NOTEBOOK设计流程.doc

NOTEBOOK DESIGN FLOW INTRODUCTION1.簡述notebook common parts?Notebook parts 包括: Key part: LCD (12.1”, 13.3”, 14.1”15, 17), CPU, HDD, CD-ROM/DVD-ROM/COMBO, FDD, Glide Pad, Battery, AC Adapter, SDRAM/DDR, Keyboard, FAX Modem, LAN, Antenna etc. Plastic: LCD bezel, LCD cover, LCD base/bezel lens, Latch, cable box, K/B cover, bottom cover, palm-rest, top cover, glide pad button, PCMCIA door, battery latch, DIMM/Dram cover, MINI PCI cover, hinge cover etc. Metal: Thermal,hinge/ hinge support, FDD bracket, HDD plate/shielding, CD-ROM bracket, G/P bracket, modem jack plate, I/O bracket, bottom plate etc. Cable: FPC, FFC, coaxial cable, wire cable PCB: CD control board, sound/audio board, LED-SW board, main board, DC board SUB board etc. Others: screw, mylar, hex/bolt, rubber, gasket,spring connector.2.Notebook common function 有哪些?l USB和IEEE1394為兩種標準外設接口l Modem jack用于上internet網絡l LAN jack用于連接局域網l Serial port為串口,可連接串口鼠標等串口設備l FDD為軟驅,可讀取3”軟盤資料l CD-ROM為光驅,可讀取VCD,CD等格式光盤l VGA用于外接顯示器l TV OUT用于外接電視機l Parallel port為並口,連接printerl Ps/2接口用于連接ps/2接口鼠標l DC IN接口用于DC輸入l Line in接口用于音頻輸入l SPDIF接口用于光纖傳輸l PCMCIA為 擴展功能卡接口,可提供memory, HDD, madem/fax, lan等功能l Blue tooth module為無線傳輸模塊 Speaker box為音箱3.R&D 開發流程?Customer,sales or Marketing requestNew project Kick offW/S (working sample)E/S (engineering sample)T/R (trial run)P/R (pilot run or pre-production)ATSM/P (mass production)b).New project kick-off control marketing specification master schedule configuration allocation table project organization chart key parts list with schedule & phase-in plan all PM document signed by team leader PM officially hole kick-off meeting after all signed document are ready.c).Design phase control: circuit review layout review M/E drawing review Mockup reviewWorking sample phase control: Sample quantity request: Mockup:12 sets. PCB: 510sets Working sample for R/D debug and review All material prepared by R/D (Assembly by R/D site)d).E/S (Engineering Sample) phase control Sample quantity request: Soft tooling: 12 sets PU mold sample:20 sets E/S sample for R/D debug and review All material prepared by R/D.(Assembly by R/D site)e).T/R (Trail Run) phase control: Sample quantity request: 60sets(tooling sample) T/R sample for debug, review and DVT testing use All material prepared by R/D (Assembly by factory site) T/R start criteria: H/W, Power, M/E EVT test finished. EMI/ESD E/E solution finished Component thermal solution finished No H/W bug confidence level:90%.f).P/P(Pilot Run) phase control Sample quantity request:For IRT:100150 setsOther: 150250 sets P/P sample for IRT and others All material prepared by factory site P/P start criteria: factory production line testing programs test OK in SIT no stop shipping bugs w/o solution exist in PAL/DFM/Customer bug list Stop shipping bugs list is issued by PM/PA/Sales/QA/PE.4.ME design flow: PM release spec ID fixed(3 weeks) PCB fixed(24 days) component final(15 days) Mock-up final(3days) tooling start(50 days) T1(15days) T2(10days) Tn pilot run Mass Production1. Project Master schedule readmap summary.a. Name summary.FS: Function Spec.PS: PCB Size.Cd: Component Drawing Fin.TS: Hard Tooling Start. MK: Mock-up Ready.St: Soft Tooling Complete.Tn: Tooling Try Out X.ATS: Authorize To Ship.WS: Working SPL Ready.ES: Engineer SPL Ready.TR: Trial Run SPL Ready.PP: Pilot Run SPL Ready.MP: Mass Production Start.b. Schedule request.2. ME schedule process.a. When is the project start.Base on ME view, function spec. fix and keyparts list release and ID fix are ME start.b. Whats the project key point.ME. Review point(Cd/MK/T1).Cd-review (drawing/design) issue.MK-review (design/assembly/tooling) issue.T1-review (assemble/tooling/produce) issue.c. Stocking timing (TR, PP, MP).d. When is project finish?ME part approvaled.BOM release.Exploded diagram release Issue clear(DFM/PAL/PPR/CLCA).e. Time that co-work with other dept(ID,HW,SW,EMI,PA Factory).Refer master schedule.5.Sample test phase有哪些? 1. Test name phase PIC DOC l EVT test WS/ES R&D EVT rep