从集成电路芯片看物联网和系统安全

1、从集成电路芯片角度看物联网和系统安全技术创新，变革未来ContentsINTRO TO IOTVLSI ATTACKSREVERSE ENGINEERING CASE STUDYInternet of Things (IoT)Expanding Adoption of IoTA Recent Survey of IoT Adoption0%10%20%30%40%50%Transportation Automotive Healthcare AgricultureBuilding automation Energy management Connected/smart cities Indus

2、trial automation Home automationIoT platform/middleware20172016Internet of Things (IoT) by 202020204BILLIONConnected People$4TRILLIONRevenue Opportunity25+ MILLIONAppsGBs of Data25+50BILLION TRILLIONEmbedded and Intelligent SystemsIoT Design and StructureWeb Services (Weather, SNS, )Internet of Thin

3、gsSoftware CodeHardware PlatformApplicationsDevice Data CollectionDevice Control & MonitoringMashup ServiceCloud toSupport IoTMicroprocessorHow To Ensure IoT Security?Cross-Layer: Technical cybersecurity solutions should take various layers of computing systems into consideration.Hardware LayersLaye

4、red View of Computing SystemsSoftware LayersHardware-Software BoundaryWHY INTEGRATED CIRCUITS (IC, AKA VLSI) SECURITYIntroduction to Secure BootEstablish a root oftrustStart code execution from a trusted sourceHave trusted source check next step of the code chainProcessorBoot CodeExternal codecheckP

5、Faasisl: pexaencicu(t)eSecure Boot ChainProcessorBoot CodeExternal codecheckMore External CodeBypassing Boot ProcessBoot Process Security ValidationModern SoCs are designed to provide high flexibilityDilemma: Flexibility vs securityTask: Evaluate the security implications of all possible bootconfigu

6、rationsCase study: TI Sitara AM3703 SoCPCB Reverse EngineeringTop viewSide viewChip Reverse EngineeringNXP MifareProprietary cryptographic algorithm: CRYPTO-1Reverse engineering: Algorithm and LFSR structureWidely used in ID cardsIC Supply ChainGlobal Integrated Circuit (IC) Supply ChainManufacturin

7、gTesting and PackagingUsageDesignG2i0 G1i1G3G4i2i3i4What software developers see.What hardware developers see.Integration Circuit (IC) Reverse EngineeringNetlist recovery by a foundry or end-user threatens intellectual property andfacilitates system level exploitation.The technology is advancingPack

8、aged ICDieDelayering, Imaging, RecognitionG2i0 G1i1G3G4i2i3i4NetlistFICS Research SeCurity and AssuraNce (SCAN) LabCourtesy of FICS UFImaging and Circuit Edit Capabilities100 m1 m100 nm10 nm1 nmDestructiveNondestructiveLYRA-3 XMH(Gallium FIB-SEM)FERA3-GMH( Plasma FIB-SEM)Skyscan 2211 (X-ray Micro CT

9、)Imaging ResolutionMilling rate2000 m3/s200 m3/sOrion NanoFab (He-Ne FIB)20 m3/sCourtesy of FICS UFOptical Backside AnalysisPhoton EmissionLaser Stimulation/Fault Injection Optical Contactless ProbingCourtesy of Shahin Tajik FICSPHOTON EMISSION ANALYSIS (PEM)Combinatorial vs. Sequential LogicCombina

10、torial Logic: AND, OR, NOT, XORs, etc.Sequential Logic: Counter, Shift Register, State Machines, etc.Presence of Clock in Sequential LogicAltera MAX V (180 nm)Courtesy of Shahin Tajik FICSRing-Oscillator EmissionIdentical Switching Frequency by all LEsSwitching frequency independent and generally higher than clock frequencyApplications: TRNG and In