PCB工艺流程演示文稿

PCB工艺流程演示文稿当前1页，总共37页。优选PCB工艺流程当前2页，总共37页。一、多层板内层制作流程BROADTECHOLOGYINC.BROADTECHOLOGYINC.显影DEVELOPING曝光EXPOSURE压膜LAMINATION去膜STRIPPING

蚀刻铜ETCHING黑化处理

BLACKOXIDE烘烤BAKINGLAY-UP预叠及叠板后处理

POSTTREATMENT压合LAMINATION内层图形转移INNERLAYERIMAGE预叠及叠板LAY-UP蚀刻I/LETCHING钻孔DRILLING压合LAMINATION内层制作流程

INNERLAYERPRODUCTMLPCBAOI检查AOIINSPECTION裁板LAMINATESHEARDOUBLE

SIDE当前3页，总共37页。二、多层板外层制作流程BROADTECHOLOGYINC.BROADTECHOLOGYINC.孔金属化P.T.H.钻孔DRILLING外层图形转移OUTERLAYERIMAGE图形电镀铜/锡PATTERNPLATING检查INSPECTION

前处理

PRELIMINARYTREATMENT图形电镀铜PATTERNPLATING蚀刻

ETCHING全板镀铜PANELPLATING外层制作OUTER-LAYERO/LETCHING蚀刻TENTINGPROCESSDESMER除胶渣

E-LESSCU孔金属化

前处理PRELIMINARYTREATMENT退锡

T/LSTRIPPING去膜STRIPPING

压干膜LAMINATION镀锡T/LPLATING曝光EXPOSURE当前4页，总共37页。三、外形制作和成品检查流程BROADTECHOLOGYINC.BROADTECHOLOGYINC.阻焊印制LIQUIDS/M

外观检查VISUALINSPECTION

成形FINALSHAPING检查

INSPECTION

测试ELECTRICALTEST出货检查OQC成品PACKING&SHIPPING印制阻焊油

S/MCOATING前处理

PRELIMINARY

TREATMENT曝光EXPOSUREDEVELOPING显影POSTCURE后烘烤预干燥

PRE-CURE热风整平HOTAIRLEVELINGOSP表面防氧化处理OSP(EntekCu106A)HOTAIRLEVELING

G/FPLATING镀金手指化学镍/金E-lessNi/AuForO.S.P.字符印制SCREENLEGEND选择性镀镍/金SELECTIVEGOLD当前5页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.附件：典型多层板制作流程1.内层开料2.内层线路压膜当前6页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.4.内层线路显影3.内层线路曝光当前7页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.5.内层线路蚀刻6.内层线路去膜当前8页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.7.叠板8.层压LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6当前9页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.9.钻孔10.孔金属化当前10页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.11.外层线路压膜12.外层线路曝光当前11页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.13.外层线路显影14.图形电镀铜/锡当前12页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.15.外层去膜16.外层蚀刻铜当前13页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.17.退锡18.阻焊印制当前14页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.19.浸金或热风整平当前15页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.四、PCB各制程物料消耗COPPERFOILEpoxyGlass1、下料裁板物料消耗：2、拼板废弃的覆铜板1、成品加工板料消耗当前16页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.PhotoResist2、内层图形转移物料消耗：1、干膜或湿膜（光致油墨）当前17页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.Artwork(底片)Artwork(底片)光源3、曝光物料消耗：PhotoResist曝光后1、菲林2、UV灯管当前18页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.PhotoResist4、内层显影物料消耗：1、显影液（碳酸钾等）当前19页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.PhotoResist5、内层蚀刻物料消耗：1、蚀刻液2、蚀刻含铜废液当前20页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.6、去膜物料消耗：1、NaOH当前21页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.7、黑化/棕化处理物料消耗：1、当前22页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayer8、叠板和层压物料消耗：1、半固化片（PP料）2、层压垫纸（垫膜）3、边/废料（PP料和垫膜等）当前23页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.墊木板鋁板10、钻孔物料消耗：1、钻咀2、铝板3、垫板当前24页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.11、孔金属化与全板镀铜物料消耗：1、凹蚀（除胶渣）液2、整孔剂3、中和剂、预浸剂4、活化剂、加速剂5、沉铜液6、镀铜液7、废槽液的回收当前25页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.PhotoResist12、外层图形转移物料消耗：1、干膜或湿膜（光致油墨）2、网版3、胶带及校正纸张当前26页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：13、外层曝光曝光后1、黄/黑菲林2、UV灯管当前27页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.14、外层显影物料消耗：1、显影液（碳酸钾等）当前28页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：15、图形电镀铜/锡1、除油剂2、粗化液3、镀铜液4、镀锡液5、铜球和锡条6、添加剂当前29页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：16、去膜1、NaOH当前30页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：17、外层蚀刻铜1、蚀刻液2、蚀刻含铜废液当前31页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：18、退锡1、退锡液当前32页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：19、阻焊印制1、阻焊绿油2、网版3、胶带及校正纸张当前33页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.S/MA/W光源物料消耗：20、阻焊曝光1、菲林2、UV灯管当前34页，总共37页。BROADTECHOLOGYINC.BROADTECHOLOGYINC.物料消耗：21、阻焊显影1、显影液（碳酸钾等）当前35页，总共37页。BROADTECHOLOGY