零件MSD标准ppt课件

CelesticaAsia GenericIntroduction MoistureSensitiveDevice MSD ProcessControlPurpose空气中的水分會通過滲透進入一般性包裝材料 利用表面裝貼技術將SMD物料焊接到PCB過程中 SMD物料會接触到超過200 C的高溫 高溫回流時 濕气迅速膨脹 材料配合不當以及材料表面降級會使SMD物料斷裂和分層 MSD控制指對不同潮濕等級的MSD物料的搬運 包裝 運輸和使用進行標準方法控制 以免物料受潮而高溫回流導致优率及可靠性下降 ProceduresSitesarerequiredtoconformtothespecificationsofJ STD 033AandbeawareoftheinformationcontainedinJ STD 020C CELESTICA ThefollowingproceduresaredescribedinthisdocumentandrepresentthebasicprocessesthatshallbemaintainedandcontrolledforMSD s 1 ReceivingInspection2 Storage CelesticaAsia GenericIntroduction 3 postExposuretoFactoryAmbient4 BoardRework5 Reuseofmaterial6 AuditRequirementsReferenceDocofCELESTICAJ STD 033A AjointstandarddevelopedbytheJEDECandIPCabouthandling Packing shippingandUseofMoisture ReflowSensitiveSurface 由JEDEC和IPC共同制定的有关潮湿敏感SMD物料的搬运 包装 运输和使用标准J STD 020 MoistureSensitivityClassificationforNon hermeticSolidStateSurfaceMountDevices 非密封固态SMD装置的湿敏性分类 ReferenceDocofCDGCELQ 029 PROC 510HandlingProcedureForDryPackingComponent干燥包装物料的操作程序CELQ 029 PROC 56ProcedureforICs PCBsandPCBAsMoistureControlandBaking MSD物料 PCB PCBA的焗烤和湿度控制的工序 CelesticaAsia ScopeforMSDIC BGAhandling packing shipping useIC搬運 包裝 運輸和使用J STD 033AAssemblyprocesses massreflow localizedheating boardrework 高溫回流 局部加热 PCBA返工 有關術語和定義MSD MoistureSensitiveDevices潮濕敏感裝置SMD SurfaceMountDevice表面裝貼裝置 Active Desiccant干燥劑HIC HumidityIndicatorCard濕度指示卡MBB MoistureBarrierBag防潮袋FloorLife允許暴露時間ShelfLife保存期限MSL MoistureSensitivityLevel潮濕敏感等級RH relativehumidity相對濕度相對濕度是指在特定溫度下空氣中的水氣相對這個溫度下空氣所能包含的最大水氣量的比率 用百分比表示 GenericIntroduction CelesticaAsia KeyRequirements ReceivingInspectionPurposeComponentsshallbereceivedinacontrolledenvironmentforTemperatureandHumiditywithproperidentification ProcedureComponentsmustbereceivedinthefollowingmanner 1 DrypackedSMDpackagesshouldbeinspectedforabagsealdatelocatedonthecautionorbarcodelabel 2 MBB desiccant HIC MSDLabelshallconformtoJ STD 033A TheMBBshallhaveaMoistureSensitiveIDandMoistureCautionlabelaffixedtotheoutsideortothelowestlevelshippingcontainer Figure1 3 TheHICshouldbereadimmediatelyuponremovalfromtheMBB Ifthe5 RHdotispinkandthe10 RHdotisnotblue theSMDpackageshavebeenexposedtoanexces sivelevel CelesticaAsia FlowchartinCDG KeyRequirements CelesticaAsia Procedure IQC检查来料 召集ME QA PROD PROG TE MP等部门召开MRB会议 确定哪些物料可以继续再用 哪些物料需要重新Baking 哪些物料必须Reject给供应商 可继续再用的物料贴上UAI标签 IQC 图1 HIC超标的物料帖上SROT RWK标签 IQC 设立相应的MRR号并存入MRB 图2 生产部要Baking的物料贴上SpecialHandling标签 IQC 此标签主要是对该物料Baking的要求 图3 生产部Baking完后 贴上一个焗炉标签 PROD 图4 2 生产部Baking 开MRB会议 主要确定的项目 规则和流程 标签填法 图片 主要是那些COMP在用干燥箱和焗炉 KeyRequirements 图1 图2 图3 图4 CelesticaAsia IQC检查合格后贴上UAI标签 MRB会议确定必须Reject给供应商的物料贴上RTV标签 IQC 并存入MRB内 图5 图5 CelesticaAsia KeyRequirements StoragePurposeComponentsshallbereceivedinacontrolledenvironmentforTemperatureandHumiditywithproperidentification ProcedureThefollowingproceduresarecoveredonthefollowingpages 1 DryCabinetstorage2 DryPackstorageTable1outlinestheattributesofthedifferentstoragemethods CelesticaAsia Storage DryCabinetPurposeDrycabinetsusedtostorecomponentsshallcontroltheTemperatureandHumidityofthespacewithinconsistently Procedure1 DrycomponentsandpackagingmaterialifnecessaryasdefinedinDryingsection 2 PlacedrycomponentsincabinetmaintainingRHofnomorethan5 RH ComponentsmaybeexposedorsealedinaMBB 3 LogtheDateandTimecomponentisplaceinthecabinetorplaceaMSDcontrollabel tagonthecomponentpackaging 4 Temperaturewithinthecabinetshallbecontrolledto 30 C INCDG 35 85 RH12 27 KeyRequirements CelesticaAsia McDry干燥箱RefDoc CELQ 052 MPI 1907 DongguanMPIDL 1 打开包装的物料 1 如果在一个小时内用完 只需真空包装 2 如果超过暴露时间用完 就必须重新Baking 3 濕敏水平為2至4的元件 如果暴露時間不超過12小時 最少需要暴露時間的5倍的时间去干燥 这要求儲存的濕度條件不可高于10 RH 4 濕敏水平為5至5a的元件 如果暴露時間不超過8小時 最少需要暴露時間的10倍的时间去干燥 这要求儲存的濕度條件不可高于5 RH KeyRequirements RH顯示器 CelesticaAsia CDG的3个主要湿度控制表 CelesticaAsia KeyRequirements Storage DryPackPurposeDrypackingshallbeperformedconsistentlytocontroltheTemperatureandHumidityWithintheMBB Procedure1 DrycomponentsandpackagingmaterialifnecessaryasdefinedinDryingsection 2 PlacethecomponentsintoaMBB 3 PlacetherequiredamountofdesiccantintotheMBB 4 PlaceaHICintotheMBBwiththecomponents EnsureHICisnotplacedontopofthedesiccant 5 RemoveanyexcessairfromtheMBBbygentlypressingthebagtowardstheopeningasclosetothecomponentsaspossible Usingvacuumpriortosealingisoptional 6 SealtheMBBusingtheheatsealer Sealthebagclosetotheopeningofthebagtoallowspaceforsubsequentsealing VacuumPacker 真空包装机 RefDoc CELQ 029 MPI 850 DongguanMPIDL 1 7 Inspectsealforanyairleaks 8 PlaceorupdateexistingMSDcontrollabel tagontheMBB 9 Storethedrypackinambientconditions 40 C 90 RH FloorlifeFloorlifearealways24hrsforallcomponentsexceptlevel6 1 2 除Level6 1 2外所有MSD零件的FloorLifeCDG均定為24小時 SMDpackagesclassifiedasLevel6mustbedriedbybaking thenreflowedwithinthetimelimitspecifiedonthelabel Level6用之前必須焗CDGhavenofloorlifelimitforLevel1 2 CDG對Level 2沒有floorlife限制 CelesticaAsia KeyRequirements Attention1 Moisturesensitiveitemsclassifiedatlevels2athrough5ashouldbepackagedinhermeticallysealedbarriermaterialswithdesiccants ThecomponentsmustbedriedpriortobeingsealedinMBB 2 SMDpackagesclassifiedasLevel6mustbelabeledanddriedbybaking thenreflowedwithinthetime 3 TablebelowdetailsdrypackingrequirementsfordifferentMSLdevices CelesticaAsia KeyRequirements 4 CarriermaterialsthatareplacedintheMBBcanaffectthemoisturelevelwithintheMBB Therefore theeffectofthesematerialsmustbecompensatedforbybakingor addingadditionaldesiccantintheMBB postExposuretoFactoryAmbientIfcomponentsarewithlevel1orlevel2 theexposuretimeisnotaconcern Ifexposurenotgreaterthan1hr floorlifeclockcanstop Ifcomponentsarerebaggedusingtheoriginalpackingmaterialsthisshouldbedonewithin30minutesaccordingtoJ STD 033A Ifexposurenotgreaterthan8hrs aminimumdesiccatingperiodof10XbydrypacktheexposuretimeisrequiredtodrytheSMDpackagesenoughtoresetthefloorlifeclock Ifcomponentswithlevel2aor3exposedforanytimelessthantheirfloorlife thefloorlifeclockcanstopusingdrypack Ifexposuregreaterthan8hrsandlessthanitsfloorlife 24hrs thecomponentsshouldbereflowedpriortothefloorlifeorotherwisemustbere bakedanddrypacked reflowedpriortothefloorlifeorotherwisemustbere bakedanddrypacked 如暴露超過8小時小于 小時 須在24小時里reflow完 否則要Re bake再包裝 Ifexposuremorethanitsfloorlife 24hrs thecomponentsmustbebaked48hrsat125C priortoreflowordrypack 若暴露超過24小時 則reflow或干包裝前一定要焗 小時 can tbeused 超過儲存期限的物料用之前須檢查 CelesticaAsia KeyRequirements Ifexposuremorethanitsfloorlife 24hrs thecomponentsmustbebaked48hrsat125Cpriortoreflowordrypack BoardReworkIfanycomponenttemperatureexceeds200 C theboardmustbebakeddrypriortoreworkand orcomponentremoval Ifdonotneedtoreusethesuspecteddefectivepartorperformancefailureanalysisthenbakingtheboardisnotrequired BakedurationofPCBAisbasedonthecomponenttoberemoved PCBAreworkflowchart CelesticaAsia KeyRequirements WORKDESCRIPTION IC PCB和PCBA的焗爐指示RefDoc CELQ 029 MPI 1426DongguanMPIDL 11 IC預焗方法根據IC的焗爐溫度設定值 選擇可承受此溫度的導電管或盤 將電子元件平放在導電的管上或盤上進行焗爐 焗完的電子元件必須作防潮包裝以备用 2 PCB預焗方法對於PCB 將電路板放在層架上 每疊之間及與焗爐內壁最小留2吋空間以便疏氣 對除Matrox產品之外的所有PCB 每疊的高度最大2吋 如沒有足夠的PCB層疊 可把重物壓在電路板上 以避免電路板焗板後拗曲 對于Matrox產品所有PCB 每疊的高度最大1吋 而且需放置重物壓在電路板上以避免電路板焗板後拗曲 對于Matrox需要特别Rework的產品 每疊的高度最多是4块PCB重叠放置 而且需放置重物壓在電路板上以避免電路板焗板後拗曲 焗完的電路板必須於24小時內進行回流 否則要作防潮包裝 CelesticaAsia 3 PCBA預焗方法對於PCBA 將電路板放在層架上 不可層疊 電路板之間最小留1吋空間以便疏氣 對於已裝配電路板PCBA 在出烘爐時 生產部需要在已裝配電路板PCBA的流程卡上邊蓋上 B 印和寫下出爐的日期和時間 它們一定要在24小時之內進行加熱進行零件翻修 否則需要再一次烘板 ICs和PCBA的焗爐參數設定PCB的焗爐參數設定 CelesticaAsia CDGMSDLabel ReuseofmaterialPurposeDryPackingmaterialsmayberecycledorreusedtoreducecosts ProcedureDesiccant HICandMBBcanberecycledaccordingtomanufacturer sinstructions ReuseofDesiccants1 J STD 033ArequiresthatdesiccantsshallmeetMIL D 3464 TYPEII2 Activatedclaytypedesiccantscanbebakedaccordingtomanufacturer srecommendationtorenewittooriginalspecifications 3 Priortoreuse thedesiccantsshouldbebakedfor48hrsat125CalongwiththeMSD s4 Itisrecommendedthatthedesiccantsshouldbereusedonlyforonecycle ReuseofHIC1 J STD 033ArequiresthatHICshallcomplywithMIL 1 8835 Atminimum theHICshallhavethreecolordotswithsensitivityvaluesof5 RH 10 RH 15 RH 2 HICcanbebakedforreuse TheHICcan tbereuseduntil5 RHvaluebecomescompletelyblue CelesticaAsia 3 ItisrecommendedthattheHICbebaked1hrat125Candreusedonlyforonecycle ReuseofMBBMBB smayber