PCB工程部专业英语词汇.doc

PCB 工 程 部 专 业 英 文 词 汇 词汇1. 板料: material2. 最低限度: minimum 或者min.3. 最大限度: maximum 或者max.4. 基准点(零点) datum point5. 周期 Date code6. V-cut余厚 V-cut remain thickness7. 抢电铜皮（假铜） dummy copper8. 实物板 actual board9. 外形及尺寸错误 dimension error10. 异常情形 error data file11. 焊锡面与零件面对位偏差 misregistration12. 孔塞 plug hole13. 要求 requirement14. 缺少 miss15. 偏公差 uneven tolerance16. 补偿 compensation17. 表面处理 surface treatment18. 无铅喷锡 Lead free HAL19. 金手指斜边 bevel of G/F20. 制程能力 process capability21. 建议,暗示 suggest22. 确保 ensure23. 满足,达到 meet24. 为了 in order to25. 交货期 delivery date26. 绿油桥 solder mask bridge 或者 solder mask dam27. 根据 according to28. 单边3mil per side 3 mil29. 直径 diameter30. 半径 radius31. 小于3mil less than 3mil32. 高于3mil more than 3 mil33. 压合结构 stacking structure 或者stack_up34. 附件：attached file35. 样品：sample36. 文档：Document37. 答复：answer; reply38. 规格：spec39. 与.同样的：the same as 40. 前版本：previous version(old version)41. 生产：production42. 确认：confirm43. 再次确认：confirm again44. 工程问题：engineering query（EQ）45. 尽快：as soon as possible46. 生产文件：production Gerber47. 联系某人：contact somebody48. 提交样板：submit sample49. 交货期：delivery date50. 电测成本：ET（electrical test）cost51. 通断测试：Open and short testing52. 参考：refer to53. IPC标准：IPC standard54. IPC二级：IPC class 255. 可接受的：acceptable56. 允许：permit57. 制造：manufacture 或者 fabricate58. 修改：revision59. 公差：tolerance60. 忽略：ignore61. 工具孔：tooling hole62. 安装孔：mounting hole63. 元件孔：component hole64. 槽孔：slot hole65. 邮票孔：snap off hole 或者stamp hole66. 导通孔：via hole67. 盲孔： blind via hole68. 埋孔：buried via hole69. 金属化孔：PTH(plated through hole)70. 非金属化孔：NPTH( no plated through hole)71. 孔位：hole location72. 避免：avoid73. 原设计：original design74. 修改：modify75. 按原设计：follow up original design76. 附边：waste tab, waste area 或者breakaway tab77. 铜条：copper strip78. 拼板：panel drawing79. 板厚：board thickness80. 删除：remove(delete)81. 削铜：shave the copper82. 露铜：copper exposure 或者exposed copper83. 光标点: fiducial mark84. 不同：be different from(differ from)85. 内弧：inside radius86. 焊环：annular ring87. 单板尺寸：single size88. 拼板尺寸：panel size89. 铣,锣：routing90. 铣刀：router 或者Routing bit91. 楔形掏槽 V-cut 或者V scoring92. 哑光：matt93. 光亮的：glossy94. 锡珠：solder ball(solder plugs)95. 阻焊：solder mask(solder resist)96. 阻焊开窗：solder mask opening97. 单面开窗：single side mask opening98. 补油：touch up solder mask99. 补线：track welds100. 毛刺：burrs101. 去毛刺：deburr102. 镀层厚度：plating thickness103. 清洁度：cleanliness104. 离子污染：ionic contamination105. 阻燃性等级：flammability retardant rating106. 黑化：black oxidation107. 棕化：brown oxidation108. 红化：red oxidation109. 可焊性不良：poor solderability110. 焊料：solder111. 包装：packaging112. 角标：corner mark113. 特性阻抗：characteristic impedance114. 正像：positive115. 负片：negative116. 镜像：mirror117. 线宽：line width 或者trace width118. 线距：line spacing 或者 trace spacing119. 做样：build sample120. 按照：according to121. 成品：finished122. 做变更：make the change123. 相类似：similar to124. 规格：specification125. 下移：shift down126. 垂直地：vertically127. 水平的：horizontally128. 增大：increase129. 缩小：decrease130. 表面处理：Surface Finishing131. 波峰焊：wave solder132. 钻孔数据：drilling data133. 标记：Logo134. Ul 标记：UL logo,或者Ul Marking135. 蚀刻标记：etched marking136. 周期：date code137. 翘曲：bow and twist138. 外层：outer layer 或者 external layer139. 内层：inner layer 或者 internal layer140. 顶层：top layer141. 底层：bottom layer142. 元件面：component side143. 焊接面：solder side144. 阻焊层：solder mask layer145. 字符层：legend layer (silkscreen layer or over layer)146. 兰胶层：peelable SM layer147. 贴片层：paste mask layer148. 碳油层：carbon layer149. 外形层：outline layer(profile layer)150. 白油：white ink151. 绿油：green ink152. 喷锡：hot air leveling (HAL)153. 电金,水金：flash gold154. 插头镀金：plated gold edge-board contacts155. 金手指：Gold-finger156. 防氧化：Entek (OSP)157. 沉金：Immersion gold (chem. Gold)158. 沉锡：Immersion Tin(chem.Tin)159. 沉银：Immersion Silver (chem. silver)160. 单面板：single sided board161. 双面板：double sided board162. 多层板：multilayer board163. 刚性板：rigid board 164. 挠性板：flexible board165. 刚挠板：flex-rigid board166. 铣：CNC (mill , routing)167. 冲：punching168. 倒角：beveling 169. 斜面：chamfer170. 倒圆角：fillet171. 尺寸：dimension172. 材料：material173. 介电常数：Dielectric constant174. 菲林：film175. 成像：Imaging176. 板镀：Panel Plating177. 图镀：Pattern Plating178. 后清洗：Final Cleaning179. 叠层：stacking structure (stack-up)180. 污染焊盘：contaminate pad181. 分孔图：drill chart 或者drill map182. 度数：degree183. 被覆盖：be covered with184. 负公差：minus tolerance185. 标靶盘： target pad186. 外形公差：routing tolerance187. 芯板：core188. 半固化片 Prepreg189. 阻抗线：impedance trace190. 评估 estimate191. 玻纤显露 Fiber Exposure192. 底铜 base copper193. 工作搞 working Gerber194. 原稿 original art work195. 放宽 relax196. 挖空 blanking 或者 cut-out197. 一般性阻焊油墨 general resist ink198. 孔位错误 mis hole location199. 压合周期 press cycle200. 毛边 serrated edges201. 跳印 skip printing202. 气泡 blistering203. 隔离焊盘 isolated pad204. 泪滴 tear drops205. 箭头 arrows206. 加大 Enlarge207. 压合周期 press cycle208. 毛边 serrated edges209. 跳印,漏印 skip printing210. 宽度与厚度的比值 width-to-thickness ratio211. 调整 adjust212. 铜箔基板 copper claded laminates213. 线路露铜 copper exposure214. 孔内异物 dirty hole215. 椭圆形 elliptical set216. 纤维突出 fiber protrusion217. 填充料 filler218. 互相连通 interconnection219. 改善方案 implementation220. 板料使用率 material use factor221. 回路,网络 network 222. 缺口 nick223. 氧化 oxidation224. 剥离(剥落) peeling off225. 补线不良 poor touch-up226. 品质等级 quality classification227. 对位孔 registration228. 拒收 rejectable229. 树脂含量 resin content230. 排列电阻 resistor network231. 锣刀（铣刀） routing bit232. 孔内沾文字 S/L on hole233. 孔内绿漆 S/M on hole234. 线路沾锡 solder on trace235. 金手指沾锡 solder on G/F236. 废框 scrap237. 封孔处理 sealing238. 间距不足 spacing non-enough239. 靶位孔 target hole240. 测试线路 test circuit241. 热应力试验 thermal stress242. 厚度分布 thickness distribution 243. 薄基板,内层板 thin core244. 线路缺口及针孔 track nick & pin hole245. 裁切线 trim line246. 真平整 true leveling247. 真正位置的孔 true position248. 万用型 universal249. 气化室 vaporizer250. 仓库 warehouse251. 契尖角 wedge angle252. 线细 width reduce253. 良率 yield254. 渗铜,渗入,灯芯效应 wicking255. 允收 acceptable256. 试样点 coupon location257. 经核准的，被认可的 approved258. 超越胜过,超过其他 exceed259. 牛皮纸 kraft paper 260. 孔壁破铜 Hole void 261. 孔位破出 Hole breakoutPCB生产经典流程英文培训教程A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F)c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4