PCB 工艺流程

.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,印制电路板（PCB）制作流程,主讲：杨兴全(高工),深圳市博敏电子有限公司,.,一、多层板内层制作流程,.,二、多层板外层制作流程,.,三、外形制作和成品检查流程,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,附件：典型多层板制作流程,1.内层开料,2.内层线路压膜,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,4.内层线路显影,3.内层线路曝光,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,5.内层线路蚀刻,6.内层线路去膜,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,7.叠板,8.层压,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,9.钻孔,10.孔金属化,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,11.外层线路压膜,12.外层线路曝光,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,13.外层线路显影,14.图形电镀铜/锡,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,15.外层去膜,16.外层蚀刻铜,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,17.退锡,18.阻焊印制,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,19.浸金或热风整平,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,四、PCB各制程物料消耗,1、下料裁板,物料消耗：,2、拼板废弃的覆铜板,1、成品加工板料消耗,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,2、内层图形转移,物料消耗：,1、干膜或湿膜（光致油墨）,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,3、曝光,物料消耗：,曝光后,1、菲林,2、UV灯管,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,4、内层显影,物料消耗：,1、显影液（碳酸钾等）,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,5、内层蚀刻,物料消耗：,1、蚀刻液,2、蚀刻含铜废液,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,6、去膜,物料消耗：,1、NaOH,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,7、黑化/棕化处理,物料消耗：,1、,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,8、叠板和层压,物料消耗：,1、半固化片（PP料）,2、层压垫纸（垫膜）,3、边/废料（PP料和垫膜等）,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,10、钻孔,物料消耗：,1、钻咀,2、铝板,3、垫板,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,11、孔金属化与全板镀铜,物料消耗：,1、凹蚀（除胶渣）液,2、整孔剂,3、中和剂、预浸剂,4、活化剂、加速剂,5、沉铜液,6、镀铜液,7、废槽液的回收,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,12、外层图形转移,物料消耗：,1、干膜或湿膜（光致油墨）,2、网版,3、胶带及校正纸张,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,物料消耗：,13、外层曝光,曝光后,1、黄/黑菲林,2、UV灯管,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,14、外层显影,物料消耗：,1、显影液（碳酸钾等）,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,物料消耗：,15、图形电镀铜/锡,1、除油剂,2、粗化液,3、镀铜液,4、镀锡液,5、铜球和锡条,6、添加剂,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,物料消耗：,16、去膜,1、NaOH,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,物料消耗：,17、外层蚀刻铜,1、蚀刻液,2、蚀刻含铜废液,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,物料消耗：,18、退锡,1、退锡液,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,物料消耗：,19、阻焊印制,1、阻焊绿油,2、网版,3、胶带及校正纸张,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,物料消耗：,20、阻焊曝光,1、菲林,2、UV灯管,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,物料消耗：,21、阻焊显影,1、显影液（碳酸钾等）,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,物料消耗：,22、字符的印制,1、字符油墨,2、网版,.,BROADTECHOLOGYINC.,BROADTECHOLOGYINC.,物料消耗：,23、表面涂覆