《零件MSD标准》PPT课件

CelesticaAsia,GenericIntroduction,MoistureSensitiveDevice(MSD)ProcessControlPurpose空气中的水分會通過滲透進入一般性包裝材料.利用表面裝貼技術將SMD物料焊接到PCB過程中,SMD物料會接触到超過200C的高溫.高溫回流時,濕气迅速膨脹,材料配合不當以及材料表面降級會使SMD物料斷裂和分層.MSD控制指對不同潮濕等級的MSD物料的搬運,包裝,運輸和使用進行標準方法控制,以免物料受潮而高溫回流導致优率及可靠性下降.ProceduresSitesarerequiredtoconformtothespecificationsofJ-STD-033AandbeawareoftheinformationcontainedinJ-STD-020C.(CELESTICA)ThefollowingproceduresaredescribedinthisdocumentandrepresentthebasicprocessesthatshallbemaintainedandcontrolledforMSDs.1.ReceivingInspection2.Storage,CelesticaAsia,GenericIntroduction,3.postExposuretoFactoryAmbient4.BoardRework5.Reuseofmaterial6.AuditRequirementsReferenceDocofCELESTICAJ-STD-033A:AjointstandarddevelopedbytheJEDECandIPCabouthandling,Packing,shippingandUseofMoisture/ReflowSensitiveSurface.由JEDEC和IPC共同制定的有关潮湿敏感SMD物料的搬运,包装,运输和使用标准J-STD-020:MoistureSensitivityClassificationforNon-hermeticSolidStateSurfaceMountDevices.非密封固态SMD装置的湿敏性分类.ReferenceDocofCDGCELQ-029-PROC-510HandlingProcedureForDryPackingComponent干燥包装物料的操作程序CELQ-029-PROC-56ProcedureforICs,PCBsandPCBAsMoistureControlandBaking.MSD物料,PCB,PCBA的焗烤和湿度控制的工序,CelesticaAsia,ScopeforMSDIC,BGAhandling,packing,shipping&useIC搬運,包裝,運輸和使用J-STD-033AAssemblyprocesses:massreflow,localizedheating(boardrework),高溫回流,局部加热(PCBA返工)有關術語和定義MSD:MoistureSensitiveDevices潮濕敏感裝置SMD:SurfaceMountDevice表面裝貼裝置(Active)Desiccant干燥劑HIC:HumidityIndicatorCard濕度指示卡MBB:MoistureBarrierBag防潮袋FloorLife允許暴露時間ShelfLife保存期限MSL:MoistureSensitivityLevel潮濕敏感等級RH:relativehumidity相對濕度相對濕度是指在特定溫度下空氣中的水氣相對這個溫度下空氣所能包含的最大水氣量的比率,用百分比表示.,GenericIntroduction,CelesticaAsia,KeyRequirements,ReceivingInspectionPurposeComponentsshallbereceivedinacontrolledenvironmentforTemperatureandHumiditywithproperidentification.ProcedureComponentsmustbereceivedinthefollowingmanner:1.DrypackedSMDpackagesshouldbeinspectedforabagsealdatelocatedonthecautionorbarcodelabel.2.MBB,desiccant,HIC&MSDLabelshallconformtoJ-STD-033A.TheMBBshallhaveaMoistureSensitiveIDandMoistureCautionlabelaffixedtotheoutsideortothelowestlevelshippingcontainer(Figure1).3.TheHICshouldbereadimmediatelyuponremovalfromtheMBB.Ifthe5%RHdotispinkandthe10%RHdotisnotblue,theSMDpackageshavebeenexposedtoanexces-sivelevel.,CelesticaAsia,FlowchartinCDG,KeyRequirements,CelesticaAsia,Procedure:IQC检查来料,召集ME,QA,PROD,PROG,TE,MP等部门召开MRB会议.确定哪些物料可以继续再用,哪些物料需要重新Baking,哪些物料必须Reject给供应商.可继续再用的物料贴上UAI标签(IQC),图1.HIC超标的物料帖上SROT/RWK标签(IQC),设立相应的MRR号并存入MRB,图2.生产部要Baking的物料贴上SpecialHandling标签(IQC).此标签主要是对该物料Baking的要求,图3.生产部Baking完后,贴上一个焗炉标签(PROD),图4.2.生产部Baking:开MRB会议,主要确定的项目?规则和流程,标签填法,图片?主要是那些COMP在用干燥箱和焗炉?,KeyRequirements,图1,图2,图3,图4,CelesticaAsia,IQC检查合格后贴上UAI标签.MRB会议确定必须Reject给供应商的物料贴上RTV标签(IQC),并存入MRB内,图5.,图5,CelesticaAsia,KeyRequirements,StoragePurposeComponentsshallbereceivedinacontrolledenvironmentforTemperatureandHumiditywithproperidentification.ProcedureThefollowingproceduresarecoveredonthefollowingpages:1.DryCabinetstorage2.DryPackstorageTable1outlinestheattributesofthedifferentstoragemethods.,CelesticaAsia,Storage-DryCabinetPurposeDrycabinetsusedtostorecomponentsshallcontroltheTemperatureandHumidityofthespacewithinconsistently.Procedure1.DrycomponentsandpackagingmaterialifnecessaryasdefinedinDryingsection.2.PlacedrycomponentsincabinetmaintainingRHofnomorethan5%RH.ComponentsmaybeexposedorsealedinaMBB.3.LogtheDateandTimecomponentisplaceinthecabinetorplaceaMSDcontrollabel/tagonthecomponentpackaging.4.Temperaturewithinthecabinetshallbecontrolledto30C.INCDG:35%-85%RH12-27,KeyRequirements,CelesticaAsia,McDry干燥箱RefDoc.:CELQ-052-MPI-1907(DongguanMPIDL-1)打开包装的物料:1.如果在一个小时内用完,只需真空包装.2.如果超过暴露时间用完,就必须重新Baking.3.濕敏水平為2至4的元件,如果暴露時間不超過12小時，最少需要暴露時間的5倍的时间去干燥，这要求儲存的濕度條件不可高于10%RH.4.濕敏水平為5至5a的元件,如果暴露時間不超過8小時，最少需要暴露時間的10倍的时间去干燥，这要求儲存的濕度條件不可高于5%RH.,KeyRequirements,RH顯示器,CelesticaAsia,CDG的3个主要湿度控制表:,CelesticaAsia,KeyRequirements,Storage-DryPackPurposeDrypackingshallbeperformedconsistentlytocontroltheTemperatureandHumidityWithintheMBB.Procedure1.DrycomponentsandpackagingmaterialifnecessaryasdefinedinDryingsection.2.PlacethecomponentsintoaMBB.3.PlacetherequiredamountofdesiccantintotheMBB.4.PlaceaHICintotheMBBwiththecomponents.EnsureHICisnotplacedontopofthedesiccant.5.RemoveanyexcessairfromtheMBBbygentlypressingthebagtowardstheopeningasclosetothecomponentsaspossible.Usingvacuumpriortosealingisoptional.6.SealtheMBBusingtheheatsealer.Sealthebagclosetotheopeningofthebagtoallowspaceforsubsequentsealing.VacuumPacker(真空包装机)RefDoc.:CELQ-029-MPI-850(DongguanMPIDL-1)7.Inspectsealforanyairleaks.8.PlaceorupdateexistingMSDcontrollabel/tagontheMBB.9.Storethedrypackinambientconditions40C/90%RH.FloorlifeFloorlifearealways24hrsforallcomponentsexceptlevel6,1&2.除Level6,1,2外所有MSD零件的FloorLifeCDG均定為24小時.SMDpackagesclassifiedasLevel6mustbedriedbybaking,thenreflowedwithinthetimelimitspecifiedonthelabel.Level6用之前必須焗CDGhavenofloorlifelimitforLevel1&2.CDG對Level&2沒有floorlife限制.,CelesticaAsia,KeyRequirements,Attention1.Moisturesensitiveitemsclassifiedatlevels2athrough5ashouldbepackagedinhermeticallysealedbarriermaterialswithdesiccants.ThecomponentsmustbedriedpriortobeingsealedinMBB.2.SMDpackagesclassifiedasLevel6mustbelabeledanddriedbybaking,thenreflowedwithinthetime.3.TablebelowdetailsdrypackingrequirementsfordifferentMSLdevices,CelesticaAsia,KeyRequirements,4.CarriermaterialsthatareplacedintheMBBcanaffectthemoisturelevelwithintheMBB.Therefore,theeffectofthesematerialsmustbecompensatedforbybakingor,addingadditionaldesiccantintheMBB.postExposuretoFactoryAmbientIfcomponentsarewithlevel1orlevel2,theexposuretimeisnotaconcern.Ifexposurenotgreaterthan1hr:floorlifeclockcanstop.Ifcomponentsarerebaggedusingtheoriginalpackingmaterialsthisshouldbedonewithin30minutesaccordingtoJ-STD-033A.Ifexposurenotgreaterthan8hrs:aminimumdesiccatingperiodof10XbydrypacktheexposuretimeisrequiredtodrytheSMDpackagesenoughtoresetthefloorlifeclock.Ifcomponentswithlevel2aor3exposedforanytimelessthantheirfloorlife,thefloorlifeclockcanstopusingdrypack.Ifexposuregreaterthan8hrsandlessthanitsfloorlife(24hrs),thecomponentsshouldbereflowedpriortothefloorlifeorotherwisemustbere-bakedanddrypacked.reflowedpriortothefloorlifeorotherwisemustbere-bakedanddrypacked.如暴露超過8小時小于小時,須在24小時里reflow完,否則要Re-bake再包裝.Ifexposuremorethanitsfloorlife(24hrs),thecomponentsmustbebaked48hrsat125C.priortoreflowordrypack.若暴露超過24小時則reflow或干包裝前一定要焗小時。cantbeused.超過儲存期限的物料用之前須檢查.,CelesticaAsia,KeyRequirements,Ifexposuremorethanitsfloorlife(24hrs),thecomponentsmustbebaked48hrsat125Cpriortoreflowordrypack.BoardReworkIfanycomponenttemperatureexceeds200C,theboardmustbebakeddrypriortoreworkand/orcomponentremoval.Ifdonotneedtoreusethesuspecteddefectivepartorperformancefailureanalysisthenbakingtheboardisnotrequired.BakedurationofPCBAisbasedonthecomponenttoberemoved.PCBAreworkflowchart,CelesticaAsia,KeyRequirements,WORKDESCRIPTION:IC,PCB和PCBA的焗爐指示RefDoc.:CELQ-029-MPI-1426DongguanMPIDL-11.IC預焗方法根據IC的焗爐溫度設定值，選擇可承受此溫度的導電管或盤。將電子元件平放在導電的管上或盤上進行焗爐。焗完的電子元件必須作防潮包裝以备用.2.PCB預焗方法對於PCB將電路板放在層架上，每疊之間及與焗爐內壁最小留2吋空間以便疏氣。對除Matrox產品之外的所有PCB，每疊的高度最大2吋,如沒有足夠的PCB層疊,可把重物壓在電路板上，以避免電路板焗板後拗曲。對于Matrox產品所有PCB，每疊的高度最大1吋,而且需放置重物壓在電路板上以避免電路板焗板後拗曲。對于Matrox需要特别Rework的產品,每疊的高度最多是4块PCB重叠放置，而且需放置重物壓在電路板上以避免電路板焗板後拗曲。焗完的電路板必須於24小時內進行回流，否則要作防潮包裝.,CelesticaAsia,3.PCBA預焗方法對於PCBA將電路板放在層架上，不可層疊，電路板之間最小留1吋空間以便疏氣。對於已裝配電路板PCBA,在出烘爐時,生產部需要在已裝配電路板PCBA的流程卡上邊蓋上B印和寫下出爐的日期和時間。它們一定要在24小時之內進行加熱進行零件翻修,否則需要再一次烘板。ICs和PCBA的焗爐參數設定PCB的焗爐參數設定,CelesticaAsia,CDGMSDLabel,ReuseofmaterialPurposeDryPackingmaterialsmayberecycledorreusedtoreducecosts.ProcedureDesiccant,HICandMBBcanberecycledaccordingtomanufacturersinstructions.ReuseofDesiccants1.J-STD-033ArequiresthatdesiccantsshallmeetMIL-D-3464,TYPEII2.Activatedclaytypedesiccantscanbebakedaccordingtomanufacturersrecommendationtorenewittooriginalspecifications.3.Priortoreuse,thedesiccantsshouldbebakedfor48hrsat125CalongwiththeMSDs4.Itisrecommendedthatthedesiccantsshouldbereusedonlyforonecycle.ReuseofHIC1.J-STD-033ArequiresthatHICshallcomplywithMIL-1-8835.Atminimum,theHICshallhavethreecolordotswithsensitivityvaluesof5%RH,10%RH,15%RH.2.HICcanbebakedforreuse.TheHICcantbereuseduntil5%RHvaluebecomescompletelyblue.,CelesticaAsia,3.ItisrecommendedthattheHICbebaked1hrat125Candreusedonlyforonecycle.ReuseofMBBMBBsmaybereu