LED照明常用词汇中英文对照(三)

1、thin film hybrid circuitLED照明常用词汇中英文对照( 三)印制电路printed circuit印制线路printed wiring印制板printed board印制板电路printed circuit board印制线路板printed wiring board印制元件printed component印制接点printed contact印制板装配printed board assembly板 board刚性印制板rigid printed board挠性印制电路flexible printed circuit挠性印制线路flexible printed wir

2、ing齐平印制板flush printed board金属芯印制板metal core printed board金属基印制板metal base printed board多重布线印制板mulit-wiring printed board塑电路板molded circuit board散线印制板discrete wiring board微线印制板micro wire board积层印制板buile-up printed board表面层合电路板surface laminar circuit埋入凸块连印制板B2it printed board载芯片板chip on board埋电阻板burie

3、d resistance board母板mother board子板daughter board背板backplane裸板bare board键盘板夹心板copper-invar-copper board动态挠性板dynamic flex board静态挠性板static flex board可断拼板break-away planel电缆cable挠性扁平电缆flexible flat cable (FFC)薄膜开关membrane switch混合电路hybrid circuit厚膜thick film厚膜电路thick film circuit薄膜thin film薄膜混合电路互连inte

4、rconnection导线conductor trace line齐平导线flush conductor传输线transmission line跨交crossover板边插头edge-board contact增强板stiffener基底substrate基板面real estate导线面conductor side元件面component side焊接面solder side导电图形conductive pattern非导电图形non-conductive pattern基材base material层压板laminate覆金属箔基材metal-clad bade material覆铜箔层压

5、板copper-clad laminate (CCL)复合层压板composite laminate薄层压板thin laminate基体材料basis material预浸材料prepreg粘结片bonding sheet预浸粘结片preimpregnated bonding sheer环氧玻璃基板epoxy glass substrate预制内层覆箔板mass lamination panel内层芯板core material粘结层bonding layer粘结膜film adhesive无支撑胶粘剂膜unsupported adhesive film覆盖层cover layer (cov

6、er lay)增强板材stiffener material铜箔面copper-clad surface去铜箔面foil removal surface层压板面unclad laminate surface基膜面base film surface胶粘剂面adhesive faec原始光洁面plate finish粗面matt finish剪切板cut to size panel超薄型层压板ultra thin laminateA 阶树脂A-stage resinB 阶树脂B-stage resinC 阶树脂C-stage resin环氧树脂epoxy resin酚醛树脂phenolic resi

7、n聚酯树脂polyester resin聚酰亚胺树脂polyimide resin双马来酰亚胺三嗪树脂bismaleimide-triazine resin丙烯酸树脂acrylic resin三聚氰胺甲醛树脂melamine formaldehyde resin多官能环氧树脂polyfunctional epoxy resin溴化环氧树脂brominated epoxy resin环氧酚醛epoxy novolac氟树脂fluroresin硅树脂silicone resin硅烷silane聚合物polymer无定形聚合物amorphous polymer结晶现象crystalline pola

8、mer双晶现象dimorphism共聚物copolymer合成树脂synthetic热固性树脂thermosetting resin·热塑性树脂thermoplastic resin·感光性树脂photosensitive resin·环氧值epoxy value·双氰胺dicyandiamide·粘结剂binder·胶粘剂adesive·固化剂curing agent·阻燃剂flame retardant·遮光剂opaquer·增塑剂plasticizers·不饱和聚酯unsatui

9、ated polyester·聚酯薄膜polyester·聚酰亚胺薄膜polyimide film (PI)·聚四氟乙烯polytetrafluoetylene (PTFE)·增强材料reinforcing material·折痕crease·云织waviness·鱼眼fish eye·毛圈长feather length·厚薄段mark·裂缝split·捻度twist of yarn·浸润剂含量size content·浸润剂残留量size residue·

10、;处理剂含量finish level·偶联剂couplint agent·断裂长breaking length·吸水高度height of capillary rise·湿强度保留率wet strength retention·白度whitenness·导电箔conductive foil·铜箔copper foil·压延铜箔rolled copper foil·光面shiny side·粗糙面matte side·处理面treated side·防锈处理stain proo

11、fing·双面处理铜箔double treated foil·模拟simulation·逻辑模拟logic simulation·电路模拟circit simulation·时序模拟timing simulation·模块化modularization·设计原点design origin·优化（设计）optimization (design)·供设计优化坐标轴predominant axis·表格原点table origin·元件安置component positioning·

12、;比例因子scaling factor·扫描填充scan filling·矩形填充rectangle filling·填充域region filling·实体设计physical design·逻辑设计logic design·逻辑电路logic circuit·层次设计hierarchical design·自顶向下设计top-down design·自底向上设计bottom-up design·费用矩阵cost metrix·元件密度component density·自

13、由度degrees freedom·出度out going degree·入度incoming degree·曼哈顿距离manhatton distance·欧几里德距离euclidean distance·网络network·阵列array·段 segment·逻辑logic·逻辑设计自动化logic design automation·分线separated time·分层separated layer·定顺序definite sequence·导线（通道）co

14、nduction (track)·导线（体）宽度conductor width·导线距离conductor spacing·导线层conductor layer·导线宽度 /间距conductor line/space·第一导线层conductor layer No.1·圆形盘round pad·方形盘square pad·菱形盘diamond pad·长方形焊盘oblong pad·子弹形盘bullet pad·泪滴盘teardrop pad·雪人盘snowman pad&

15、#183;形盘V-shaped pad V·环形盘annular pad·非圆形盘non-circular pad·隔离盘isolation pad·非功能连接盘monfunctional pad·偏置连接盘offset land·腹（背）裸盘back-bard land· 盘址anchoring spaur·连接盘图形land pattern·连接盘网格阵列land grid array·孔环annular ring·元件孔component hole·安装孔mountin

16、g hole·支撑孔supported hole·非支撑孔unsupported hole·导通孔via·镀通孔plated through hole (PTH)·余隙孔access hole·盲孔blind via (hole)·埋孔buried via hole·埋 ,盲孔buried blind via·任意层内部导通孔any layer inner via hole·全部钻孔all drilled hole·定位孔toaling hole·无连接盘孔landless hole·中间孔interstitial hole·无连接盘导通