封装工艺介绍ppt课件

AssemblyProcessIntroduction-InternalTrainingMaterial,ZhangWeida2009.5.31,ICPackageBasicIntroduction;ProcessFlowofQFPProcessFlowofBGAPackageSummary,Index,2,ICPackageBasicIntroduction,AssemblyProcessFlow,3,Wafer晶圆StreetWidth街区宽度Thickness厚度Substrate(S/B)基板Leadframe(LF)框架,ICPackageBasicIntroduction,4,ICPackageBasicIntroduction,5,ICPackageBasicIntroduction,6,ICPackageBasicIntroduction,7,QFPProcessFlow,BackGrounding,Taping,De-taping,Mount,DieSaw(Dicing),DieBond,EpoxyCure,Plasma,WireBond,Molding,PMC,Mark,D/D,Plating,Trim/Form,FVI,ICPackageBasicIntroduction,8,BackGrounding,Taping,De-taping,Mount,DieSaw(Dicing),DieBond,EpoxyCure,Plasma,WireBond,Molding,PMC,Mark,BallAttack,Singulation,FVI,ICPackageBasicIntroduction,BGAProcessFlow,9,TM2633B92283.1#69852Z,ProcessFlowofQFP,ProcessFlowofQFP,10,Placewafersinthetapeframetofacilitatethediesawprocess.,WAFERMOUNTWAFERSAWDIEATTACHWIREBONDMOLDMARKPOSTMOLDCUREDEJUNK/TRIMSOLDERPLATINGFORMING/SINGULATIONPACKING,ProcessFlowofQFP,11,Cutwafersintosingledieunitaccordingtothespecificdiesize.,WAFERMOUNTWAFERSAWDIEATTACHWIREBONDMOLDMARKPOSTMOLDCUREDEJUNK/TRIMSOLDERPLATINGFORMING/SINGULATIONPACKING,ProcessFlowofQFP,12,Attachdicetotheleadframe,WAFERMOUNTWAFERSAWDIEATTACHWIREBONDMOLDMARKPOSTMOLDCUREDEJUNK/TRIMSOLDERPLATINGFORMING/SINGULATIONPACKING,ProcessFlowofQFP,13,WAFERMOUNTWAFERSAWDIEATTACHWIREBONDMOLDMARKPOSTMOLDCUREDEJUNK/TRIMSOLDERPLATINGFORMING/SINGULATIONPACKING,Toconnectthediepadandtheleadframebygoldwire,whichmakesthediefunctionworkwhenleadframeisconnectedwithoutsidedevice.,ProcessFlowofQFP,14,WAFERMOUNTWAFERSAWDIEATTACHWIREBONDMOLDMARKPOSTMOLDCUREDEJUNK/TRIMSOLDERPLATINGFORMING/SINGULATIONPACKING,Toencapsulatethewire-bondedI.C.toprotectthedieandgoldwirefromdamage,contamination&oxidation.,ProcessFlowofQFP,15,WAFERMOUNTWAFERSAWDIEATTACHWIREBONDMOLDMARKPOSTMOLDCUREDEJUNK/TRIMSOLDERPLATINGFORMING/SINGULATIONPACKING,xxxTM2633B92283.1#69852Z,ToimprintlegendontopsideoftheproductbyinkorlaserforIdentificationofdevicetype.Themarkingcontentincludelogo,lotno.,datecodedevicetypeandsoon.,ProcessFlowofQFP,16,WAFERMOUNTWAFERSAWDIEATTACHWIREBONDMOLDMARKPOSTMOLDCUREDEJUNK/TRIMSOLDERPLATINGFORMING/SINGULATIONPACKING,175oC,TostabilizethepropertyofplasticpackagechemicallyandphysicallytoensurethereliabilityofI.C.,ProcessFlowofQFP,17,WAFERMOUNTWAFERSAWDIEATTACHWIREBONDMOLDMARKPOSTMOLDCUREDEJUNK/TRIMSOLDERPLATINGFORMING/SINGULATIONPACKING,Dejunk:istocut/removetheresinbetweendambarsandmoldcompound.Trim:istocutdambarsofleadframe.,ProcessFlowofQFP,18,WAFERMOUNTWAFERSAWDIEATTACHWIREBONDMOLDMARKPOSTMOLDCUREDEJUNK/TRIMSOLDERPLATINGFORMING/SINGULATIONPACKING,Solderplatingistoformathinfilmontheleadframebyelectrodeposits.Thisthinsoldercanensuretheusageoftheproductandprotecttheleadsfromoxidation.,ProcessFlowofQFP,19,WAFERMOUNTWAFERSAWDIEATTACHWIREBONDMOLDMARKPOSTMOLDCUREDEJUNK/TRIMSOLDERPLATINGFORMING/SINGULATIONPACKING,Toseparatefinishedunitsontheleadframestripeintosingleunit,andthembendtheleadofeachunittothespecificshape.,ProcessFlowofQFP,20,WAFERMOUNTWAFERSAWDIEATTACHWIREBONDMOLDMARKPOSTMOLDCUREDEJUNK/TRIMSOLDERPLATINGFORMING/SINGULATIONPACKING,Toseparatefinishedunitsontheleadframestripeintosingleunit,andthembendtheleadofeachunittothespecificshape.,ProcessFlowofQFP,21,WAFERMOUNTWAFERSAWDIEATTACHWIREBONDMOLDMARKPOSTMOLDCUREDEJUNK/TRIMSOLDERPLATINGFORMING/SINGULATIONPACKING,Toseparatefinishedunitsontheleadframestripeintosingleunit,andthembendtheleadofeachunittothespecificshape.,ProcessFlowofQFP,22,WAFERMOUNTWAFERSAWDIEATTACHWIREBONDMOLDMARKPOSTMOLDCUREDEJUNK/TRIMSOLDERPLATINGFORMING/SINGULATIONPACKING,Selectsuitabletube,trayorboxforpackinginaccordingtoproducttypeandcustomerrequirement.,ProcessFlowofQFP,23,ProcessFlowofBGA,ProcessFlowofBGA,24,FRONTEND前线,BACKEND后线,BACKGRINDING晶圆背面研磨WAFERSAW晶圆切割DIEBOND上片WIREBOND焊线,MOLDING塑封(压模)MARKING印字BALLATTACH植球SINGULATION分离成型LEADSCAN/FVI外观检查,ASSEMBLYFLOW组装流程,ProcessFlowofBGA,25,WAFER晶圆,BackGrinding晶圓背面研磨(减薄),WAFER,TRUCKTABLE,GRINDINGWHEEL,ProcessFlowofBGA,26,WaferSaw晶圆切割,WAFER,BLUETAPE,WAFERMOUNT,SAWBLADE,DIE,ProcessFlowofBGA,27,DieBond(DieAttach)上片,BONDHEAD,SUBSTRATE,EPOXY,EPOXYCURE(DIEBONDCURE),ProcessFlowofBGA,28,WireBond焊线,GOLDWIRE,FINGER(INNERLEAD),DIE,PAD,CAPILLARY,ProcessFlowofBGA,29,Molding塑封(压模),Compound,Moldchase,ProcessFlowofBGA,30,Marking印字(盖印),INKMARK油墨印字,LASERMARK激光印字,ProcessFlowofBGA,31,175oC,PostMoldCure塑封后固化,ProcessFlowofBGA,32,BallAtta