 10 m or 5% 丝网厚度0.10mm 0.01mm丝网材料制造工艺电铸或者激光切割丝网的张力测量在丝网上任何一点所得的拒绝标准25N/cm基准点2x1mm dia sphere etched half-way on stencil2x1mm 球径半部分蚀刻在丝网上安装丝网最大安装厚度/= 25% 理论厚度 (例如. 100m 丝网 l, 安装面积 125m测量方法: 织品张力测量仪, 例如 ZBF Tetkomat, CH-8803 R5uschlikon, 瑞士,传真：。01/724 15 25注: 如果聚酯丝网被使用时应该完成正确的 ESD 防备措施。522.4 支撑台性质性质规格规格原料原料用钢或铝合金制造推荐表面摩擦力大以及兼容 ESD 的材料。支撑台对应丝网支撑台对应丝网最大误差范围 0.2mm支撑台表面光滑度支撑台表面光滑度 0.025mm 两边支撑加工深度两边支撑加工深度元件高度+ 5 mm模块利刃支撑模块利刃支撑( (两边支撑两边支撑) )模块利刃支撑 1.5mm 0.5mm 从边缘朝模块中间, 最大间距在临界区域附近没有支撑为15mm 。支撑台必须是最大区域支撑。支撑台真空孔支撑台真空孔主要位于非可印刷区域和防止真空泄漏印刷面。如果真空能可靠地被限制在 100-200 mbar, 真空协助全区域是可以仔细处理调整的。板校准板校准机械的, 所谓的”硬制动”如果特别是有产品 CSP 器件引脚间距小于 0.5 mm 时必须被使用。2.5 印刷工艺参数（丝网印刷）参数参数设置设置印刷速度10030mm/s 200mm 宽刮刀其压力恒定（印刷头是不固定的，力道可以自动调节）抹网压力+5N 为安全极小的压力, 通常在40 50 N 之间刮刀调整 (恒定的刮刀距离(负) 从PWB 表面算)M 抹网距离+0.5mm 为最小安全调整脱离间隙-0.5 0.0mm 脱板速度在分离阶段期间最大脱板速度保持与支撑台的联系自动抹网率（标准锡膏）在每 10 5 次印刷以后注意：在不一致的情况之下由抹网造的频繁出现临时性技术问题下应用。自动抹网率（无铅）3 6 次锡膏量拇指定则：锡膏滚动直径在 12 mm 20 mm.之间锡膏补给量锡膏补给量为其滚动直径的 12 mm。锡膏再利用在丝网上的锡膏可以移动到其它丝网上或可以存放在干净的塑料瓶子里。锡膏在丝53网上的存放时间一起是 6 个小时。停止时间长于 15 分钟应该用塑料箔长期盖住丝网上的锡膏丝网上的锡膏。如果丝网上的锡膏超过 1 个小时没有被保护,应该报废并更换。拭擦和丝网清洁Multicore Prozone SC-01, Kiwoclean 或同样高燃点溶剂需由印刷机制造商正式地认可。对异丙醇(IPA) 或等效溶剂的用途不负责防火安全原因 。清洗液是用来清洗被错印板和为手工清洁丝网的PWBs 禁止清洗!清洗剂损害 PWB 结构和降低特别是 CSP 器件的结合可靠性。2.6 印刷结果确认印刷结果确认定义在第 3 章工艺控制和监控3 印刷工艺控制和监控3.1 自动光学检测3.2 机器在生产线的位置AOI 系统必须位于在最后的高速贴装机器之间以及根据生产线进行设定,或靠前在 IC 贴装机器之间。在这个阶段所有片式元件被贴装并且大多数关键集成电路锡膏是可见的。考虑误报的要求，AOI 检查必须包括所有元器件被贴装在 AOI 系统之前(0603 片式元件X & Y 偏移量: 220 m偏移量: 15 X & Y 偏移量m: 180 250偏移量 t: 10 30 元器件元器件：X & Y 偏移量: 130 m偏移量: 10元器件元器件：X & Y 偏移量: 120 m 150m 偏移量 8 150.5 mm 引脚间距CSP 锡膏锡膏：X & Y 偏移量: 120 m面积: 35% - 150%桥接: 20%锡膏：锡膏：X & Y 偏移量: 100 m 150m面积: 35% - 180%桥接: 15% - 30%55元器件：元器件：X & Y 偏移量: 120 m偏移量: 10元器件：元器件：X & Y 偏移量: 120 m 160m 偏移量 8 150.4 mm 引脚间距 CSP锡膏：锡膏：X & Y 偏移量: 100m面积: 45% - 150%桥接: 20%锡膏：锡膏： X & Y 偏移量: 100m 150m面积: 35% - 170%桥接: 15% - 30%其他锡膏误差锡膏锡膏：X&Y 偏移量: 150 m面积: 50%-150%桥接: 0.4x 孔径锡膏锡膏：X&Y 偏移量: 100m 200m面积: 35%-200%桥接: 0.3 0.5 x 孔径其他元器件的一般误差X & Y 偏移量: 200 m偏移量: 15 X & Y 偏移量m: 180 250偏移量: 10 30 3.5 能力分析的规格限制下表描述的是研究能力的规格限制值。目的是详细说明多数关键工艺和使用价值在监控优选锡膏印刷机和贴装机器的机器能力的工艺窗口。处理阶段处理阶段规格限制规格限制印刷阶段(275m 孔径)X & Y 公差: 100 m目标 t: Cp1.33 (sigma level 3)片式元件贴装(0402 R &C)X & Y 公差: 150 m目标: Cp1.33 (sigma level 3)IC 贴装(0.5 & 0.4 mm CSP)X & Y 公差: 75 m目标: Cp1.33 (sigma level 3)3.6 吸嘴推荐同种类型的吸嘴大小：0201 (0603)Fuji CP 系列: 0.4 mm 圆形吸嘴 Siplace: 型号 7020402 (1005)Fuji CP 系列: 0.7 mm 圆形吸嘴Siplace: 型号 901 or 925异型器件(连接器, 双工器, 功为了保持贴装速度和准确性通常使用尽量大的56率模块等.)吸嘴 (最小的直径为 5mm /最小面积 20mm )2573.7 飞达高速机器7”带&卷轴是 Fuji.标准。0402 台电阻器和电容器使用 13”卷轴(13” 与纸带, 水泡带不允许使用) ，使用的是 Siplace 13”和 15” 带&卷轴。低速机器13”带&卷轴 是标准, 7” 和 15”也可以使用。棍式和盘式不允许使用。3.8 数控程序0402 的贴装顺序首先给所有小零件装配一般推荐使用高速机器(0402 个电阻器 0.3mm),零件高度是 0.3 0.5 毫米(
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