KLA缺陷检查培训

Overview,KLABasicOperation,1,21xxCapabilities,2,3,RunOverview,4,Runonewafer,InspectionQueue,5,6,7,8,9,StoppingtheInspection,10,DefectOverview,Whymonitordefects?,Toimproveproductionyields,defectsneedtobemonitoredandstatisticallyanalyzedateachstageofwaferproduction.,11,DefectSort,1.False:Foundnothingafterreviewwithinspectiondata.2.Unkown:Defectswerefoundbutthereisnosuitabledefectcodetoassign.3.Fallonparticle:Particleonsurfaceofpatten.,4.Infilmparticle:Particlewascontainedinfilm,suchaspoly,HDP,metalandsoon.,HDP,Poly,12,5.Scratch:Especiallyforscratchcausedbyrobot,othertoolpartsorman-made.Defectmap:,Defectiamge:,Micro,Macro,13,6.Discolor:Colordifference,7.Masking：Shouldbeetchedbutstillremian(poly,SiN,spacer,metalandsoon).Someconnectmorethantwolines,itsbridge(killer).,14,8.Ringlikedefect:SuchasdefectscausedbyARCsplash,usuallyrelatedtoPHOTO.,Poly,Metal,9.Grapelikedefect:InducesbyPHOTOPU.,15,10.Residue：Alwayshappenafterwetstationclean.,11.Pattenabnormal:Roughness,Defocus,Pattenshiftandsoon.,Roughness,Defocus,Pattenshift,PattenAbnormal,16,12.Concave:COP（Crystalorientedpits）,OxideLoss，Pits.,13.Peeling:Patternshiftormissing（Wplugisoneofpeeling,alwaysappearatwaferedge.）,17,14.Blind:CTorViahavenotbeenopened.,15.Pattendamage:,Metaldamage,Polybrokenispattendamagetoo,alwayshappenduringHighImp.,18,16.WResidue:,1).CausedbyOxideLoss;2).CausedbyCMP.,NORMALABNORMAL,17.Under_Pat：Underlayerpatternfailissue.,19,18.Salicide_abnormal:Salicidepoorformation.,19.Grain:Includingpolyormetalgrain.,20,20.,Slurry:,21.,PR/Polymer_remain:PRhasnotbeenstrippedcompletely,typicallycontainsCarbon,21,22.Arcing:,23.Lineopen:,22,24.Corrosion:Causedby