ASM IHAWK教材 BSOB BBOS参数设定

本文格式为Word版，下载可任意编辑——ASMIHAWK教材BSOBBBOS参数设定ASMASMAdvancedProcessTraining–WBDevelopmentGroupTailBreakBSOB/BBOSControlBondStitchOnBall(BSOB)/BondBallOnStitch(BBOS)/ContentsaresubjecttochangewithoutpriornotificationCompanyConfidentialASMASMAdvancedProcessTraining–WBDevelopmentGroupConceptandTheory?Applicationisveryusefultodietodiebonding?Improvedqualityandreliabilityondietodiebonding?EliminatescapillarymarkwhilepromotinggoodintermetallicbetweenballandsurfaceThebumpballformationprocessisalmostlikebondinganormalwire,including1stbond,loopingand2ndbondparameters.BSOBBBOSContentsaresubjecttochangewithoutpriornotificationCompanyConfidentialASMASMAdvancedProcessTraining–WBDevelopmentGroupBallParametersforBSOBandBBOS?ScrubDistance–Thiscontrolsthehorizontalmovementofthecapillarywithascrubbingmotiontoweakenthewireattheneck.–Range5–30(*0.8um)ScrubDistanceContentsaresubjecttochangewithoutpriornotificationCompanyConfidentialASMASMAdvancedProcessTraining–WBDevelopmentGroupWireParametersforBSOBandBBOS?2ndBondPtOffset–Wireoffsetparameterrequiredtoensuremaximumcontactareabetweenthestitchbondandtheball–Range10–30(*0.8um)2ndBond(wedge)StandoffballCapillaryPositionduringstitchbondContentsaresubjecttochangewithoutpriornotificationCompanyConfidentialASMBondStitchOnBall-BSOB說明：主要使用在MCM或是Stackdie的產品上，其他需要較佳的Wirepull時也可以使用。2ndBond(wedge)1stBondDie1Die2BondBall圖1:BondStickOnBall(BSOB)5

ASMBondBallOnStitch(BBOS)/SecurityBond說明：BBOS是為了保證銲線的安全性，這個製程主要是在2nd點銲再植上一個球以確保銲著性。(圖2)1stDie1BondLeadBondBall2ndBond(wedge)圖2:BondBallOnStitch(BBOS)6ASMBSOB植球參數控制選單7ASM植球動作順序：1.先在‘’Device2‘’上執行燒球動作‘’FAB2‘’。FAB2Device1Device28ASM2.針下降到鋁墊上：運用1stBond植球的參數形成‘BallThickness’and‘BallSize’W/clamp‘打開’CapillaryDevice1Device2植球過程是運用植球參數。9ASM3.瓷嘴上昇：瓷嘴上昇是設定LoopBase瓷嘴與測高點之間的距離是‘’Loopbase‘’。線夾‘open’接觸點LoopBase實際‘’Loopbase‘’=設定x10um假使Loopbase=2實際‘’Loopbase‘’=20umDevice1Device2建議設定=210

ASM4.XYtable移動朝向1stBond或是2ndBond的方向：+值朝向2ndbond-值朝向1stbondW/clamp‘open’BallOffset設定參數=Settingx0.8um假使BallOffset設定=22實際的Balloffset數值=19.6umDevice1Device2建議設定參數=-ve3511ASM5.瓷嘴下降到金球上輸出2ndBond的參數：瓷嘴下降設定BallThickness輸出BOSB2ndbaseparameterW/clamp‘open’BallThicknessContactPt.Device1Device2※球厚度的距離時設定在測高點與瓷嘴Tip之間。※建議數值=212ASM6.瓷嘴水平移動作刮擦的動作扯弱球頸部的餘線：ScrubDistance的設定是針對瓷嘴的移動一般會讓針頭移動離開金球上刮擦時移動離開金球W/clamp‘’打開’’實際刮擦的距離設定=設定數值x0.8um假使‘’Scrubdistant‘’=10實際移動距離=8umDevice1Device213建議設定=8ASM7.瓷嘴上昇做tailheight：瓷嘴上昇設定Taillength。W/clamp‘’關閉‘’Device1Device2建議設定=3514ASM8.瓷嘴上昇與扯斷線尾，B/H移動到燒球高度：W/c‘close’Device1Device215

ASM9.EFO燒球：FABBondBallDevice1Device216ASMBSOB銲線參數17ASM植球後銲線2ndBond：2ndBond(wedge)1stBondBondBallDevice1Device1Device218ASMnd2Bond銲線位置偏移魚尾位置瓷嘴針孔位置植球位置-值向著1stBond+值向著2ndBond19ASMBSOBBall植球控制參數的定義4.1)LoopBase這個參