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1、富士电机半导体：威柏电子FUJIV-IPMAPPLICATION MANUALSeptember 2012REH985URL http: /富士电机半导体：威柏电子中国区富士模块应用技术支持团队富士王鹏技术支持，富士华中，西南，西北技术支持:电子邮件：JerryWangwestpac-.hk华北，东北技术支持:：010-6212 7585 电子邮件：富士牟军青岛技术支持，富士：TonyMuwestpac-.hk华东，华北技术支持:：021-5489 1461 电子邮件：富士杨雪上海技术支持，富士：CindyYangwestpac-.hk华南技术支持:：0755-8826 2914 电子邮件：富

2、士吴龙技术支持，富士：WuLongwestpac-.hk威柏电子致力于中国，工业及新能源事业的发展AutomotiveIndustryNew Energy/IPM中国区一级-威柏电子富士电机威柏威柏上海威柏021-5489 1460021-5425 9682北京威柏010-6212 7585010-6212 7559青岛威柏0532-8823 15660532-8580 7948成都威柏威柏西安威柏029-8938 1667029-8938 1667(852)2763 5991 0755-8826 7606(852)2343 6979 0755-8826 7406028-8554 0368 0

3、27-8705 4728028-8554 0368 027-8775 4438富士电机半导体：威柏电子线-合作伙伴CONTENTSChapter 1Features and structure1. Features of-IPM1-22. Features of IPM by package1-33. Description of what are represented by type and lot number1-54. Line-up1-65. External appearances and dimensions drawing1-76. Structure1-11Chapter 2

4、Description of terminal marking and terms1. Description of terminal marking2-22. Description of terms2-3Chapter 3Description of functions1. List of functions3-22. Description of functions3-43. Truth table3-104. IPM block diagram3-125. Timing chart3-17Chapter 4Typical application circuits1. Typical a

5、pplication circuits4-22. Important points4-63. Photocoupler peripheral circuits4-94. Connector4-11Chapter 5Heat dissipation design1. Method for selection of heat sink5-22. Important points for selection of a heat sink5-23. How to mount the IPM5-3Chapter 6Precautions for use1. Main power supply6-22.

6、Control power supply6-33. Protective functions6-44. Power Cycling Capability.6-55. Others6-6Chapter 7Troubleshooting1. Troubleshooting7-22. Failure factor analysis charts7-23. Alarm factor tree analysis chart7-8 Chapter 1 Features and structure1Features of-IPM.1-22Features of IPM by package.1-33Desc

7、ription of what are represented by type and lot number.1-54Line-up.1-65External appearances and dimensions drawing.1-76Structure.1-111-1Table of ContentsPageChapter 1Features and structure1Features of-IPMAn IPM (intelligent power module) is an intelligent module mounting a control IC having a drive

8、circuit anda protection circuit built in anmodule. It provides the following features:1.1Built-in drive circuitDrives theunder the optimally configured conditions.The wiring length between the drive circuit and theTherefore, no reverse bias power supply is needed.is short and the drive circuit imped

9、ance is low.The number of required control power supply units is one (1) on the lower arm side, three (3) on theupper arm side; total four (4) units.1.2Built-in protection circuitOvercurrent protection (OC), short-circuit protection (SC), control power supply under voltage protection (UV), overheat

10、protection (TjOH), and external output (ALM) of these alarms areincorporated.OC and SC are functions to protect theagainst breakdown caused by overcurrent or loadshort-circuit. As these functions are implemented by detection of collector current by detectingelements built in eachthey permit protecti

11、on against disorder that occurs in anyand inaddition, they are capable of protecting theagainst arm short-circuit.UV is the protective function that works against drive power supply voltage drop, and it is built in everycontrol IC.TjOH provides a temperature detecting element on eachspeed against ab

12、normal chip heat-up.chip, and the protection works at highALM is the function to output an alarm signal to outside, and it is possible to positively stop the system by sending an alarm signal to the microcomputer that controls the IPM on occurrence of protected operation of OC, SC, UV and/or TjOH. *

13、1*1 See Chapter 3 Description of functions for details of protective functions of each IPM.1.3Built-in brake circuit (7in1 IPM) A brake circuit can be configured by adding a deceleration.that consumes electric power during A drive circuit and protection circuit are incorporated like in the inverter

14、unit.1.4Conformity to RoHS directive All types of V-IPM conform to RoHS directive.1-2Chapter 1Features and structure2Features of IPM by package2.1Small-capacity type (mounting lower arm <only> alarm output function; 6in1)600 V-series 20 A to 50 A and 1200 V-series 10 A to 25 A are lined up as

15、small-capacity type. (P629 package) P629 package products are of copper base type. They provide excellent heat dissipation performance. Control input terminals are of 2.54 mm standard pitch. Main terminals are of flat shape and are of the height same as that of control input terminals. Therefore, so

16、ldering connection on the same PCB is permitted.Trade-off of the switching loss with Vce (sat) is improved by the application of 6th generationthe total loss is reduced., andThe chip is protected against abnormal heat-up bychip overheat protection. *1overcurrent protection. *1Detection is made by se

17、nsemethod forMounting is compatible with that of R-IPM-series P619 package products.*1 Although the protective function is provided on the upper arm side, no alarm output function is available.2.2Medium-capacity small-size type (mounting upper and lower arm alarm output function;6in1)600V-series 50

18、A to 75 A and 1200 V-series 25 A to 50 A are lined up as medium-capacity small-size type. (P626 package) Control input terminals are of 2.54 mm standard pitch. Main terminals are of flat shape and are of the height same as that of control input terminals. Therefore, soldering connection on the same

19、PCB is permitted.Trade-off of the switching loss with Vce (sat) is improved by the application of 6th generationthe total loss is reduced., andThe chip is protected against abnormal heat-up bychip overheat protection.overcurrent protection.Detection is made by sensemethod for2.3Medium-capacity thin

20、type (mounting upper lower arm alarm output function, 6in1, 7in1)600 V-series 50 A to 200 A and 1200 V-series 25 A to 100 A are lined up as medium-capacity thin type. (P630 package) Control input terminals are of 2.54 mm standard pitch, and they can be connected using a general-purpose connector or

21、by soldering.Insertion of a PCB connector is easy thanks to use of guide pins. Main terminals are of M4 screw threads.1-3Chapter 1Features and structureThe diameter of screws for mounting to the heat sink is M4, which is common with that of main terminals.Electrical connection is entirely made by sc

22、rews and connectors. No soldering is required anddismounting is easy.Trade-off of the switching loss with Vce (sat) is improved by the application of 6th generationthe total loss is reduced., andThe chip is protected against abnormal heat-up bychip overheat protection.overcurrent protection.Detectio

23、n is made by sensemethod for2.4Large-capacity type (mounting upper lower arm alarm output function; 6in1, 7in1)600 V-series 200 A to 400 A and 1200 V-series 100 A to 200 A are lined up as large-capacity type.(P631 package)Main power supply input terminals (P1, P2, N1, N2), brake terminal (B) and out

24、put terminals (U, V, W) are located in proximity to each other, and the package structure permits easy main wiring. Terminals P1 and P2 and terminals N1 and N2 are connected inside.Main terminals permit positive connection of large current by M5 screws.The diameter of screws for mounting to the heat

25、 sink is M5, which is common with that of main terminals.Electrical connection is entirely made by screws and connectors. No soldering is required anddismounting is easy.Trade-off of the switching loss with Vce (sat) is improved by the application of 6th generationthe total loss is reduced., andThe

26、chip is protected against abnormal heat-up bychip overheat protection.overcurrent protection.Detection is made by sensemethod forMounting is compatible with that of R-IPM-series P612 package products (excluding control terminalportions).1-4Chapter1Featuresandstructure3Description of what are represe

27、nted by type and lot number Type6 MBP50 V BA060-50Msequential numberVoltage rating060: 600 V120: 1200 VSeries sequential numberPackageA: P629 B: P626 D: P630 E: P631Series nameCurrent rating of inverter unitRepresents “-IPM”Number of main elements7: With built-in brake 8: Without brake Lot number2 1

28、 0 0 0Sequential number (001 to 999)Month of production1: JanuaryO: October N: November D: DecemberYear of production2: 20123: 20134: 2014 LabelLot NoCountry of productionand place of productionData matrix1-56MBP50VBA060-5050A 600VChapter1Featuresandstructure4Line-up600V-series1200V-series1-6Package

29、Current ratingP629P626P630P63110A6MBP10VAA120-50-15A6MBP15VAA120-50-25A6MBP25VAA120-506MBP25VBA120-507/6MBP25VDA120-50-35A6MBP35VBA120-507/6MBP35VDA120-5050A-6MBP50VBA120-507/6MBP50VDA120-50-75A-7/6MBP75VDA120-50-100A-7/6MBP100VDA120-507/6MBP100VEA120-50150A-7/6MBP150VEA120-50200A-7/6MBP200VEA120-50

30、PackageCurrent ratingP629P626P630P63120A6MBP20VAA060-50-30A6MBP30VAA060-50-50A6MBP50VAA060-506MBP50VBA060-507/6MBP50VDA060-50-75A-6MBP75VBA060-507/6MBP75VDA060-50-100A-7/6MBP100VDA060-50-150A-7/6MBP150VDA060-50-200A-7/6MBP200VDA060-507/6MBP200VEA060-50300A-7/6MBP300VEA060-50400A-7/6MBP400VEA060-50Ch

31、apter1Featuresandstructure5External appearances and dimensions drawingNote: 1.The dimension shown in £ represents the theoretical dimension.The terminal pitch is the dimension measured at the root.Dimensions in ( ) are given for information only.Terminals: Sn-Cu plating (soldering specification

32、)2.3.4.Unit of dimensions: mmFigure 1-1External appearances and dimensions drawing (P629)Target type: 6MBP20VAA060-506MBP30VAA060-506MBP50VAA060-506MBP10VAA120-506MBP15VAA120-506MBP25VAA120-501-7Chapter1FeaturesandstructureNote:1.The dimension shown in £ represents the theoretical dimension. Th

33、e terminal pitch is the dimension measured at the root. Terminals: Sn-Cu plating (soldering specification)2.3.Unit of dimensions: mmFigure 1-2External appearances and dimensions drawing (P626)Target type: 6MBP50VBA060-506MBP75VBA060-506MBP25VBA120-506MBP35VBA120-506MBP50VBA120-501-8Chapter1Featuresa

34、ndstructureNote: 1.The dimension shown in £ represents the theoretical dimension.The terminal pitch is the dimension measured at the root.Dimensions in ( ) are given for information only. Main terminals: Ni platingControl terminals: Ni plating on the ground, Au plating on the surface(connector,

35、 soldering specification)The guide pins located on both sides of a control terminal are made of brass.(They are insulated in the interior and are not connected to any object.).Unit of dimensions: mmFigure 1-3External appearances and dimensions drawing (P630)Target type:7/6MBP50VDA060-507/6MBP

36、75VDA060-507/6MBP100VDA060-507/6MBP150VDA060-507/6MBP200VDA060-507/6MBP25VDA120-507/6MBP35VDA120-507/6MBP50VDA120-507/6MBP75VDA120-507/6MBP100VDA120-501-9Chapter1FeaturesandstructureNote: .The dimension shown in £ represents the theoretical dimension. The terminal pitch is the dimension

37、measured at the root.Dimensions in ( ) are given for information only. Main terminals: Ni platingControl terminals: Ni plating on the ground, Au plating on the surface (connector, soldering specification)The guide pins located on both sides of a control terminal are made of brass.(They are insulated

38、 in the interior and are not connected to any object.)5.Unit of dimensions: mmFigure 1-4External appearances and dimensions drawing (P631)Target type: 7/6MBP200VEA060-507/6MBP300VEA060-507/6MBP400VEA060-507/6MBP100VEA120-507/6MBP150VEA120-507/6MBP200VEA120-501-10Chapter1Featuresandstructure6Structur

39、e* This drawing was prepared for explanation of the material. It does not represent accurate chip size or layoutFigure 1-5Structure (P629)1-11No.Component nameMaterial (main)Remarks1Insulated substrateCeramics2chipSilicone3FWD chipSilicone4Printed circuit board (PCB)Glass epoxyHalogen-free5IC chipSi

40、licone6BaseCopperel plating7Main terminalCopperGround:el plating Surface: Sn-Cu plating8CoverPPS resinUL 94V-09CasePPS resinUL 94V-010WireAluminum11GelSilicone resin12Control terminalBrassGround:el plating Surface: Sn-Cu platingChapter1Featuresandstructure* This drawing was prepared for explanation

41、of the material. It does not represent accurate chip size or layoutFigure 1-6Structure (P626)1-12No.Component nameMaterial (main)Remarks1Insulated substrateCeramics2chipSilicone3FWD chipSilicone4Printed circuit board (PCB)Glass epoxyHalogen-free5IC chipSilicone6BaseCopperel plating7Main terminalCopp

42、erGround:el plating Surface: Sn-Cu plating8CoverPPS resinUL 94V-09CasePPS resinUL 94V-010WireAluminum11GelSilicone resin12Control terminalBrassGround:el plating Surface: Sn-Cu platingChapter1Featuresandstructure* This drawing was prepared for explanation of the material. It does not represent accura

43、te chip size or layoutFigure 1-7Structure (P630)1-13No.Component nameMaterial (main)Remarks1Insulated substrateCeramics2chipSilicone3FWD chipSilicone4Printed circuit board (PCB)Glass epoxyHalogen-free5IC chipSilicone6BaseCopperel plating7Main terminalCopperSurface:el plating8CoverPPS resinUL 94V-09C

44、asePPS resinUL 94V-010WireAluminum11GelSilicone resin12Control terminalBrassGround:el plating Surface: Au plating13Guide pinBrassChapter1Featuresandstructure* This drawing was prepared for explanation of the material. It does not represent accurate chip size or layoutFigure 1-8Structure (P631)1-14No

45、.Component nameMaterial (main)Remarks1Insulated substrateCeramics2chipSilicone3FWD chipSilicone4Printed circuit board (PCB)Glass epoxyHalogen-free5IC chipSilicone6BaseCopperel plating7Main terminalCopperSurface:el plating8CoverPPS resinUL 94V-09CasePPS resinUL 94V-010WireAluminum11GelSilicone resin1

46、2Control terminalBrassGround:el plating Surface: Au plating13Guide pinBrassChapter1Featuresandstructure Main terminals of IPM (screw type)The structure of the main terminal unit is indicated below:ElectrodeArea A sectionProductScrewMain terminalNutAFigure 1-9Structure of main terminal unit of IPM (Example: P630)Table 1-1Specification for IPM main terminal unitUnit: mm Guide pins of IPMThe g