PCB生产工艺及其说明

1、发料贴膜发料贴膜外层线路制作脱脂曝光粗化显影枯燥线路图形电镀干膜压合去膜曝光蚀刻显影去膜蚀刻防焊漆涂布去膜端子电镀粗化印字压板成型钻孔清洗去胶渣终检化学镀铜包装全板镀铜成品程InnerLayerProcessIssue MaterialDegreasingOuter Layer ProcessOuter Layer ResistLaminationExposureRoughingDevelopingDryingPattern PlatingDry Film LaminationFilm StrippingExposureEtchingDevelopingResist Tin Stripping

2、EtchingSolder Resist CoatingStrippingMetal FinishRoughingLegend PrintLaminationHole DrillingPlating-Through Holes ProcessDe-smearShapingCleaningElectro-less CopperPlatingFinal InspectionPackingPanel PlatingFinished Goods一、发料此工艺的目的是为了将大张的电路板基材，裁切成一般电路板制造操作的尺寸基材一般是外表掩盖有铜箔的环氧树脂基板The purpose of this pro

3、cess is to cut the sheet size of copper clad laminate to working size forproduction.基材的构造：铜箔环氧树脂铜箔以下其次至第九项是内层线路制作过程：二、脱脂去除基材外表的污垢之类，一般使用碱性的药剂。三、粗化粗糙化相当光滑的基材外表，增加铜箔与阻光膜等物料的结合力。四、枯燥枯燥经过处理的基材的工艺。五、干膜压合这个工艺的目的是制作感光性蚀刻的阻抗层。它的过程是利用一种所谓的“干膜光阻” 物料，用热压的方式贴附在基材上。The purpose of this process is to create a phot

4、osensitive resist layer on boards. The coating material used in PCB inner layer process in so called “Dry Film”. Using a hot roll laminator, dry film can be laminated on boards.经过干膜压合之后的基材：阻光膜(Dry film)铜箔环氧树脂铜箔阻光膜(Dry film)六、曝光利用曝光将底片影像转移到板面。Transfer the image from artwork to boards through exposure

5、 process.七、显影去除未曝光局部的干膜，使那些局部的铜箔曝露出来。八、蚀刻将曝露出来的铜箔蚀刻掉。九、去膜又称为剥离，将阻光膜(Dry Film)剥离的工艺。至此，内层板的线路形成。十、粗化 需要再次对基材外表进展粗糙化处理，做出适当的粗糙度以强化环氧树脂与金属的结合力。此工艺过程又称黑化。Make roughness on pattern surface for increasing bonding strength between copper and resin.十一、压板压合多层的线路板。内层板可以有很多层，具体的层数依据具体客户的需要而定。Organize the board

6、 sequence & stacking.下面是经过压板之后的线路板：铜箔胶片内层板胶片内层板胶片内层板胶片铜箔十二、钻孔通，无法达成多层电路板连通的目的，因此需要利用机械钻孔的方法将层间打通。Create connecting channels between metal layers. After boards are laminated, there is nointerconnection between layers so we need to create thru holes to achieve connection.以下第十三至第十五项是镀通孔工艺过程：十三、去胶渣去除钻孔过

7、程中所产生出来的胶渣，避开残渣对于内部线路导通所造成的困扰。De-smear process function are to remove smear from hole-walls.去胶渣的步骤如下：溶胀清洗高锰酸钾去胶渣清洗中和复原清洗对各个步骤的解释：1、溶胀溶胀的目的是通过溶胀使环氧树脂软化，为高锰酸钾去胶渣做预备。依据“相像相溶” 有肯定的溶解性。由于醚能与水发生氢键缔合，所以在水中有肯定的溶解性。因此，常用水溶性的醚类有机物作为去胶渣的溶胀剂，比方已二醇乙醚。2、高锰酸钾去胶渣高锰酸钾是一种强氧化剂，在高温碱性条件下，高锰酸钾能使环氧树脂碳链氧化裂解：4424MnO -+环氧树脂+

8、4OH-=4MnO 2-+CO (g)+2H 442同时，高锰酸钾会发生以下副反响：4424MnO -+4OH-=4MnO 2-+O (g)+2H 4424MnO 2-也会发生以下副反响：442MnO 2-+2H O+2e-=MnO (s)+4OH42这些副反响会生成锰酸钾和二氧化锰，并和高锰酸钾一起残留在钻孔当中。3、中和复原去除高锰酸钾去胶渣过程残留的高锰酸钾、锰酸钾和二氧化锰。化学反响式如下：3MnO2-+4H+=2MnO -+MnO (s)+2H O442242422MnO -+5C O 2-+16H+=2Mn2+10CO (g)+8H 4242C O 2-+ MnO +4H+=Mn2

9、+2CO +2H O24222十四、化学镀铜能在后续工艺中使用电镀方法Electro-less coppersdepositionsfunctions areconditioning the hole wall andcoat withconductive metal layer for post plating.十五、全板镀铜全板镀铜的主要目的是为了加厚孔内的铜层厚度 因此这种程序被称为“全板镀铜The method of copper electro panel plating is depositing more copper on the holes wall. Becauseat t

10、his point there is non-pattern on boards yes so the processes have been called“Panel Plating”.以下第十六至其次十二项是外层线路制作过程：十六、贴膜和内层线路制作中的干膜压合类似。十七、曝光和内层线路制作中的曝光类似。十八、显影和内层线路制作中的显影类似。十九、线路图形电镀经过干膜压合、曝光、显影之后，将来所需要的线路包括内层的和外层的已经曝露出来。此时再在线路的区域镀铜，孔内的铜层亦会连续加厚。当铜层厚度足够以后，停顿镀After outer layer resist lamination, expo

11、sure, developing, the pattern area is exposed. The PCB will then be loaded in plating equipment for pattern and through holes plating. After build enough copper in hole the boards will be coated with thin layer of tin as etching resist. The total process above is so calledPattern Plating”.二十、去膜又称为剥离

12、，将外层线路的阻光膜剥离的工艺。二十一、蚀刻将曝露出来的铜箔蚀刻掉。二十二、去锡将外层线路作为蚀刻阻剂的锡去掉。二十三、防焊漆涂布，这种局部保护电路板的高分子材料被称为“防焊漆PCBs main function is carrier of components. For selective interconnection issue, makers have to define the assembly area for assemblers. Especially the areas that are not for soldering, then makers will use some material to protect for preventing damage or oxidation. This material is called“Solder Resist”.