印制电路板各工序缺陷中英文一览.doc

各工序缺陷中英一览表Inner layer dry/film 内层干菲林Blocking boards卡板Lack copper少铜Inner scrap内层报废Uncomplete tearing film撕膜不净Soft inner内层变软Conductor lift崩线Inner misregistration内层错位Bulge on conductor线路凸位Inner short内层短路Poor conductor线路不良Inner open内层开路Pattern misregistration线路图形歪Inner slight short内层微短Elliptical hole椭圆孔Pressing 压板DRY PLYDRY PLYInner shift内层偏位Tg value out of spec.Tg超出要求Inner hole position incorrect内层歪孔Tg value not meet the requirementTg达不到要求Lay up in reverse排反板Dent凹折The incision length not meet the requirement切割长度达不到要求Measling白斑Board poor cutting切坏板Poor edge板边不良Burnt烧焦Burrs on board edge板边毛刺The resin content lower than the requirement树脂含量低于要求Resin shortage in board edge板边缺树脂Void in resin树脂空洞Fibre in board edge板边纤维丝Dissipation factor beyond criteria损耗因子达不到要求Thin board thickness板薄Make wrong guide hole挑错管位Excess board thickness板厚Thinner copper thickness铜箔偏薄Board out of spec.板厚不合要求Dlamination between surface copper and prepreg铜箔气泡Lamination wrinkles板料布纹Bow and twist out of spec弯曲性超标Lamination blisters板料气泡Dusty and damage污损Rough board surface板面不光滑Absorption beyond criteria吸水性超标Board surface extrusion 板面突起Construction of fiber not meet requirement纤维结构不符要求Dent by pressing board板面压伤Pressing dent压板凹痕Board warp/bow板弯/曲Poor lamination压板不良Board small板小Failed pressure vessel test压力锅测试未达标Protective film too thick or thin保护膜偏厚&偏薄Fracture压伤Delamination爆板Oxide氧化Peel strength under requirement剥离强度未达标Misuse prepreg用错P片Black oxide scratch擦花黑化Laminate misused用错板料Layer structure not meet MI requirement层压结构不符MI要求Misuse inner P/R用错内层P/RPoor dimensional stability尺寸稳定性未达标Misuse Cu coil用错铜箔Delamination/Blister分层/起泡Weave texture织纹显露Poor cutting割板不良Wrinkles皱折痕Guide hole over size管位大孔Marked legend shift字唛打偏Guide pin shift管位钉打偏Marked legend in unit字唛入单元Guide hole shift管位歪孔Stain on board板面污渍Poor black oxide黑化不良Bow板弯Board slip in pressing滑板Copper clad thickness under spec.表面铜薄Foreign material in laminate 基材内异物Copper clad thickness over spec.表面铜厚Joint glue too thick or thin接着剂偏厚&偏薄Drilling wrong guide hole打错管位Unqualified dielectric layer介电层不合格Inner layer cu thickness under spec.内层铜薄Thin dielectric layer thickness介电层偏薄Inner layer cu thickness over spec.内层铜厚Excess dielectric layer介电层偏厚Foreign material in inner layer内层杂物Electronic inductivity beyond standard介电常数未达标Length and width not meet spec.外围尺寸不符合要求Cutting wrong laminate开错料Marking wrong打错字唛Missing guide hole漏打管位Missing marking漏打字唛Missing black oxide漏黑化Poor staff板料不良Exposed/Disrupted fibres露纤维/纤维断裂Poor marking打字唛不良Routing guide hole shift锣偏管位孔Board break板裂Pits麻点The joint of copper foil铜箔接口Inner white spot内层白点Skipping inner-layer少排内层Improper inner layer内层不配套Skipping prepreg少排P片Inner scratch内层擦花Pattern perforation线路穿孔Inner pink ring内层粉红圈Poor mechanical pressing机械压伤不良Inner glue residue内层胶渍Drilling 钻房Broken guide hole打爆管位Hole diameter over size钻大孔Drill bit broken断针Drilling extra hole钻多孔Scrape刮花Drilling in reverse钻反孔Deformed hole孔变形Poor drilling钻孔不良Burrs in hole孔内披锋Drilling un-through 钻不穿Drilling skip漏钻孔Drilling hole misalignment钻歪孔Drilling wrong boards钻错板Hole diameter under size钻小孔Drilling wrong hole钻错孔Hole damaged钻炸孔Tenting hole/Plugging塞孔PTH/PP 沉铜/板面电镀Board surface dent板面凹痕Copper thread in hole孔内铜丝Board surface copper nubbles板面铜粒No copper in hole孔内无铜Board folding and breaking 板折坏Copper in hole（NPTH）孔内有铜(非镀铜孔)Poor plating电镀不良Board damaged by scrubbing 磨坏板The plating thickness not uniform电镀层不均匀Plating copper peel off铜层剥离Rough plating电镀粗糙Wicking 渗铜Hole plugged by plating电镀塞孔Drilling hole failure钻飞孔Burnt board by plating电镀烧板Board scratched by machine机械刮伤Boards-drop into the tunnel缸底板Mechanical drilling hole misalignment机械钻歪孔Burrs on hole-edge孔边毛刺Poor mechanical drilling 机械钻孔不良Rough hole wall孔粗Big hole of mechanical drilling机械钻大孔Hole black孔黑Extra hole of mechanical drilling机械钻多孔Missing hole of mechanical drilling机械钻漏孔Dry/Film 干菲林 Hole breakout崩孔Glue residue胶渍Film scratch擦花菲林Missing PAD漏PADScratching prevent tin擦花锡面Missing date code漏印周期Under developing冲板不净Poor in D/F lamination辘菲林不良Over developing冲板过度Poor exposure曝光不良Broken dry film穿菲林Exposure foreign material曝光垃圾Overlap boards叠板Bleeding copper plating (wicking)渗镀Same location trace open定位断线Peel off D/F甩菲林Short短路Misuse film用错菲林Trace open断线Foreign inclusions杂物Put wrong D/F放错菲林Pin hole针孔Put D/F in reverse放反菲林Unclear date code 周期不清Film wring 菲林起皱Mistake date code用错周期Film in hole菲林入孔Foreign material under film菲林下杂物D/F residue菲林碎Pattern plating & Etching & M/I图电/蚀刻/中检Dishdown碟形凹痕Trace undersize线幼Dirty板污Chemical solution polluting药水Copper residue残铜Lower impedance阻抗偏低Dropped D/F掉菲林Higher impedance阻抗偏高Poor tin plating镀锡不良Resistance out of requirement电阻不合要求Trace broken by clamper夹崩线路Hole knocked down撞崩孔D/F clamping夹菲林Trace shift (by damage)撞歪（断）线Under etching蚀板不净Scrap by machine blocking塞机报废Over etching蚀板过度Mechanical broken trace机械撞断路Unclear etching legend蚀字不清Poor circuit reworking补线不良Thin copper plating铜薄Poor rework修理不良Excess copper thickness铜厚Burned trace open烧断线Film under stripping褪菲林不净SMT PAD undersize锡手指幼Tin under stripping褪锡不净Edge roughness(dull line)线路狗牙Thin tin coating锡薄Trace spacing undersize线隙不足Nicks缺口Boards damaged板损坏W/F 湿绿油Board discolor板黄S/M on SMT PAD绿油上锡手指S/M skipping不过油Foreign material under S/M绿油下杂物Scratch擦花Poor S/M color绿油颜色不良Damaged by pin pressing钉床压伤Poor scrubbing磨板不良Weave exposure基材白点Solder mask bleeding 渗油Board poor baking焗坏板Hand print手印Expose cu in hole孔内露铜Solder mask peel off 甩油Exposed conductors露线Over micro-etching微蚀过度S/M skip漏印绿油S/M on PAD绿油上焊盘S/M uneven绿油不匀Missing boards遗失板S/M under developing绿油冲不净Misuse W/F net用错W/F网Solder mask misregistration绿油偏位S/M thickness under spec.油薄Solder mask blistering绿油超泡Solder mask over developing绿油冲过度Solder mask wrinkles绿油起皱Misuse solder mask用错油墨Solder mask in hole绿油入孔S/M thickness over spec.油厚S/M on gold finger绿油上金手指C/M 白字C/M in hole字符入孔Plugging hole shift塞偏孔C/M on PAD字符油上焊盘Unclear trademark商标不清Mark Illegible字符不清Double C/M 双重白字Legend dissolved字符溶解Poor carbon ink碳油不良Carbon ink on board板面有碳油Carbon ink short碳油短路Broken ink爆油Carbon ink saw-tooth shaped碳油狗牙Yellow C/M in hole黄油入孔Missing print C/M印错字符Peelable mask in hole蓝胶入孔Misuse black oil net印错黑油网Missing plug hole漏塞孔Wrong trademark印错商标Missing C/M漏印字符Askew C/M印歪字符S/M blocking hole绿油塞孔Misuse C/M net印错字符网Poor plug hole塞孔不良Exposed conductor露导体Illegible legend字符残缺Carbon ink peel off甩碳油Carbon ink bleeding 渗碳油C/M peel off甩字符Return cycle print返印周期Misuse carbon ink net用错碳油网Solder powder锡粉HAL 喷锡Scratching solder legend擦伤锡字Solder thickness over spec.锡厚Dent in gold finger金手指凹痕Solder thickness under spec.锡厚度不足Scratching gold finger金手指擦花Gray solder锡面灰Expose cu on gold finger金手指露铜Tin blocking hole锡塞孔Solder on gold finger金手指上锡Line peel off线路剥离Dirty hole孔灰Solder on trace线路上锡Poor melting熔锡不良Solder on S/M板面上锡PAD peel off甩焊盘Non-wetting不上锡Copper peel off甩铜Solder whiten锡白Solder peel off甩锡Solder surface roughness锡面粗糙Excessive solder 锡高Solder thread in hole孔内锡丝Dewetting缩锡Undersized hole孔细SMT PAD damaged损坏锡手指Rust solder锈色G/F plating & Immersion gold 金手指电镀&沉金Gold burnt in plating电镀烧金Gold bleeding渗金Poor gold plating镀金不良Water residue水渍印Poor Ni plating镀镍不良Poor gold stripping褪金不良Gold plating skip漏镀金White hole edge孔边发白Ni plating skip漏镀镍 No gold in hole孔内无金Ni thickness under spec.镍薄Gold on guide hole管位孔上金Gold on trace线路上金Gold or Ni peel off甩金镍Ni or gold skipping SKIPWatercolor printing水纹印Gold on the edge板边有金Chemical solution on gold surface药水上金面Poor gold immersion沉金不良Rough G/F金手指粗糙Gold whiten金白G/F damaged金手指损坏Gold thickness under spec.金薄Ni spot on board surface板面镀上镍 Poor gold color金颜色不良Nodule on G/F金手指有突出块Pin hole on G/F金手指针孔Profiling 外形加工Poor V-cutV坑不良Board damaged by punching啤坏板Too shallow V-cutV坑过浅Damage G/F by punching啤坏金手指Excess depth of V-cutV坑过深Damage board by model啤模压伤V-cut shiftV坑偏位Double V-cut双重V坑Dimension not meet requirement尺寸不合要求Out of upper tolerance外围偏大Missing V-cut漏V坑Out of lower tolerance外围偏小Miss routing board漏锣板Poor bevel斜边不良Miss punching boards漏啤板Board cracked by punching啤爆板Poor routing edge锣边不良Bevel edge over size斜边偏大Board damaged by routing锣坏板Bevel edge under size斜边偏小Poor punch啤板不良Missing slot hole漏SLOT孔Hole cracked by punching啤爆孔Missing routing G/F bevel edge漏锣G/F斜边Damaged board烂板Miss routing hole漏锣孔Measling after punching啤后有白点Miss punching hole漏啤孔Rouging board scrapped by machine 机械锣坏板Outdated boards周期过期Others 其它Unclear E-TE-T印不清Outdated boards过期板Damaged edge板边损坏Old boards(stocked boards旧板(存仓板)Damaged corner板角损坏Old boards (customers clean board)旧板(客清板)Dent by E-Test电测压伤Customer returned boards客户退货Broken board断板Collected mantissa boards清尾数板Missing E-T stamp漏盖E-T印Wrong REV做错REVOut of inner scraps超出内层报废ME trialME试验Old REV旧REVPE scrapPE报废Receive extra order接多单QA trialQA试验PPC changed revisionPPC转版本ME take boardME取板PE take boardPE取板Overdue prepreg过期P片QA take boardQA取板Prepreg brokenP片折裂PMC take boardPMC取板Black yarn黑纱Return to material vendorRTV物料供应商Black spot黑点Return to machine vendorRTV机器供应商Prepreg wrinkleP片折痕Return to subcontractorRTV外发供应商Resin