PCB印制电路板以及HDI生产流程详细介绍.英文版PPT课件

.,1,PCB以及HDI生产流程详细介绍.,.,2,AGENDA,1.DetailManufacturing4-65ProcessFlow(Photo)HDIProducts2.TechnologyRoadmapforPCB&HDI66-70TechnologyRoadmapProcessCapability,ProcessFlow(PCB&HDI),BACK,.,4,ProcessFlowChart(1),.,5,ProcessFlowChart(2),.,6,ProcessFlowChart(3),.,7,ProcessFlowChart(4),.,8,ProcessFlowChart(5),.,9,ProcessFlowChart(6),.,10,*Rawmaterial(ThinCore,Copper,Prepreg.),RawMaterial:FR-4(Difuntional,Tetrafuntional)Supplier:Nan-Ya,Grace,EMCSheetsize:36.5”*48.8”,40.5”*48.8”,42.5”*48.8”CoreThickness:0.003”,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”CopperFoil:1/3oz,1/2oz,1.0oz,2ozPrepregtype:1080,2112,2116,1506,7628,7630,RCC,.,11,.,12,.,13,.,14,4.內層線路製作(顯影)(Develop),.,15,5.內層線路製作(蝕刻)(Etch),.,16,6.內層線路製作(去膜)(StripResist),.,17,7.黑氧化(OxideCoating),.,18,8.疊板(Lay-up),.,19,9.壓合(Lamination),.,20,.,21,10.鑽孔(Drilling),.,22,11.電鍍Desmear&CopperDeposition,.,23,12.塞孔(HolePlugging),13.去溢膠(BeltSanding),.,24,14.減銅(CopperReduction)Option,15.去溢膠(BeltSanding)Option,.,25,16.外層壓膜DryFilmLamination(Outerlayer),.,26,17.外層曝光Expose,.,27,18.AfterExposed,.,28,19.外層顯影Develop,.,29,20.蝕刻Etch,.,30,20.去乾膜StripResist,.,31,21.壓合(Build-upLayerLamination),.,32,21.護形層製作(壓膜)(ConformalMask),.,33,22.護形層製作(曝光)(ConformalMask),BeforeExposure,AfterExposure,.,34,23.護形層製作(顯像)(ConformalMask),.,35,24.護形層製作(蝕銅)(ConformalMask),.,36,25.護形層製作(去膜)(ConformalMask),.,37,26.雷射鑽孔(LaserAblation)及機械鑽孔,.,38,27.機械鑽孔(MechanicalDrill),.,39,28.電鍍(Desmear&CopperDeposition),.,40,29.外層線路製作(Patternimaging),壓膜(D/FLamination),.,41,曝光(Exposure),顯像(D/FDeveloping),.,42,蝕銅(Etching),去膜(D/FStripping),.,43,30.防焊(綠漆)製作(SolderMask),.,44,DTI94V-0,R105,31.S/M顯像(S/MDeveloping),32.印文字(LegendPrinting),.,45,33.浸金(噴錫)製作(ElectrolessNi/Au,HAL),.,46,DedicateoruniversalTester,FlyingProbeTester,34.成型(Profile),35.測試(ElectricalTesting),.,47,36.終檢(FinalInspection),37.O.S.P.(entekplusCu_106A.)Option,EquipmentPhoto,BACK,49,EquipmentPhoto,Exposure,50,EquipmentPhoto,LaserDrilling,M/Drilling,51,EquipmentPhoto,X-RayDrilling,CuPlatting,52,EquipmentPhoto,CNCRouting,SEC/EDS,53,EquipmentPhoto,IR,ThermalShock,BACK,HDIProducts,BACK,.,55,LASERBLIND&BURIEDVIALAY-UP,A=THROUGHViaHole(導通孔),B=BURIEDViaHole(埋孔),C=STAGGERBlindVia(雷射盲孔),D,C,C,D=TWOLEVELLaserVia(雷射盲孔),C,D,C,Prepreg,FR-4Core,RCC,A,B,B,A,BuriedViaandLaserBlindVia,.,56,4LsMLBwithBlindViaProcess,BV,LAYER1,B-STAGE,PTH,LAYER2,LAYER3,LAYER4,.,57,8LsMLBwithBlindViaProcess,DRILLING,LAMINATION,PTH,DRILLING,INNERLAYERIMAGE,PTH,INNERLAYERIMAGE(L2),INNERLAYERIMAGE(L7),D/SPROCESS,L1-L2,L3-L4,L7-L8,L5-L6,.,58,6LsMLBwithBlind&BuriedViaProcess,INNERLAYERIMAGE(L3,L4),D/SPROCESS,L3-L4,LAMINATION,DRILLING,PTH,INNERLAYERIMAGE(L2,L5),LAMINATION,LASERDRILLING(L1-L2,L5-L6),DRILLING(MECHANICAL),PTH,OUTERLAYERIMAGE(L1,L6),BV,PTH,L1,L2,L3,L4,L5,L6,.,59,6LsMLBwithBlind&BuriedViaProcess,INNERLAYERIMAGE(L3,L4),D/SPROCESS,L3-L4,LAMINATION,DRILLING,PTH,INNERLAYERIMAGE(L2,L5),LAMINATION,LASERDRILLING(L1-L2,L5-L6),DRILLING(MECHANICAL),PTH,BV,PTH,L1,L2,L3,L4,L5,L6,OUTERLAYERIMAGE(L1,L6),PLUGGING,PANELPLATIING,.,60,8LsMLBwithLaserBlindViaProcess,INNERLAYERIMAGE(L2-L7),AOIInspection,L4-L5,L6-L7,L2-L3,LAMINATION(L1-l8),LASERDRILLING(L1-L2,L7-L8),DRILLING(L1-L8)(MECHANICALDRILL),PTH,OUTERLAYERIMAGE(L1,L8),DoubleSidePROCESS,.,61,8LsMLBwithLaserBlindViaProcess,PTH,LASERABLATION(L1-L2,L7-L8),INNERLAYERIMAGE(L3),D/SPROCESS,L3-L4,LAMINATION(L2-L4),DRILLING(L2-L4),INNERLAYERIMAGE(L6),OUTERLAYERIMAGE(L1,L8),L5-L6,LAMINATION(L5-L7),DRILLING(L5-L7),PTH,PTH,LAMINATION(L2-L7),INNERLAYERIMAGE(L4),INNERLAYERIMAGE(L5),DRILLING(L2-L7),PTH,INNERLAYERIMAGE(L2,L7),LAMINATION(L1-L8),.,62,8LsMLBwithLaserBlindViaProcess,PTH,LASERABLATION(L1-L2,L7-L8),INNERLAYERIMAGE(L3),D/SPROCESS,L3-L4,LAMINATION(L2-L4),DRILLING(L2-L4),INNERLAYERIMAGE(L6),OUTERLAYERIMAGE(L1,L8),L5-L6,LAMINATION(L5-L7),DRILLING(L5-L7),PTH,PTH,LAMINATION(L2-L7),DRILLING(L1-L8),INNERLAYERIMAGE(L4),INNERLAYERIMAGE(L5),DRILLING(L2-L7),PTH,INNERLAYERIMAGE(L2,L7),LAMINATION(L1-L8),.,63,6LsMLBwithLaserBlindViaProcess,BV,LAYER1,LAYER2,LAYER3,LAYER4,LAYER5,LAYER6,PTH,LASERABLATION(L1-L2,L5-L6),D/SPROCESS,L3-L4,OUTERLAYERIMAGE(L1,L6),LAMINATION(L2-L5),DRILLING(L1-L6),PTH,DRILLING(L3-L4),PTH,INNERLAYERIMAGE(L3,L4),LASERABLATION(L2-L3,L4-L5),INNERLAYERIMAGE(L2,L5),LAMINATION(L1-L6),.,64,6LsMLBwithLaserBlindViaProcess,BV,LAYER1,LAYER2,LAYER3,LAYER4,LAYER5,LAYER6,PTH,LASERABLATION(L1-L2,L5-L6)(L1-L3,L4-L6),D/SPROCESS,L3-L4,OUTERLAYERIMAGE(L1,L6),LAMINATION(L2-L5),DRILLING(L1-L6),PTH,DRILLING(L3-L4),PTH,INNERLAYERIMAGE(L3,L4),LASERABLATION(L2-L3,L4-L5),INNERLAYERIMAGE(L2,L5),LAMINATION(L1-L6),.,65,6LsMLBwithLaserBlindViaProcess,BV,LAYER1,LAYER2,LAYER3,LAYER4,LAYER5,LAYER6,PTH,LASERABLATION(L1-L2,L5-L6),D/SPROCESS,L3-L4,OUTERLAYERIMAGE(L1,L6),LAMINATION(L2-L5),DRILLING(L1-L6),CuFilledPlating/PTH,DRILLING(L3-L4),PTH,INNERLAYERIMAGE(L3,L4),LASERABLATION(L2-L3,L4-L5),INNERLAYERIMAGE(L2,L5),LAMINATION(L1-L6),Developed,BACK,TechnologyRoadmap,Linking,BACK,.,67,TechnologyRoadmapGZPlant,LayerReg.,Line/Spacing.,4/4mil,3.5/3.5mil,ImmersionNi/Au,PCMCIA,14Layers,BlindVia,Line/Space,HDI,5mil,BuriedC.R.,SurfaceFinish,Entek,MicroVia(D),3/3mil,3/3mil,4mil,SelectiveNi/Au,ImmersionSilver&Tin,2.5mil,LayerReg.,2.5/2.5mil,HalogenFree,LeadFree,4mil,3.5mil,3mil,GreenMaterial,2.5mil,3mil,GoldPlating,HASL,.,68,StackVia,ViaonVia,CuFilledPlatingPlugging,ViaonPTH,StaggerVia,PCMCIA,14Layers,BlindVia,HDI,PlusOne,BuriedC.R.,ViaStructure,MicroVia(D),PlusTwo,ViaonPTH,StaggerVia,ViaonVia,StackVia,PlusThree,5mil,4mil,2.5mil,3mil,TechnologyRoadmapGZPlant,.,69,CapabilityGZPlant(HDI),2006,2007,2008,2009,Max.build-uplayercountperside,Min.build-updielectricthickness,Min.microviadiameter(Unfinished),Line/Space,LayertolayerReg.Tolerance,SolderMaskReg.Tolerance,Impedancecontrol,Max.microviaaspectratio,ViaonPTH,ViaonVia,PluggedPlating,layers,2,2,3,3,mil,2.6,2.0,2.0,mil,5,4,4,3,mil,12,12,10,10,mil,3/3,3/3,2.5/2.5,2/2,mil,3.5,3,2.5,2,m