半导体专业术语(中英对照)

1、半导体专业词汇汇总Semiconductor:半导体MFG (Manufacture):制造部Wafer :晶片Boule:晶锭Ingot:晶棒As cut wafer: 毛片Particle：含尘量/微尘粒子Ped :晶盒Cassette:晶片夹Clean Room:洁净室(Class l()0(X)0 以上)MO ( Miss Operation):误.操作Process Engineering：制程工程师，简称为P.E.简单称为制程。Equipment Engineering:设备工程师，简称为E.E.简单称为设备。Recipe:程式PM (Prevention Maintenance)

2、:预 防保养Alarm :警讯()1 (Operation Instruction):规定的标准的正确操作机台的方法的文件1FAB区常用词汇1Air Shower空气洁净室25Cycle time生产周期2Al arm警讯26Code代码3Average平均27Control控制4APD异常处理单28Chip (die)晶粒5Abort放弃29Coiranent注解6Acid酸30Critical layer重要层7Auto/"Manual自动洋动31Confirin确认8AMHS (Automati c Mat erial Handl inc Syst em)自动化物料传输系统32

3、Chamber反应室gArea区域33CD (Critic Dimension)关键性尺寸10Batch群；粗34Cart手推车iiBack up备用35Chart图表12Bay rack货架36Control Wafer控片13Bay工作区37Duirany wafer挡片14Bank储存所38Daily check每天检查15Cancel取消39Diffusion扩散16Clean room无尘室40DI wat er去离子水17Cassette装晶片的晶舟41Damage损害18Cheinical化学药剂42Display展示19Check检查；核对43Double重复；加倍20CIM

4、(Comput er Int egrat ed Xanuf act urine)电脑整和制造44Defect缺陷21Class洁净室等级45Doping掺杂22CMP(Chemical Mechanica 1 Polish)化学机械研磨46Downgrade降级23Child lot子批47Due date交期24Correct正确48Discipline纪律22FAB区常用词汇49Etch蚀刻73ID (Identify)辨认，鉴定50Error错误74IPA有机清洁溶剂51EE (Epuipmeiut Engineer)设备工程师75Layer层次52Emergency紧急状况76Lot批

5、53Exit退出77Line线距54Entry进入78Loop巡路55Energy能星79Load载入56Environment环境80Login/logout注册/离开57EQ rack机台货架81Log sheet记录本58ET (Epui pm ent T e chni c i an)设备技术员82Logo标志59EQ Status机台状态83Location位置60Foundry代工84Login登录61Fail失败85Logout退出62FAB工厂86Lot Status产品状态63Filter过滤器87Laundry洗衣房64Function功能88Machine机器65Gas气体

6、89Machine机器66Gowning room更衣室90Module部门67Hold暫停91Move产量68Hot back烘烤92Monitor测机69I. Cflntegrated Circuit)集成电路93Merge合并70Idle闲置94Micron微米71Implant植入95Metal金属72Inter bay自动传输轨道系统96MF G (Manufa cturi ne)制造部3FAB区常用词汇97Mark标志121Profile侧面98Mask (reticle)光罩122Power电源99Manual手动123Pressure压力100Measure测量124P. R.

7、 (Photo Resist)光阻101Mapping映射125Parent lot母批102Mode模式126Pause暂停103Message讯息127Process讲行/过程/程序104Mean平均值128PE (Process Engine”)制程工程师105Measure测量129Peeling掀起106Non-critical非重要130Pattern图形107Oxide氧化物131Priority优先权108Owner拥有者132Product产品1090. I (operat ion Instruction)操作指导手册133PJI(Prevention Maintenance

8、)预防保养110OP I (Operation Int er face)操作界面134PN(Process Not i ce)制程通报11100S(Out of Spec)超出规格界线135POD晶盒11200C(Out of control)超出控制界线136Quality品质1130CAP(Out of Control Act ion Plan)超出管制界线的因1应对策137Certify (Qualify)取得资格114Pod装晶舟与晶片的盒子138Quantity(QTY)数量115Photo黄光或微影139Queue time等待时间116Particle含尘量/微尘粒子140Rec

9、ipe程式117Password密码141Rework再做一次/重做118Poly复晶142Robot机械手臂119Passivation保护层143Run跑（货）120Polymer聚合物144Release放行4FAB区常用词汇145Run Card卡片，注明程式内容169Sorter晶片分片/整理机146Ready准畚170Suiranary总计147Recycle回收171SPC制程统计管制148Reclaim再生172Strip剥去149Remove去除173SPC-Chart制程統计控制图形150Request要求174Stocker仓储151Reject退回（出）175Split

10、分批152Range范围176Shut down停工153Record记录177Sticker防错标签154Review重新检查178Stop停止155Retest再测试179S t andby准备，待命156Semiconductor半导体180Scrubber洗刷157Scrap报废181Set up测试158Si (Silicon)硅原子182SOP(Standard Operation Procedure)标准操作程序159Start开始183Slot槽位160Spec (Specificat ioiO规格184Solvent溶剂161Schedule指目录或时间表185Scratch

11、刮伤162Step步骤186Track out出货163Sinif Arm标准机械界面187Tag电子显示器164Sinart Tag电子式标签188Thin Film薄膜165Ship传送189Temperature温度166Smart Tray托盘190TECH(Temporary Engineer Change Notice)临时工程变更通失。167Space空间191T. A. (Technical Assistant)技术助理168Sidewal1侧壁192Transfer传送5FAB区常用词汇193Vacuum真空206T.M.领班/训练员194WAT (Wafer Accepta

12、nce Test)晶圆测试207Transistor电晶体195Wafer晶圆208Track in进货196Wafer Start晶片投入209Tunnel (Bay)通道197WIP在制品210Turn Ratio周转率(T/R)198Wet Bench酸槽211Trolley手推车199Well井区212Throughput产量200WPH每小時機台 產出晶片數213Thickness厚度201Wait等待214Test Wafer测试晶片202Warning占口215Unload载出203Wiper无尘布216Up向上204W (Tungsten)铸217Update更新资料205Yi

13、eld良率218Uniformity均匀度219¥. L. S. I (Very Larce Scale Inteerated)超大型积体电路66!工作域snma汇1DlfF Area"区）nPad Oxide蛙化层XHLtridr (Sg2Gate Oiclde闸釦.族9Furnace炉管Field Oxide时化IB10Alloy散E电圧与电流疫找性'4DensityS-ft关茶降延接触打阻値BPM言碟员最担隹化内«T"rr'-r四乙基航化廷；在其單§Backside Etch背面蚀財11ItOS通常当作第歆曽使用7Aimc

14、il目火THPLAIfr A.re!a（植入区）6Hld-CiirrEt中卮流1竄 VU1« JfaiS ViiL*3原于度彳敏7 1Depth2Hl gh-Cmient高电沒0 QHajnct邮'?Angle角度9Dose剂系1Bi sh-Eer&y高産5J1。Source-Krad奇子遍上Bcai-CinTent申二中:电济，】1HLsh-Vollaaewn.BEETCH Arm（蚀刻区，1AEIfifitr noli TiSDt-eiho&)蚀如応垃斉8Plasia2Under E代hH剑不吊9Dry Clean干跳3ASIfJklitr Hjis iM

15、ttaiL&iO光阻专除.后椅罗110Se-isoniHe til VU金鷹搂触啬11捕虹$网3的1 t;L*CtclC41mcm&g网扫描式电于朝杭5Contict 3«le剛窗12Selectivity选择比,6ger Etch4瞄13Etid Poirit蚀到祥点7 .：De cvr顾理14Hlccti归 ufcg 7二作区常用途匚PHOTO Area (黄光区)1ADI(Art er develop inspect lonJ显影后检视18Backside品.片背面2Exhaust排气（将官路中的空气排 除）19Finished完成，货已执行完成3Alignme

16、ntJ非成一直线，对平20Coating泳布，光阻覆盖4Exposure曝光21Execute执行5Break中断，stepper机台内中 诠停止键22Coater光阻覆盖机台）6Local defqgus局部失焦因机台或品片造成 之脏汚23Flatness平坦度7Dose曝光星24Developer显影液；显影机台）8Lamp灯25Focus焦距9Offset弥补26Development显影10Over flow溢出27Local当地的，本地的11H. M. D. SHexamethyldis ilazane ，经去水烘烤的晶片，将 涂上一层増加光阻与晶片 表面附着力的化含物，称H. M. D. S28Diagnosis诊断，诊断结果.stepper机台执行测机时之技键12Overlay测量刖层与本层之间曝光 的准确度29Query疑问13Spin旋转Spin. Dry旋干*30WEE周边嗥光14P. R. (Photo resist1光阻31Queue time等待时间15Rotation爐转32Register记录，登记16Pilot实验的33Rinse湿润17Search寻找34Reticle北軍THTNFTL Area (蒲膜区)1FV