fab中常见缩写介绍

硬件相关： ESC: Electrical Static Chuck 静电卡盘 TMP: Turbo Molecule Pump 分子泵 DP: Dry Pump 干泵 EPD: Endpoint Detection 终点检测系统 OES: Optical Emission Spectrograph 光学发射光谱仪 IEP: Interferometer Endpoint Detection 干涉测量仪软件相关： CTC: Cluster Tool Controller 群集设备控制器 PMC: Process Module Controller 工艺模块控制器 TMC: Transfer Module Controller 传送模块控制器工艺相关： BT: Break Through 去除自然氧化层 ME: Main Etch 主刻 OE: Over Etch 过刻 STI: Shallow Trench Isolation 浅沟槽隔离刻蚀 PR: Photo Resist 光刻胶 CD: Critical Dimension 关键尺寸 AEI: After Etch Inspection ADI: After Developed Inspection ROX: Remaining Oxide 剩余Oxide层厚度 ER: Etch Rate 刻蚀速率 EU: Etch Uniformity 刻蚀均匀性 AEC/APC: Advanced Equipment/Process Control 先进设备/工艺控制 PRK: Particle Reduce Kits 减少颗粒过程 PM: Periodic Maintenance 周期维护芯片加工商相关： CoO: Cost of Ownership CoC: Cost of Consumption PRS: Process Release Standard STR: Split testing release MSTR: Mass Split Testing Release WAT: Wafer Acceptance Test Fab: Fabrication 芯片加工厂代称 FA: Fab Automation 工厂自动化 CIM: Computer Integration Manufacturing 计算机集成制造通用术语Table 1 Acronyms Table表1 缩写列表Acronyms/缩写Explanation/解释1WATWafer Acceptance Test /晶圆测试2RFRadio Frequency /射频3CDCritical Dimension /关键尺寸4Cp YieldYield /良率5PRPhoto resist /光刻胶6STIShallow trench isolation /沟槽隔离（刻蚀工艺）7MFCMass Flow Controller /质量流量计8ADIAfter develop inspection /显影后检查9AEIAfter etch inspection/刻蚀后检查10CoOCost of Ownership /客户拥有成本11CoCCost of Consumables /消耗成本12MTBFMean Time Between Failure /平均故障间隔时间13MTTRMean Time To Repair /机台平均维修时间14MTBCMean Time Between Clean /平均清洗间隔时间15FECPField Equipment Change Procedure /设备合格认证流程16CECustomer Engineer /客户硬件支持工程师17PSEProcess Support Engineer /客户工艺支持工程师18HCIHot Carrier Inject /热载流子注入测试19EFREarly Failure Rate /早期失效率测试20HTOLHot Temperature Operation Life 168/500/1000 Hour test/168/500/1000小时高温运行寿命测试21WPHWafer Per Hour /每小时加工的硅片数量TJ SMIC 术语Table I Acronyms Table表I 缩写列表Acronyms/缩写Explanation/解释1PRSProcess Release Standard /工艺发布标准2STRSpecial Test Request /特殊测试要求3MST