电镀基础知识培训

1、Ni+Ni+Cl-Cl-+_Rectifier整流器整流器ANODE阳极阳极CATHODE阴极阴极ANODE阳极阳极Ni+ + 2e- Ni (metal 金属金属)2H+ + 2e- H24H2O + 4e- 2H2 + 4(OH)-Ni Ni+ + 2e-4OH- O2 + 2H2O + 4e-2H2O O2 + 4H+ + 4e-Amperes安培安培 = Volts 伏特伏特 Ohms 欧姆欧姆I 电流电流= E 电压电压 R 电阻电阻Amperes 安培安培Time 时间时间Equivalent Weight of Metal 金属当量金属当量b One ampere flowing

2、 for one second represents one coulomb. Faraday law states that 96,500 coulombs (one Faraday) will deposit one gram equivalent weight of a metal. Equivalent weight is the atomic weight of the metal divided by its valence.b1安培的电流安培的电流1秒的时间通过的电量等于秒的时间通过的电量等于1库仑。库仑。法拉第定律：法拉第定律：1个法拉第即个法拉第即96,500库仑的电量可以库

3、仑的电量可以沉积沉积1克当量的金属。克当量是金属的原子量除以克当量的金属。克当量是金属的原子量除以它的化合价它的化合价.weight of metal deposited沉积的金属重量沉积的金属重量 96,500 Coulombs Deposit At. Wt. = grams 96,500库仑的镀层库仑的镀层 ValenceWEIGHT OF NICKEL PLATED电镀镍的重量KNOWN FACTORS已知的条件已知的条件Current 电流电流= 50 amps安培安培Time 时间时间 = 15 mins分钟分钟原子量原子量 At. Wt. Ni = 58.7 Valence = 化

4、合价化合价, 2 价价CALCULATION 计算计算96,500 = 45,000 X = 13.7 GRAMS 克克 x grams 2density x area1mil = 25. 4 umEXAMPLE :wt = 0.136 grams. Area = 4 cm2Thickness =8.9 x 4Answer = 1.5 milsAnode阳极阳极-e = corrosion溶解溶解 -e + Oxygen氧氧 -e Cathode阴极阴极+e = plating所镀金属所镀金属+e + hydrogen氢氢+eThe exchange of electrons at the a

5、node and the cathode or the total flow of current at each electrode is always equal.电子在阳极和阴极上交换电子在阳极和阴极上交换,在阴阳极上流动的电在阴阳极上流动的电流总是相等的。流总是相等的。Anode阳极阳极Cathode阴极阴极Ni+2Ni+22H+H2EIEpR= E IEP= PolarizationNi +IonsANODE阳极阳极CATHODE 阴极阴极+ + + + +EFFECT 影响影响Agitation 打气打气Temperature 温度温度Why Acid Copper ?Why Ac

6、id Copper ?为什么用酸铜为什么用酸铜抛抛/磨光后提供好的填平效果磨光后提供好的填平效果Mirror Smooth Surface180 GritScratchesMACROTHROW宏观上的均镀宏观上的均镀THE ABILITY TO DEPOSIT METAL RELATIVELY UNIFORMLY OVER A BROAD CURRENT DENSITY RANGE 在一个宽的电流密度范在一个宽的电流密度范围内相对地镀层均匀分布围内相对地镀层均匀分布的能力的能力MICROTHROW 微观上的均镀微观上的均镀THE ABILITY TO DEPOSIT METAL IN GROO

7、VES, PORES, CRACKS AND SURFACE IMPERFECTIONS OF MICROSCOPIC NATURE在凹槽、小孔、裂纹和其在凹槽、小孔、裂纹和其他表面微观缺陷上沉积镀他表面微观缺陷上沉积镀层的能力层的能力.Why Acid Copper ? Why Acid Copper ? 为何用酸铜？为何用酸铜？Provides Leveling of Scratches将砂痕印填平将砂痕印填平DgTgTsGood LevelingMicrothrow好的填平好的填平 及微观均镀及微观均镀Poor/No Leveling差差/无填平无填平% Leveling = Tg- T

8、s x 100 DgWhy Acid Copper ? Why Acid Copper ? 为何用酸铜为何用酸铜 Provides A Bright, Easy to Buff Surface for Coverage of Very Minor Blemishes in Castings, Aluminum or Plastic 提供一个光亮的、电镀后容易抛光覆盖压铸件提供一个光亮的、电镀后容易抛光覆盖压铸件,铝材或塑料表面铝材或塑料表面的微小缺陷的镀层的微小缺陷的镀层. Bright Surface That Requires Little/No Buffing少少/ 不要求抛光的光亮表面

9、不要求抛光的光亮表面. Long Term Protection Against Corrosion长期耐蚀长期耐蚀Microscopic Section Of A Porous Casting. Plating Has Bridged Surface Pores多孔压铸件的横截面图，电镀镀层覆盖了多孔压铸件的横截面图，电镀镀层覆盖了表面表面的微孔的微孔.SpotsSurface Pores表面微孔表面微孔Acid Copper PlateAcid Copper Plate酸铜电镀酸铜电镀Key Ingredients 关键成份关键成份:Copper Sulfate 硫酸铜硫酸铜180-225

10、 g/LSulfuric Acid 硫酸硫酸45-90 g/LAcid Copper PlateAcid Copper Plate酸铜电镀酸铜电镀Other Ingredients 其它成份其它成份:Chloride 氯化物氯化物80-120 mg/LUltra mu 开缸剂开缸剂8-10 ml/LUltra A 添加剂添加剂0.3-0.5 ml/LUltra B 添加剂添加剂0.3-0.5 ml/LAt 113 gL At 285 g/L Low copper content can cause reduced leveling, slow deposition, and a narrow

11、current density range铜含量低将减少填平性能、沉积慢和电流密度铜含量低将减少填平性能、沉积慢和电流密度范围窄范围窄. Concentrations 248 g/L copper sulfate may produce crystals on tank walls, and anode bags, yielding rough deposits, and poor anode corrosion.硫酸大于硫酸大于248g/L会在槽壁中、阳极袋中产生会在槽壁中、阳极袋中产生结晶结晶,引起粗糙的沉积和阳极溶解不好引起粗糙的沉积和阳极溶解不好.The Hull Cell indic

12、ates that at 113 g/L Copper Sulfate a deposit that is burned at very high current densities is produced.赫氏槽实验显示赫氏槽实验显示113g/L浓度下的硫浓度下的硫酸铜液中沉积的金酸铜液中沉积的金属在高电流密度下属在高电流密度下出现烧焦的情况出现烧焦的情况180 g/L Sulfuric Acid = high current density area burning and anode passivation.浓度大于浓度大于180g/L的硫酸会使高电的硫酸会使高电流密度区烧焦，并使阳极钝

13、化。流密度区烧焦，并使阳极钝化。 Concentrations 1000 mg/L, iron and nickel may reduce the electrolyte conductivity and throwing power浓度大于浓度大于1000mg/L时，铁和镍会减少电解液的导电性和均镀时，铁和镍会减少电解液的导电性和均镀能力能力Hull Cell Panel Plated In Acid Copper Containing 1,000 ppm Zinc含含1000ppm锌的酸铜液中镀出来的赫氏片锌的酸铜液中镀出来的赫氏片Can produce dull appearance i

14、n low current density areas 在低密度区会产生暗的外观在低密度区会产生暗的外观Sources来源来源:Tank linings 缸的内衬缸的内衬, Row material 原材料原材料, Plastic Mandrels 塑料填充物塑料填充物, Brightener Breakdown Products 光亮剂的分解物光亮剂的分解物 Treatment处理处理:Activated Carbon removes organics活性碳活性碳In some cases a hydrogen peroxide treatment may also be required.

15、双氧水双氧水Carbon Treatment 碳处理碳处理bMove Solution To Separate Treatment Tank把溶液移入独立的处理槽把溶液移入独立的处理槽bAdd 3-12 g/L Activated Carbon加加3-12g/L的活性碳的活性碳bAgitate Thoroughly充分搅拌充分搅拌bAllow To Settle 2 hours (but not too long, 8 hours max.)静置静置2小时（不要太长，最多小时（不要太长，最多8小时）小时）bTransfer To Second Treatment Tank, Test For

16、Presence of Carbon转入第二个槽，测试是否还含有碳粉转入第二个槽，测试是否还含有碳粉.bIf Carbon Free, Transfer Back To Plating Tank如果没有碳粉了，则泵回原来的电镀槽如果没有碳粉了，则泵回原来的电镀槽.Actual Current Density Depends On The Distance Between A Spot On The Part And The Anode真实的电流密度决定于工件上真实的电流密度决定于工件上A点和阳点和阳极间的距离极间的距离.High Current Density Area高电流密度区高电流密度区

17、Medium Current Density Area中电流密度区中电流密度区Low Current Density Area低电流密度区低电流密度区Average CCD = Amperes of Current Area in Square Feet平均的阴极电流密度平均的阴极电流密度=平方英尺面积的安培数平方英尺面积的安培数Thickness (mils) = A/ft2 x Hours厚度厚度 (密尔密尔) If amps/ft2 = 15, and plating time is 20 minutes (0.33 hours), then the thickness will be:

18、 如果安培如果安培/平方英尺平方英尺=15，电镀时间为，电镀时间为20分钟（小时分钟（小时），则厚度为：），则厚度为： Thickness (mils) = 15 x = 0.28 mils 厚度厚度 ) )Calculating Plating Time 计算电镀时间计算电镀时间:If we want 20u of thickness, plating at 3 A/dm2:如果我们想得到如果我们想得到20u的厚度的厚度,在在3 A/dm2下电镀：下电镀：Thickness (u) = A/dm2 x min 厚度厚度 20u = 3A/dm2 x min Medium Agitation中

19、搅拌中搅拌Low Agitation低搅拌低搅拌Panel Plated With No Agitation无搅拌的电镀片无搅拌的电镀片Phosphorized 磷铜磷铜(0.02-0.06%P) rolled copper anodes or phosphorized slugs含含P 0.02-0.06%的磷铜的磷铜球球/块块Anodes baskets should be 3-5 inches shorter than the longest rack being plated. 阳极钛篮应该比最长的电阳极钛篮应该比最长的电镀挂具短镀挂具短3-5英寸英寸.Partially Filled

20、 Titanium Anode Basket 没有装满磷铜的没有装满磷铜的阳极钛篮阳极钛篮.Bag The Anodes Using Dynel Or Napped Polypropylene Bags (8 oz/yd2). 使用代纳尔合成纤维使用代纳尔合成纤维或聚丙烯材料做阳极或聚丙烯材料做阳极袋袋.Loose Fit Is Best!稍松的填装最好！稍松的填装最好！Tops of Bags Need To Be ABOVE Liquid Level!阳极袋的封口须高于液面！阳极袋的封口须高于液面！CATHODE 阴极阴极ANODE 阳极阳极ZERO LEVELING 零填平零填平NEGA

21、TIVE LEVELING 负填平负填平GOOD LEVELING 好的填平好的填平SINGLE LAYER NICKEL COATING单层镍单层镍BRIGHT NICKEL光亮镍光亮镍COPPER铜CHROMIUM铬铬CORROSION SITE腐蚀点腐蚀点Pd/Sn LAYER钯钯/锡层锡层Cu-LinkDOUBLE LAYER NICKEL COATING双层镍双层镍BRIGHT NICKEL光亮镍光亮镍COPPER铜CHROMIUM铬铬CORROSION SITE腐蚀点腐蚀点SEMI BRIGHT NICKEL半光半光亮镍亮镍DUPLEX SYSTEM双层系统双层系统ABS/PC P

22、LASTIC塑料塑料Cu-LinkPd/Sn LAYER钯钯/锡层锡层TRIPLE LAYER NICKEL COATING三层镍三层镍BRIGHT NICKEL光亮镍光亮镍CHROMIUM铬铬CORROSION SITE腐蚀点腐蚀点SEMI BRIGHT NICKEL半光半光亮镍亮镍TRIPLEX SYSTEM三层镍系统三层镍系统HIGH SULFUR LAYER高硫镍高硫镍ABS/PC PLASTIC塑料塑料Pd/Sn LAYER钯钯/锡层锡层Cu-LINK LAYERMICRODISCONTINUOUS CHROMIUM WITH QUADRUPLE NICKEL COATING带四层镍

23、的微间断镍涂层带四层镍的微间断镍涂层BRIGHT NICKEL光亮镍光亮镍CHROMIUM铬铬CORROSION SITESSEMI BRIGHT NICKEL半光半光亮镍亮镍QUADRUPLE SYSTEM四层镍四层镍HIGH SULFUR LAYER高硫镍高硫镍PARTICLE NICKEL镍封镍封COPPER铜铜ABS/PC LAYERCu-LINK LAYERPd/Sn LAYER钯钯/锡层锡层MICRODISCONTINUOUS CHROMIUM WITH QUADRUPLE NICKEL COATING带四层镍的微间断铬涂层带四层镍的微间断铬涂层BRIGHT NICKEL光亮镍光亮

24、镍COPPERCHROMIUM铬铬CORROSION SITES腐蚀点腐蚀点SEMI BRIGHT NICKEL光亮光亮镍镍QUADRUPLE SYSTEM四层镍系统四层镍系统HIGH SULFUR LAYER高硫层高硫层PARTICLE NICKEL镍封镍封ALUMINUM铝铝DILUTE SOLUTION 稀溶液稀溶液CrO3 + H2O H2CrO4 CrO4= + 2H+CONCENTRATED SOLUTION 浓溶液浓溶液2H2CrO4 H2Cr2O7 + H2O Cr2O7= + 2H+Cr2O7= + 14H+ + 12(e) CAT 2Cr0 + 7H20 DEPOSITIO

25、N REACTION 沉积反应沉积反应2H+ 2 ( e ) H2Cr2O7= + 14H+ + 6(e) CAT 2Cr+ + 7H20SIDE REACTION 副反应副反应CATHODE 阴极阴极4OH- - 4(e ) 2H2O + O2 Pb + 4OH- - 4( e ) PbO2 + 2H2OANODE LEAD 阳极阳极铅铅2Cr+ + 3O2 - 6( e ) 2CrO3X 375X 150AIR空气空气BUBBLE TOWER泡沫塔泡沫塔AIR LINE空气线空气线SALT SOLUTION ATOMIZER TANK盐水喷雾缸盐水喷雾缸DISPERSION TOWER分散

26、塔分散塔LEVEL CONTROL SYSTEM水平控制系统水平控制系统WATER JACKET水套水套VISEA PLATED SECTION 电镀部分电镀部分ANGLE OF DEFLECTION弯曲的角度弯曲的角度NICKEL FOIL 镍箔镍箔MICROMETER 千分尺千分尺D = T/2RMANDREL轴轴PLATED STRIP电镀条电镀条D(%) = 100t d + tNICKEL FOIL镍箔镍箔OILor WATER油或水油或水PRESSURE压力压力PRESSURE压力压力DEPOSIT 沉积沉积TENSILE拉伸拉伸COMPRESSIVE压缩压缩ZERO零零GAUGE 量规量规HELIX 螺旋螺旋AGITATOR搅拌搅拌STRIPPING ELECTROLYTE剥离电解液剥离电解液GASKET垫圈垫圈CELL 槽槽SPECIMEN样品样品THICKNESS INSTRUMENT厚度设备厚度设备STAND立式立式 & CELL电池电池COATING涂层涂层SUBSTRATE基材基材APERATURE PLATEN?ISOTOPE 同位素同位素GEIGERMULLER TUBE管管PRINTERBETA BACK SCATTERC