CCM产品工艺知识培知识课件

CCM产品工艺知识培训日期:2011.8.20

产品的应用产品的类型产品的构造产品的制作工艺问与答附录:专业名词介绍2PartI产品的应用3PartI产品的应用拆解拆解手机摄像模组4PartII产品的类型◆软板定焦模式(FF)1.B-To-B2.GoldFinger5PartII产品的类型◆软板变焦模式1.手动变焦(MF)

2.自动变焦(AF)6PartII产品的类型◆插槽模式(Socket)7PartII产品的类型■像素分类CIF(352*288)10万像素(0.1M)VGA(640*480)30万像素(0.3M)SXGA(1280*1024)130万像素(1.3M)UXGA(1600*1200)200万像素(2.0M)8PartIII产品的构造●CSP(ChipScalePackage)ChipLensBarrelHolderIRFilterstiffenerFPCSolderBallGlass9PartIII产品的构造●COB(ChipOnBoard)ChipLensBarrelHolderIRFilterFingerGoldWireFPCPCB10PartIII产品的构造镜头(Lens)镜座(Holder)芯片(Chip)电路板(PCB)连接器(Con.)11PartIII产品的构造CMOSCHIPLENSHOLDERLENSBARRELThese3itemscomeasanassembly1stLENSELEMENT2ndLENSELEMENTIRGLASSSUBSTRATEFPC12PartIV产品的制作工艺★材料1.晶圆(Wafer)

主要是由硅和锗组成,是摄像头模组的核心部分,称之为影像传感器。13PartIV产品的制作工艺2.线路板

PrintedCircuitBoard印刷电路板,是电子元器件的支撑体,是电子元器件电气连接的提供者,简称PCB.14PartIV产品的制作工艺3.镜座(Holder)

15PartIV产品的制作工艺4.镜头(Lens)16PartIV产品的制作工艺5.软板(FPC)

FlexibleCircuitBoard软性印制电路是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性绝佳的可挠性印刷电路。

17PartIV产品的制作工艺★工艺流程

Wafer清洗Plasma清洗固晶固晶烘烤邦线金线检查DAM邦定DAM烘烤二流体清洗CCD检查Glass贴附CCD检查固化半成品测试18ProcessSupplyWaferTrayOKOKOKOKN/AOKN/AOKIRGlassAttachProcessCM800BarrelInsertProcessCM800dispenseCMOSChipdispenseIRGlassdispense++++LensBarrelDieAttachProcessCM800HolderAttachProcessCM80019PartIV产品的制作工艺DieBonding:使芯片与PCB粘合。注意点：1.芯片方向2.胶量3.顶针和吸嘴印4.芯片角度5.芯片位置6.芯片倾斜

20PartIV产品的制作工艺WireBonding:通过金线焊接使芯片与PCB线路导通。注意点：1.接线是否正确2.线弧3.金球大小4.金球厚度5.金线拉力6.金球推力

21SolderPasteScreenPrintPassivePlacementForDieAttachPassiveSolderPastePassiveSubstrate22DieAttachWireBondingWetCleanChipSensorAreaAuWireChipSensorAreaAuWire23IRGlassMountIRGlassSAWWaferRingIRGlassIRGlass24GlueDispenseIRGlassAttachHolderHolderGlueGlueIRcutGlassIRGlassCA800-IRCA800-IR25GlueDispenseHolderAttachGlueGlueBarrelInsertBarrelHolderCA800-HACA800-HACA-800-BI26Singlationcutcut27FocusadjustBarrelBarrelFixationMotorLighting（PercolationMethod)chartAchromaticLensND4（AdjustmentofLightQuantity）Laser28PartV问与答Q&A29PartVI专业名词介绍30ENDThanks!31BondingProcess32padleadFreeairballiscaptured

inthechamfer33padleadFreeairballiscaptured

inthechamferSEARCHHEIGHT34padleadFreeairballiscaptured

inthechamferSEARCHSPEED1SEARCHTOL135Freeairballiscaptured

inthechamferpadleadSEARCHSPEED1SEARCHTOL136Freeairballiscaptured

inthechamferpadleadSEARCHTOL1SEARCHSPEED137Freeairballiscaptured

inthechamferpadleadSEARCHTOL1SEARCHSPEED138Freeairballiscaptured

inthechamferpadleadSEARCHTOL1SEARCHSPEED139FormationofafirstbondpadleadSEARCHSPEED1SEARCHTOL140FormationofafirstbondpadleadSEARCHSPEED1SEARCHTOL1IMPACTFORCE41Formationofafirstbond

ContactpadleadheatPRESSUREUltraSonicVibration42Formationofafirstbond

BasepadleadUltraSonicVibrationheatPRESSURE43Capillaryrisestoloop

heightpositionpadlead44Capillaryrisestoloop

heightpositionpadlead45Capillaryrisestoloop

heightpositionpadlead46Capillaryrisestoloop

heightpositionpadlead47Capillaryrisestoloop

heightpositionpadlead48Capillaryrisestoloop

heightpositionpadleadRH49FormationofalooppadleadRD(ReverseDistance)50Formationofalooppadlead51padlead52padleadCalculatedWireLengthWIRECLAMP‘CLOSE’53padleadCalculatedWireLength54padleadSEARCHDELAY55padleadTRAJECTORY56padleadTRAJECTORY57padleadTRAJECTORY58padleadTRAJECTORY59padleadTRAJECTORY60padleadTRAJECTORY61padleadTRAJECTORY62padleadTRAJECTORY63padleadTRAJECTORY64padleadTRAJECTORY65padlead2ndSearchHeightSearchSpeed2SearchTol266padleadSearchSpeed2SearchTol267padleadSearchSpeed2SearchTol268Formationofasecondbondpadleadheat69Formationofasecondbond

Contactpadleadheatheat70padleadheatheatFormationofasecondbond

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