镀膜真空术语全集(中英文对照)

1、镀膜真空术语全集（中英文对照） 5.分压真空计（分压分析器） 5-1.射频质谱仪radio frequency mass spectrometer：  5-2.四极质谱仪（四级滤质器）quadrupole mass spectrometer；quadrupole mass filer：  5-3.单极质谱仪momopole mass spectrometer： 5-4.双聚焦质谱仪double focusing mass spectrometer：  5-5.磁偏转质谱仪magnetic deflection mass spectro

2、meter：  5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer：  5-7.回旋质谱仪omegatron mass spectrometer：  5-8.飞行时间质谱仪time of flight mass spectrometer：  6.真空计校准 6-1.标准真空计reference gauges：  6-2.校准系统system of calibration：  6-3.校准系数K calibration coeff

3、icient：  6-4.压缩计法meleod gauge method：  6-5.膨胀法expansion method：  6-6.流导法flow method： 4.   1.真空系统vacuum system  1-1.真空机组pump system：  1-2.有油真空机组pump system used oil ：  1-3.无油真空机组oil free pump system 1-4.连续处理真空 设备 continuous treatme

4、nt vacuum plant：  1-5.闸门式真空系统vacuum system with an air-lock：  1-6.压差真空系统differentially pumped vacuum system：  1-7.进气系统gas admittance system：  2.真空系统特性参量 2-1.抽气装置的抽速volume flow rate of a pumping unit ：  2-2.抽气装置的抽气量throughput of a pumping unit ： 

5、 2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system：  2-4.真空系统的漏气速率leak throughput of a vacuum system：  2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber：  2-6.极限压力ultimate pressure：  2-7.残余压力residual pressure：  2-8.残余气体谱resid

6、ual gas spectrum：  2-9.基础压力base pressure：  2-10.工作压力working pressure：  2-11.粗抽时间roughing time：  2-12.抽气时间pump-down time： 2-13.真空系统时间常数time constant of a vacuum system：  2-14.真空系统进气时间venting time：  3.真空容器 3-1.真空容器；真空室vacuum chamber： 

7、60;3-2.封离真空装置sealed vacuum device：  3-3.真空钟罩vacuum bell jar：  3-4.真空容器底板vacuum base plate：  3-5.真空岐管vacuum manifold：  3-6.前级真空容器（贮气罐）backing reservoir：  3-7.真空保护层outer chamber：  3-8.真空闸室vacuum air lock：  3-9.真空冷凝器；蒸汽冷凝器device for

8、condensing vapor：  4.真空封接和真空引入线 4-1.永久性真空封接permanent seal ：  4.2. 玻璃 分级过渡封接graded seal ：  4-3.压缩玻璃金属封接*pression glass -to-metal seal：  4-4.匹配式玻璃金属封接matched glass-to-metal seal：  4-5.陶瓷金属封接ceramic-to-metal seal：  4-6.半永久性真空封接semi-permanent s

9、eal ：  4-7.可拆卸的真空封接demountable joint：  4-8.液体真空封接liquid seal  4-9.熔融金属真空封接molten metal seal：  4-10.研磨面搭接封接ground and lapped seal：  4-11.真空法兰连接vacuum flange connection：  4-12.真空密封垫vacuum-tight gasket：  4-13.真空密封圈ring gasket： 4-14.真

10、空平密封垫flat gasket：  4-15.真空引入线feedthrough leadthrough： 4-16.真空轴密封shaft seal：  4-17.真空窗vacuum window：  4-18.观察窗viewing window：  5.真空阀门 5-1.真空阀门的特性characteristic of vacuum valves：  .真空阀门的流导conductance of vacuum valves：  .真空阀门的阀座漏气率leak rate of

11、 the vacuum seat：  5-2.真空调节阀regulating valve：  5-3.微调阀 micro-adjustable valve：  5-4.充气阀charge valve：  5-5.进气阀gas admittance valve：  5-6.真空截止阀break valve：  5-7.前级真空阀backing valve：  5-8.旁通阀 by-pass valve：  5-9.主真空阀main vac

12、uum valve：  5-10.低真空阀low vacuum valve：  5-11.高真空阀high vacuum valve：  5-12.超高真空阀；UHV阀 ultra-high vacuum valve：  5-13.手动阀manually operated valve：  5-14.气动阀pneumatically operated valve：  5-15.电磁阀electromagnetically operated valve：  5

13、-16.电动阀valve with electrically motorized operation：  5-17.挡板阀baffle valve：  5-18.翻板阀flap valve：  5-19.插板阀gate valve：  5-20.蝶阀butterfly valve：  6.真空管路 6-1.粗抽管路roughing line：  6-2.前级真空管路backing line：  6-3.旁通管路；By-Pass管路 by-pass line

14、：  6-4.抽气封口接头pumping stem：  6-5.真空限流件limiting conductance：  6-6.过滤器filter： 5.   1.一般术语 1-1真空 镀膜 vacuum coating：  1-2基片substrate：  1-3试验基片testing substrate：  1-4镀膜材料coating material：  1-5蒸发材料evaporation material： 

15、60;1-6溅射材料sputtering material：  1-7膜层材料(膜层 材质 )film material：  1-8蒸发速率evaporation rate：  1-9溅射速率sputtering rate：  1-10沉积速率deposition rate：  1-11镀膜角度coating angle： 2.工艺 2-1真空蒸膜vacuum evaporation coating：  (1).同时蒸发simultaneous evaporation：

16、60; (2).蒸发场蒸发evaporation field evaporation：  (3).反应性真空蒸发reactive vacuum evaporation：  (4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator：  (5).直接加热的蒸发direct heating evaporation：  (6).感应加热蒸发induced heating evaporation：  (7). 电子 束蒸发electron

17、 beam evaporation：  .激光束蒸发laser beam evaporation：  (9).间接加热的蒸发indirect heating evaporation：  (10).闪蒸flash evaportion：  2-2真空溅射vacuum sputtering：  (1).反应性真空溅射 reactive vacuum sputtering：  (2).偏压溅射bias sputtering：  (3).直流二级溅射direct

18、current diode sputtering：  (4).非对称性交流溅射asymmtric alternate current sputtering：  (5).高频二极溅射high frequency diode sputtering：  (6).热阴极直流溅射（三极型溅射）hot cathode direct current sputtering：  (7).热阴极高频溅射（三极型溅射）hot cathode high frequency sputtering：  .离子束溅射ion

19、beam sputtering：  (9).辉光放电清洗glow discharge cleaning：  2-3物理气相沉积PVD physical vapor deposition：  2-4化学气相沉积CVD chemical vapor deposition：  2-5磁控溅射magnetron sputtering：  2-6等离子体化学气相沉积；PCVD plasma chemistry vapor deposition：  2-7空心阴极离子镀HCD hollo

20、w cathode discharge deposition：  2-8电弧离子镀arc discharge deposition： 3.专用部件 3-1镀膜室coating chamber：  3-2蒸发器装置evaporator device：  3-3蒸发器evaporator：  3-4直接加热式蒸发器evaporator by direct heat：  3-5间接加热式蒸发器evaporator by indirect heat：  3-7溅射装置sputteri

21、ng device：  3-8靶target：  3-10时控挡板timing shutter：  3-11掩膜mask：  3-12基片支架substrate holder：  3-13夹紧装置clamp：  3-14换向装置reversing device：  3-15基片加热装置substrate heating device：  3-16基片冷却装置substrate colding device：  4.真

22、空镀膜设备 4-1真空镀膜设备vacuum coating plant：  (1).真空蒸发镀膜设备vacuum evaporation coating plant：  (2).真空溅射镀膜设备vacuum sputtering coating plant：  4-2连续镀膜设备continuous coating plant：  4-3半连续镀膜设备semi- continuous coating plant 6.   1.漏孔 1-1漏孔leaks：  1-2通道漏孔ch

23、annel leak：  1-3薄膜漏孔membrane leak：  1-4分子漏孔molecular leak：  1-5粘滞漏孔vixcous leak：  1-6校准漏孔calibrated leak：  1-7标准漏孔reference leak ：  1-8虚漏virtual leak：  1-9漏率leak rate：  1-10标准空气漏率standard air leak rate：  1-11等值

24、标准空气漏率equivalent standard air leak rate：  1-12探索（示漏）气体： 2.本底 2-1本底background：  2-2探索气体本底search gas background ：  2-3漂移drift：  2-4噪声noise：  3.检漏仪 3-1检漏仪leak detector：  3-2高频火花检漏仪H.F. spark leak detector：  3-3卤素检漏仪halide leak detect

25、or：  3-4氦质谱检漏仪helium mass spectrometer leak detector：  3-5检漏仪的最小可检漏率minimum detectable rate of leak detector：  4.检漏 4-1气泡检漏leak detection by bubbles：  4-2氨检漏leak detection by ammonia：  4-3升压检漏leak detection of rise pressure：  4-4放射性同位素检漏rad

26、ioactive isotope leak detection：  4-5荧光检漏fluorescence leak detection 7.   1.一般术语 1-1真空干燥vacuum drying：  1-2冷冻干燥freeze drying ：  1-3物料material：  1-4待干燥物料material to be dried：  1-5干燥物料dried material ：  1-6湿气moisture；humidity： &

27、#160;1-7自由湿气free moisture：  1-8结合湿气bound moisture：  1-9分湿气partial moisture：  1-10含湿量moisture content：  1-11初始含湿量initial moisture content：  1-12最终含湿量final residual moisture：  1-13湿度degree of moisture ,degree of humidity ：  1-14干燥物质

28、dry matter ：  1-15干燥物质含量content of dry matter： 2.干燥工艺 2-1干燥阶段stages of drying ：  (1).预干燥preliminary dry：  (2).一次干燥（广义）primary drying(in general)：  (3).一次干燥（冷冻干燥）primary drying(freeze-drying)：  (4).二次干燥secondary drying：  2-2.(1).接触干燥contact

29、drying：  (2).辐射干燥 drying by radiation ：  (3).微波干燥microwave drying：  (4).气相干燥vapor phase drying：  (5).静态干燥static drying：  (6).动态干燥dynamic drying：  2-3干燥时间drying time：  2-4停留时间length of stay(in the drying chamber)：  2-5循环时

30、间cycle time：  2-6干燥率 dessication ratio ： 2-7去湿速率mass flow rate of humidity：  2-8单位面积去湿速率mass flow rate of humidity per surface area：  2-9干燥速度 drying speed ：  2-10干燥过程drying process：  2-11加热温度heating temperature：  2-12干燥温度temperature of the

31、material being dried ：  2-13干燥损失loss of material during the drying process ：  2-14飞尘lift off (particles)：  2-15堆层厚度thickness of the material：  3.冷冻干燥 3-1冷冻freezing：  (1).静态冷冻static freezing：  (2).动态冷冻dynamic freezing：  (3).离心冷冻centrifu

32、gal freezing：  (4).滚动冷冻shell freezing：  (5).旋转冷冻spin-freezing：  (6).真空旋转冷冻vacuum spin-freezing：  (7).喷雾冷冻spray freezing：  .气流冷冻air blast freezing：  3-2冷冻速率rate of freezing：  3-3冷冻物料frozen material：  3-4冰核ice core： &

33、#160;3-5干燥物料外壳envelope of dried matter：  3-6升华表面sublimation front：  3-7融化位置freezer burn：  4.真空干燥设备；真空冷冻干燥设备 4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant：  4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber：  4-3加热表面

34、heating surface：  4-4物品装载面shelf ：  4-5干燥器的处理能力throughput (of the vacuum drying chamber)：  4-6单位面积干燥器处理能力throughput per shelf area：  4-7冰冷凝器ice condenser：  4-8冰冷凝器的负载load of the ice condenser：  4-9冰冷凝器的额定负载rated load of the ice condenser 8.&

35、#160;  1.一般术语 1-1试样sample ：  (1).表面层surface layer：  (2).真实表面true surface：  (3).有效表面积effective surface area：  (4).宏观表面；几何表面macroscopic surface area; geometric surface area：  (5).表面粒子密度surface particle density：  (6).单分子层monolayer： &

36、#160;(7).表面单分子层粒子密度monolayer density：  .覆盖系数coverage ratio：  1-2激发excitation：  (1).一次粒子primary particle：  (2).一次粒子通量primary particle flux：  (3).一次粒子通量密度density of primary particle flux：  (4).一次粒子负荷primary particle load：  (5).一次粒子积

37、分负荷integral load of primary particle：  (6).一次粒子的入射能量energy of the incident primary particle：  (7).激发体积excited volume：  .激发面积excited area：  (9).激发深度excited death：  (10).二次粒子secondary particles：  (11).二次粒子通量secondary particle flux：  

38、;(12).二次粒子发射能energy of the emitted secondary particles：  (13).发射体积emitting volume：  (14).发射面积emitting area：  (15).发射深度emitting depth：  (16).信息深度information depth：  (17).平均信息深度mean information depth：  1-3入射角angle of incidence：  1-4

39、发射角angle of emission：  1-5观测角observation：  1-6分析表面积analyzed surface area：  1-7产额 yield ：  1-8表面层微小损伤分析minimum damage surface analysis：  1-9表面层无损伤分析non-destructive surface analysis：  1-10断面深度分析 profile analysis in depth; depth profile analys

40、is ：  1-11可观测面积observable area：  1-12可观测立体角observable solid angle ：  1-13接受立体角；观测立体角angle of acceptance：  1-14角分辨能力angular resolving power：  1-15发光度luminosity：  1-16二次粒子探测比detection ratio of secondary particles：  1-17表面分析仪的探测极限det

41、ection limit of an apparatus for surface analysis：  1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis：  1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis：  1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis：  1-21本底压力base pressu