飞利浦有害物质

1、This agreement is made and entered into on / / (yy/mm/dd)and is effective upon execution (hereinafter referred to as “the effective date”) by and between: 本协议于 年 月 日(以下简称生效日)，由1)Massive NV., acting through its Philips Consumer Luminaires business,with offices at Satenrozen 13, 2550 Kontich, Belgium2

2、)Philips Consumer Luminaires ShenZhen Company Ltd, acting throughit Philips Consumer Lumiaires business, with offices at6F, Auxiliary Building of SheKou Technology Building, NanHai Road, SheKou,NanShan District, ShenZhen City, GuangDong Province, 518067, China3)Philips Electronics Hong Kong Limited,

3、 acting throughits Philips Consumer Lumiaires business, with offices atLevel 6, Three Pacific Place, 1 Queens Road East, Wanchai, Hong Kong(hereinafter referred to as “Philips”).(以下简称“飞利浦”)andhaving its registration at(hereinafter referred to as “Supplier”).和其注册地址为(以下简称“供应商”)签定生效。This agreement if o

4、ne of the Annexes of the Purchase Agreement. Supplier shall guarantee that all the articles (i.e. material, components, subassemblies, products) delivered to and used in Philips must be free of the “Restricted Substances” as mentioned in this Agreement.本协议作为采购合同的附件。供应商保证送往和用于飞利浦的物品(例如材料、成份、组件、产品)禁止含

5、有本协议提到的限用物质。This or newer versions of the present list can be found at Philips website:这个或更新的版本列表在飞利浦网站中可以找到：In case Chinese version has conflict with the English version, the English version shall prevail.如本协议中英两种文字解释有异议，应以英文本为准。A. Restricted Substances in all application所有用途限用的物质Substances物质Restri

6、ction Threshold ppm (mg/kg)¹限值 ppm (mg/kg)¹Asbestos (all types)石棉(所有类型)10Benzoapyrene苯并芘20Short duration skin contact ( 30 sec)与皮肤短时接触 ( 30 秒)1Long duration skin contact (> 30 sec)与皮肤长期接触 (> 30 秒)Beryllium and Beryllium compounds (see remark e)铍和铍化合物(参见备注e)1000Cadmium and Cadmium com

7、pounds (in plastics) (see remark d) 镉和镉化合物(塑胶)(参见备注d)100¹Cadmium and Cadmium compounds (in metal alloys) (see remark a) 镉和镉化合物(金属合金)(参见注a)100Hexavalent Chromium (Cr 6+) and Cr(6+) compounds (see remark b) 六价铬(Cr 6+)和铬化合物(Cr 6+)(参见备注b)1000Lead and Lead compounds (see remarks a, b and c) 铅和铅化合物(参

8、见备注a, b和c)1000Lead and lead compounds in outer sleeves of cables, according to Proposition 65 legislation, USA用于电缆外部套管的铅和铅化合物，根据美国法律65条 300Mercury and Mercury compounds (see remark a, d) 汞和汞化合物(参见备注a, d)1000¹Monomethyl tetrachlorodiphenyl methane (Ugilec 141) 单甲基四氯乙烷甲烷(Ugilec 141)10Monomethyl d

9、ichlorodiphenyl methane (Ugilec 121 or Ugilec 21) 甲基二氯二苯甲烷(Ugilec121或Ugilec 21)10Monomethyl dibromodiphenyl methane (DBBT) 甲基二溴二苯基甲烷(DBBT)单甲基二溴二苯基甲烷10Ozone depleting substances (see remark f)破坏臭氧物质(参见备注f)1Pentachlorophenol (PCP) and its salts and esters五氯酚(PCP)及其盐、酯类10Perfluoroctane sulfonates (PFOS

10、s) compounds (see remark g) 全氟辛烷磺化物(PFOSs)(参见备注g)1000Polybrominated diphenyl ethers (PBDEs) (see remark h) 多溴联苯醚(PBDEs)(参见备注h)1000Polybrominated biphenyls (PBBs)多溴联苯(PBBs)1000Polychlorinated biphenyls (PCBs)多氯联苯(PCBs)10Polychlorinated terphenyls (PCTs)多氯三联苯(PCTs)10Sum of all Polycyclic aromatic hydr

11、ocarbons (PAHs) (16 mentioned in EPA list)多环芳烃，EPA16条所提及200与皮肤短时接触 ( 30 秒)Short duration skin contact ( 30 sec)10与皮肤长期接触 (> 30 秒)Long duration skin contact (> 30 sec)¹Above this restriction threshold the substance is restricted and declaration of the substance is obliged. In fact, restric

12、ted substances are not to be intentionally used, that is, Royal Philips Electronics accepts that certain materials contain a certain amount of naturally occurring restricted substances. Thresholds can represent legal limits, or refer to currently accepted analysing thresholds. Furthermore these thre

13、sholds should be declared on component level. Substances are measured in homogeneous materials. Exemptions of specific applications, mentioned in legislation, are also exempted.¹这些物质超过以上的限值时都必须申报。限用的物质实际上也并非是故意使用的。也就是说，飞利浦承认某些材料含有一定量的天然的限用物质。阈值可以代表的是法定范围或指的是目前公认的分析。另外，超过限值的申报应该是就零组件中的限用物质含量而言的。

14、限用物质在同一均质材料中测定。法律提及某种特定应用的豁免在这里也是适用的。a. The restriction does not apply to exemptions in European Directive RoHS (2002/95/EC) - see Annex 1. Nevertheless declaration is still needed. The exemption for deca-BDE is not accepted by Philips. 该限制对欧洲RoHS指令的豁免项(2002/95/EC)不适用-见附件1。但仍需要声明。飞利浦不接受deca-BDE的豁免。b

15、. Does not apply to Medical equipment, which is presently excluded from the EU RoHS Directive. Neither does it apply to the exemptions in EU-RoHS.不适用于医疗设备，欧盟RoHS指令现不包括医疗设备。也不适用于欧盟RoHS指令的豁免项。c. Lead-based soldering in electronic circuit boards and other electric applications is exempted in automotive

16、 applications under the European ELV directive (2000/53/EC).根据欧洲ELV指令(2000/53/EC)，应用于汽车的电子线路板和其他电子设备中的含铅焊锡是豁免的。d. Mercury is allowed only in gas discharge lamps with certain conditions referred in EU RoHS exemptions. For Cadmium (in plastics only) and Mercury and their compounds declaration is oblig

17、atory above 50 ppm.欧盟RoHS豁免项中的特定条件下的应用于气体放电灯中的汞可豁免。当浓度高于50ppm时，镉(仅限于塑料制品)及其化合物、汞及其化合物必须声明。e. Be is exempted in the following applications:i) Be metal and BeO used in X-Ray applications,ii) BeO as ceramic heat-resistant in semiconductors, andiii) Be metal alloy (BeCu) in RF shielding in MR applicatio

18、ns.In other applications where no alternatives exist, exemptions may be granted. Waiver procedure as given in the Framework of Chemical Substances in Products and Processes Document must be followed:铍在下列应用中是豁免的：i) X射线中铍单质和氧化铍，ii) 氧化铍用于半导体热阻陶器，和iii) 铍合金(BeCu)在射频屏蔽中应用。在没有其他选择的情况下豁免也是允许的，但这种特殊使用必须遵循产品及

19、工艺中定义的化学物质的框架文件。具体可参考如下网址。alsSubstancesUsageProcedure.pdff. Ozone depleting substances, as published in 2000 in the Montreal protocol on substances that deplete the ozone layer: CFCs (Chlorofluorocarbons), HCFCs (Hydrogenated chlorofluorocarbons), Halons, Methyl Bromide, HBFCs (Hydrobromofluorocarbo

20、ns), 1,1,1-Trichloroethane, Carbon tetrachloride and bromochloromethane.臭氧层消耗物质，如在2000年出版的蒙特利尔议定书中消耗臭氧层的物质：含氯氟烃(氟碳化合物)、HCFCs(氟碳化合物)， 哈龙、溴甲烷、HBFCs(氢溴氟碳化合物)、1,1,1-三氯乙烯、四氯化碳和溴氯甲烷。g. Textile and coated materials: 1µg/m² of the coated material. Derogations (exemptions) proposed in the directive

21、 are collected in Annex 1.纺织品、涂层材料：1µg /平方米的涂层材料。有关减损(豁免)方面的指令见附件1。h. Polybrominated diphenylethers (PBDE) are the same as polybrominated biphenylethers (PBBE); polybrominated diphenyloxides (PBDO) are the same as polybrominated biphenyl oxides (PBBO).多溴联苯醚(PBDE)同多溴二苯醚 (PBBE)；Polybrominated dip

22、henyloxides(PBDO)同多溴联苯氧化物 (PBBO)。B. Additionally Restricted Substances in product packaging其他产品包装的限用物质Substances物质Restriction Threshold ppm (mg/kg)²限值 ppm (mg/kg)²Arsenic compounds, applied for wood packaging砷的化合物，用于木材的包装10Formaldehyde emission from composite wood packaging/transport mater

23、ial (Limit Formaldehyde emission from Hardwood Plywood (HWPW) (see remark i)复合木质包装/运输材料中的甲醛释放(甲醛释放量由(HWPW)限制)(参见备注i)0.1(0.08)Methyl bromide in gassing treatment of wood packaging/transport material木质包装/运输材料的气体处理中的溴化甲烷1Polyvinyl chloride (PVC) and PVC blends聚氯乙烯(PVC)和PVC混合物1000Sum of Heavy metals (Cd

24、, Hg, Cr(6+) and Pb)重金属的总和(镉、汞、六价铬、铅)100C. Additionally Restricted Substances in Batteries电池中的其他限用物质Substances物质Restriction Threshold ppm (mg/kg)²限值 ppm (mg/kg)²Cadmium (all batteries) (see remark b)镉(所有电池中)(参见备注 b)20Mercury for all batteries (excl button cells) (see remark i)所有电池中的水银(除了纽扣

25、电池)(参见备注 i)5Mercury for button cells (see remark j)纽扣电池的水银(参见备注j)20 000 D. Additionally Restricted Substances when used in specific applications特殊应用中的其他限用物质Substances物质Restriction Threshold ppm (mg/kg)²限值 ppm (mg/kg)²Remark备注Antimony in soda lime glass 钠钙玻璃中的锑1000Only applied in lamps只限于灯的

26、应用Arsenic in soda lime and borosilicate glass钠钙玻璃和硼硅酸盐玻璃中的砷1000Azo Colourants含氮染料30Only in direct and prolonged skin contact applications, when e.g., applied in leather and textiles. 只限于特定的长时间皮肤直接接触，例如皮革或纺织品.Tris-(1-aziridinyl) phosphinoxide三(1-氮丙啶)氧化膦10Tri-(2,3-dibromo-propyl) phosphate三(2,3-二溴-丙烷基

27、)磷酸盐10Benzene苯5As residue in materials作为原料残余物Formaldehyde (see remark l)(Limit Formaldehyde emission HWPW)甲醛(见注l)(限甲醛排放HWPW)0.1(0.08)Hexachlorobenzene and Trichlorobenzene灭黑穗药和1、2,4-三氯苯100Nickel and nickel alloys (see remark k)镍和镍合金(参见备注k)0.5µg/cm2/weekOnly in direct and prolonged skin contact

28、applications. 只有在直接与皮肤长期接触时Organostannic compounds有机锡化合物1000Organic Tin compounds (TBT, TPT and TBTO), applied in paints and as pigments and as agents for anti-oxidizing, anti- bacterial, anti-fungal, anti-septic, anti-staining and anti-fouling.有机锡化合物(TBT、TPT和TBTO)，应用于涂料、颜料和抗氧化性物质、抗菌、抗真菌、防腐败防污染情况下。P

29、AHs多环芳烃50In applications such as potting material for electronic ballast应用在如电子镇流器的灌封材料.Phthalates (see remark k) 邻苯二甲酸盐(参见备注k)1000Applied in toys and childcare articles适用于玩具和儿童用品Phenol and phenolic compounds (see remark m)苯酚和酚类化合物(参见备注m)50 mg/lApplied in toys and childcare articles and laminates of

30、printed wiring boards适用于玩具、儿童用品和薄型印刷线路板Polychloronaphtalenes短链氯化石蜡10>3 Cl atoms; applied as stabilizer and flame retardant in plastics 3 原子；应用为稳定剂和塑料阻燃剂Short-chain chlorinated paraffins聚乙烯氯化萘类1000(C10-C13); applied in paints and as flame retardant in PVC (C10-C13)；用于油漆及作为PVC阻燃剂²Above this re

31、striction threshold the substance is restricted and declaration of the substance is obliged. In fact, restricted substances are not to be intentionally used, that is, Royal Philips Electronics accepts that certain materials contain a certain amount of naturally occurring restricted substances. Thres

32、holds can represent legal limits, or refer to currently accepted analysing thresholds. Furthermore these thresholds should be declared on component level. Substances are measured in homogeneous materials. Exemptions of specific applications, mentioned in legislation, are also exempted.²这些物质超过以上

33、的限值时都必须申报。限用的物质实际上也并非是故意使用的。也就是说，飞利浦承认某些材料含有一定量的天然的限用物质。阈值可以代表的是法定范围或指的是目前公认的分析。另外，超过限值的申报应该是就零组件中的限用物质含量而言的。限用物质在同一均质材料中测定。法律提及某种特定应用的豁免在这里也是适用的。i. Threshold Mercury for all batteries in China is 1 ppm在中国，所有电池中的水银限值为1ppmj. This is equal to 2% w/w for mercury (Hg) for button cells这相当于纽扣电池中2% w/w水银k.

34、 Does not apply to Medical devices and associated equipment. Medical device safety standards require biocompatibility testing to ensure that chemical substances, which may contact patients during use per the device's intended use, do not pose a health risk, specifically with respect to biocompat

35、ibility.不适用于医疗器械及相关设备。医疗器械的安全标准要求生物相容性测试，以确保化学物质可以在使用过程中接触病人,而不会构成健康风险，特别是生物相容性方面。l. Formaldehyde: Emission from composite wood products, parts, and packaging. Emission from HWPW from 1 Jan 2010 onwards set to 0.05 ppm. Composite wood is defined by California Code of Regulations (CCR), Title 17, 931

36、20.1. Refer to CCR, title 17, 93120.9 for test methods.甲醛：复合木制品、零部件和包装中的排放。从2010年1月1日起HWPW排放为0.05ppm。复合木质品是由加利福尼亚综合法典规定(CCR)，标题17、93120.1。参阅CCR、检测方法17章 93120.9。m. CL (Consumer Lifestyle) requirements for phenol in laminates of printed wiring boards:CL(时尚生活事业部)在薄片印刷线路板排放的苯酚要求:l Emission to the air: &

37、lt;200 odor unit/m2/dayTest method: Measured in duplo according to NVN2820 (or NEN-EN 13725:2003) by TNO Apeldoorn, the Netherlands, with 10 dm2 of single sided copper added laminate after 3 days at room temperature in a PTFE bag of approximately 40 l.排放到空气中：< 200气味单位/平方米/日测试方法：根据Duplo一体化速印机实测，NV

38、N2820(或NEN-EN 13725：2003)，荷兰，TNO 10 dm2单边铜加层后三天内置于室温中在聚四氟乙烯大约为40l。l Phenol monomer : <50 mg/l phenolicsTest method: Phenolics content in water (according to ISO 6439) after shaking for 23 hours a mixture of 75 g of milled (to 3 mm) laminate in 1.5 l of demineralized water at pH 4).单体：< 50毫克/升酚

39、酚测试方法：在水中酚类物质含量(根据ISO 6439) 震荡23小时的混合物的75克研磨(3毫米)薄层在1.5 l软水在pH 4条件下测试。E. Additionally Restricted Substances used in specific industrial processes在某些工业过程的其他限制物质Substances物质Restriction限制Hexavalent Chromium (Cr 6+) and Cr (6+) compounds used in plating processes (see remark n, b)六价铬和铬六价铬化合物用于电镀工艺(见注n、b

40、)Not allowed in plating processes不允许用于电镀工艺Ozone Depleting Substances (see remark o)破坏臭氧物质(见注o)Not allowed in processes在工艺中不允许使用n. Due to the difficulties to control the plating Cr6+ process, posing compliance risks of products brought to the market by Philips, this substance must not be used in any

41、plating or passivation process.由于难以控制电镀过程中的六价铬，其会给飞利浦投放市场的产品带来风险，这种物质不得用于任何电镀或钝化工艺。o. Use of Ozone Depleting Substances in processes is subject of federal excise tax law applied to all imported electronics in USA.在生产过程中使用破坏臭氧层物质会受到美国进口电器联邦消费税法律的限制。ANNEX 1 List of Exemptions and Derogations (as of 15

42、 May 2008)附件1 豁免和减损的列表(2008年5月15日)RoHS Legislation (2002/95/EC)RoHS标准(2002/95/EC)No.编号Description描述Remark备注1Mercury in compact fluorescent lamps not exceeding 5 mg per lamp. 紧凑型荧光灯的汞含量不超过5毫克/灯泡 2Mercury in straight fluorescent lamps for general purposes not exceeding:一般用途的直管荧光灯中的汞含量不超过 2.1

43、halophosphate 10 mg卤代磷酸盐10毫克 2.2triphosphate with normal lifetime 5 mg正常寿命三磷酸盐5毫克 2.3triphosphate with long lifetime 8 mg长寿命三磷酸盐8毫克 3Mercury in straight fluorescent lamps for special purposes特殊用途的直管荧光灯中的汞 4Mercury in other lamps not specifically mentioned in this Annex本附件没有明确指出的其

44、它灯中的汞 5Lead in glass of cathode ray tubes, electronic components and fluorescent tubes阴极射线管、电子元器件和荧光灯管中的铅 6Lead as an alloying element in steel containing up to 0,35 % lead by weight, aluminium containing up to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight铅

45、作为合金元素在钢中不得超过0.35 %、在铝中不得超过0.4 %、在铜合金中不得超过4 % 7.1Lead in high melting temperature type solders (i.e. lead based alloys containing 85 % by weight or more lead)高熔点型焊料中的铅(即含85%或更多重量的铅) 7.2lead in solders for servers, storage and storage array systems, network infrastructure equipment for swit

46、ching, signalling, transmission as well as network management for telecommunications服务器、存储和存储系统、网络基础设施设备用于交换、信号、传动以及电信网络管理设备焊料中的铅 7.3lead in electronic ceramic parts (e.g. piezoelectronic devices)电子陶瓷部件中的铅(如压电陶瓷) 8Cadmium and its compounds in electrical contacts and cadmium plating except

47、for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations在电气接触和镉镀层中的镉及其化合物，除了91/338 / EEC指令禁止的(1)修正案76/769 / EEC(2)有关某些危险物质,化合物的销售、使用限制 9Hexavalent chromium as an an

48、ti-corrosion of the carbon steel cooling system in absorption refrigerators六价铬作为吸收式电冰箱碳钢冷却系统的防腐剂 9aDeca BDE in polymeric applications (exemption valid until 1 July 2008)Deca BDE在高分子中的应用 (豁免有效期至2008年7月1日)This exemption is being removed by the EU from the list of exemptions per July1st, 08. Furth

49、ermore, this exemption is not accepted by Philips see Table A这项豁免权已经被欧盟从08年7月1日豁免名单中删除。另外，飞利浦公司是不接受这豁免的见表A9bLead in lead-bronze bearing shells and bushes铜铅轴承壳套和衬套中的铅 11Lead used in compliant pin connector systems顺应针连接器系统中的铅 12Lead as a coating material for the thermal conduction module c-r

50、ing铅作为热传导模块C环的涂层材料 13Lead and cadmium in optical and filter glass光学及滤光玻璃中所含的铅及镉 14Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight用以连接插脚和微处理器封装的复合焊料(两

51、个元素以上)中的铅，并且铅的浓度在80-85%的重量之间 15Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages集成电路倒装芯片封装中半导体晶片和引线的电气连接焊料中的铅 16Lead in linear incandescent lamps线形白炽灯灯管中的铅 17Lead halide in High Intensity Disch

52、arge (HID) lamps used for professional reprography applications在专业复印应用的高强度气体放电灯(HID)中作为发光介质的卤化铅 18Lead as activator in the fluorescent powder of discharge lamps when used as sun tanning lamps () as well as () specialty lamps for diazo-printing reprography, lithography ()当放电灯作为含磷(如BSP(BaSi2O5：Pb

53、)的仿日晒灯，或作为含磷(如SMS(Sr,Ba)2MgSi2O7：Pb)的重氮复印、平版印刷、捕虫器、光化学和食品加工过程的专用灯时，放电灯荧光粉中作为触媒剂的铅含量在1%或以下 19Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL)紧凑型节能灯中主要汞齐合金作为特定成分PbBiSn-Hg 及PbInSn-Hg中的铅以及 PbSn

54、-Hg中为辅助汞齐合金中的铅 20Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs)用于液晶显示器(lcd)中用于连接前后平板萤光灯底材的玻璃中的二氧化铅 21Lead and cadmium in printing inks for the application of enamels on borosilicate glass硼硅酸盐玻璃表面瓷釉上印刷油墨中的铅与镉&

55、#160;22Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems光纤通讯系统稀土铁榴石法拉第旋转器中作为杂质的铅 23Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames until and lead in finishes of fine

56、 pitch components other than connectors with a pitch of 0.65 mm or less with copper lead-frames小螺距零部件表面抛光中的铅(螺距0.65mm的连接器中的铅、或螺距小于0.65mm镍铁铅框连接器中的铅、或螺距小于0.65mm铜铅框连接器中的铅不在豁免范围内) 24Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors通孔

57、盘状及平面阵列陶瓷多层电容器焊料所含的铅 25Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes等离子显示屏(PDP)及表面传导式电子发射显示器(SED)