Expanded uncertainty (mm) MMC = 0.040, Camera = 0.104, Exascan = 0.230, CT = 0.295 and Atos = 0.025.doc

Automated contract time determination system for highway projectsOriginal Research ArticleAutomation in Construction, Volume 18, Issue 7, November 2009, Pages 957-965Hyung Seok Jeong, Siddharth Atreya, Garold D. Oberlender, BooYoung ChungShow preview| Purchase PDF (761 K) | Related articles|Related reference work articles 6174D dynamic construction management and visualization software: 1. DevelopmentOriginal Research ArticleAutomation in Construction, Volume 14, Issue 4, August 2005, Pages 512-524K.W. Chau, M. Anson, J.P. ZhangShow preview| Purchase PDF (914 K) | Related articles|Related reference work articles 618Impact life prediction modeling of TFBGA packages under board level drop testOriginal Research ArticleMicroelectronics and Reliability, Volume 44, Issue 7, July 2004, Pages 1131-1142Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei ZhongClose preview| Purchase PDF (486 K) | Related articles|Related reference work articles AbstractAbstract | Figures/TablesFigures/Tables | ReferencesReferences AbstractReliability performance of IC packages during drop impact is critical, especially for handheld electronic products. Currently, there is no model that provides good correlation with experimental measurements of acceleration and impact life. In this paper, detailed drop tests and simulations are performed on TFBGA (thin-profile fine-pitch BGA) and VFBGA (very-thin-profile fine-pitch BGA) packages at board level using testing procedures developed in-house. The packages are susceptible to solder joint failures, induced by a combination of PCB bending and mechanical shock during impact. The critical solder ball is observed to occur at the outermost corner solder joint, and fails along the solder and PCB pad interface. Various testing parameters are studied experimentally and analytically, to understand the effects of drop height, drop orientation, number of PCB mounting screws to fixture, position of component on board, PCB bending, solder material, etc. Drop height, felt thickness, and contact conditions are used to fine-tune the shape and level of shock pulse required. Board level drop test can be better controlled, compared with system or product level test such as impact of mobile phone, which sometimes has rather unpredictable results due to higher complexity and variations in drop orientation. At the same time, dynamic simulation is performed to compare with experimental results. The model established has close values of peak acceleration and impact duration as measured in actual drop test. The failure mode and critical solder ball location predicted by modeling correlate well with testing. For the first time, an accurate life prediction model is proposed for board level drop test to estimate the number of drops to failure for a package. For the correlation cases studied, the maximum normal peeling stresses of critical solder joints correlate well with the mean impact lives measured during the drop test. The uncertainty of impact life prediction is within 4 drops, for a typical test of 50 drops. With this new model, a failure-free state can be determined, and drop test performance of new package design can be quantified, and further enhanced through modeling. This quantitative approach is different from traditional qualitative modeling, as it provides both accurate relative and absolute impact life prediction. The relative performance of package may be different under board level drop test and thermal cycling test. Different design guidelines should be considered, depending on application and area of concern.Article Outline1. Introduction2. Drop test procedures3. Drop test simulation4. Acceleration curve during impact5. Relative comparison of modeling and testing6. Impact life prediction model7. Analysis of drop test results 7.1. Effect of component position7.2. Effects of drop orientation7.3. Effect of package type: TFBGA46 vs. VFBGA467.4. Effect of number of screws mounted on PCB7.5. Effect of PCB bending7.6. Effect of solder material8. Extended simulation analysis 8.1. Effect of drop height8.2. Effects of PCB size and shape8.3. Effect of flatness of contact surface8.4. Effect of mass-scaling8.5. Effect of element size9. ConclusionsAcknowledgementsReferences626Simulation of electron spin resonance spectroscopy in diverse environments: An integrated approachOriginal Research ArticleComputer Physics Communications, Volume 180, Issue 12, December 2009, Pages 2680-2697Mirco Zerbetto, Antonino Polimeno, Vincenzo BaroneShow preview| Purchase PDF (2163 K) | Related articles|Related reference work articles 627Signaling new product introduction delays: Determinants of clarity of delay-duration announcementsOriginal Research ArticleIndustrial Marketing Management, In Press, Corrected Proof, Available online 22 December 2010Hsuan-Hsuan Ku, Chiu-Chen Huang, Chien-Chih KuoShow preview| Purchase PDF (333 K) | Related articles|Related reference work articles Research HighlightsWe examine the determinants of clarity of delay-duration announcements. Competitive equity building has a positive effect on signal clarity. All product-related factors have negative effects on signal clarity. Perceived competitive elasticity has a negative effect on signal clarity.628Integrated coastal management and marine protected areas in the Philippines: Concurrent developmentsOriginal Research ArticleOcean & Coastal Management, Volume 48, Issues 11-12, 2005, Pages 972-995Miriam C. BalgosShow preview| Purchase PDF (311 K) | Related articles|Related reference work articles 629A computational tool for the simulation and optimization of microbial strains accounting integrated metabolic/regulatory informationOriginal Research ArticleBiosystems, Volume 103, Issue 3, March 2011, Pages 435-441Paulo Vilaa, Isabel Rocha, Miguel RochaShow preview| Purchase PDF (945 K) |Supplementary content| Related articles|Related reference work articles 630Respecting the human needs of students in the development of e-learningOriginal Research ArticleComputers & Education, Volume 40, Issue 1, January 2003, Pages 57-70Moti Frank, Nurit Reich, Keith HumphreysShow preview| Purchase PDF (139 K) | Related articles|Related reference work articles 631Applying security policies through agent roles: A JAAS based approachOriginal Research ArticleScience of Computer Programming, Volume 59, Issues 1-2, January 2006, Pages 127-146Giacomo Cabri, Luca Ferrari, Letizia LeonardiShow preview| Purchase PDF (1673 K) | Related articles|Related reference work articles 632Process improvement for small firms: An evaluation of the RAPID assessment-based methodOriginal Research ArticleInformation and Software Technology, Volume 48, Issue 5, May 2006, Pages 323-334Aileen Cater-Steel, Mark Toleman, Terry RoutShow preview| Purchase PDF (155 K) | Related articles|Related reference work articles 633HipMatch: An object-oriented cross-platform program for accurate determination of cup orientation using 2D3D registration of single standard X-ray radiograph and a CT volumeOriginal Research ArticleComputer Methods and Programs in Biomedicine, Volume 95, Issue 3, September 2009, Pages 236-248Guoyan Zheng, Xuan Zhang, Simon D. Steppacher, Stephen B. Murphy, Klaus A. Siebenrock, Moritz TannastShow preview| Purchase PDF (3133 K) | Related articles|Related reference work articles 634Data fusion to improve trajectory tracking in a Cooperative Surveillance Multi-Agent ArchitectureOriginal Research ArticleInformation Fusion, Volume 11, Issue 3, July 2010, Pages 243-255Federico Castanedo, Jess Garca, Miguel A. Patricio, Jos M. MolinaShow preview| Purchase PDF (1654 K) | Related articles|Related reference work articles 635An organizational approach to undoing gender: The unlikely case of offshore oil platformsReview ArticleR