GB 51037-2014 GB51037-2014微组装生产线工艺设备安装工程施工及验收规范:英文

专用

人人文库

NATIONALSTANDARD

OFTHEPEOPLE'SREPUBLICOFCHINA

CODEFORCONSTRUCTIONANDACCEPTANCEOF

MICRO-ASSEMBLINGPRODUCTIONLINEPROCESS

EQUIPMENTINSTALLATIONENGINEERING

GB51037-2014

DevelopedbyTheMinistryofIndustryandInformationTechnologyof

thePeople'sRepublicofChina

ApprovedbyTheMinistryofHousingandUrban-Rural专用Developmentof

thePeople'sRepublicofChina

ImplementationDateMay1，2015

人人文库

ChinaPlanningPress

Beijing2021

图书在版编目（CIP）数据

GB51037-2014微组装生产线工艺设备安装工程施工

及验收规范：英文/中华人民共和国住房和城乡建设部

组织编译.--北京：中国计划出版社，2021.12

ISBN978-7-5182-1415-0

Ⅰ.①G…Ⅱ.①中…Ⅲ.①微组装—生产线—生产

工艺—设备安装—工程施工—规范—中国—英文②微组装

—生产线—生产工艺—设备安装—工程验收—规范—中国

—英文Ⅳ.①TB4-65

中国版本图书馆CIP数据核字（2022）第010386号

ChineseeditionfirstpublishedinthePeople'sRepublicofChinain2014

EnglisheditionfirstpublishedinthePeople'sRepublicofChinain2021

byChinaPlanningPress

3rdFloor，CTower，GuohongBuilding专用

No.A11，Muxidi-Beili，XichengDistrict

Beijing，100038

PrintedinChinabyBeijingJingyintangGraphicPrintingCenter

©2014bytheMinistryofHousingandUrban-RuralDevelopmentof

thePeople'sRepublicofChina

Allrightsreserved.Nopartofthispublicationmaybereproducedortransmittedinanyformor

byanymeans，graphic，electronic，ormechanical，includingphotocopying，recording，

oranyinformation人人文库storageandretrievalsystems，withoutwrittenpermissionofthepublisher.

Thisbookissoldsubjecttotheconditionthatitshallnot，bywayoftradeorotherwise，belent，

resold，hiredoutorotherwisecirculatedwithoutthepublisher'spriorconsentinanyformof

blindingorcoverotherthanthatinwhichthisispublishedandwithoutasimilarcondition

includingthisconditionbeingimposedonthesubsequentpurchaser.

ISBN978-7-5182-1415-0

中华人民共和国住房和城乡建设部公告

2020年第129号

住房和城乡建设部关于发布《微组装生产线

工艺设备安装工程施工及验收规范》等

11项工程建设标准英文版的公告

现批准《微组装生产线工艺设备安装工程施工及验收规范》（GB51037-2014）、《电子工

业纯水系统安装与验收规范》（GB51035-2014）、《光缆生产厂工艺设计规范》（GB51067-

2014）、《光纤器件生产厂工艺设计规范》（51123-2015）、《电子工程防静电设计规范》（专用50611-

GBGB

2010）、《防静电工程施工与质量验收规范》（GB50944-2013）、《天线工程技术规范》（GB50922-

2013）、《试听室工程技术规范》（GB/T51091-2015）、《体育场建筑声学技术规范》（GB/T50948-

2013）、《电子会议系统工程设计规范》（GB50799-2012）、《电子会议系统工程施工与质量验收

规范》（GB51043-2014）英文版。工程建设标准英文版与中文版出现异议时，以中文版为准。

该11项工程建设标准英文版由住房和城乡建设部组织中国计划出版社有限公司出版发行。

中华人民共和国住房和城乡建设部

2020年5月28日

人人文库

AnnouncementoftheMinstryofHousingandUrban-Rural

DevelopmentofthePeople'sRepublicofChina

No.533

AnnouncementoftheMinistryofHousingandUrban-Rural

DevelopmentonPublishingNationalStandardof

CodeforConstructionandAcceptanceofMicro-assemblingProductionLine

ProcessEquipmentInstallationEngineering

CodeforConstructionandAcceptanceofMicro-assemblingProductionLineProcessEquipment

InstallationEngineeringhasbeenapprovedasanationalstandardwithaserialnumberofGB51037-

2014，andwillbeimplementedonMay1，2015.Inthiscode，Articles4.2.1（4），4.5.2（1），5.4.1（3），5.6.1

（3），5.7.1（5）7.7.2（3）专用.

andaremandatoryonesandmustbeimplementedstrictly

AuthorizedbytheResearchInstituteofStandardsandNormsofMinistryofHousingandUrban-

RuralDevelopmentofthePeople'sRepublicofChina，thiscodeispublishedanddistributedbyChina

PlanningPress.

MinistryofHousingandUrban-RuralDevelopmentofthePeople'sRepublicofChina

August27，2014

人人文库

Foreword

ThiscodeisdevelopedbySinopecEngineeringIncorporationincooperationwithotherinvolved

organizationsaccordingtotherequirementsofDocumentJIANBIAO〔2010〕No.43issuedbythe

MinistryofHousingandUrban-RuralDevelopmentofthePeople'sRepublicofChina（MOHURD）—

“NoticeonPrintingandDistributing‘theDevelopmentandRevisionPlanofNationalEngineering

ConstructionStandardsin2010’”，thiscodeiscompiledandformulatedbyElectronicEngineering

StandardQuotaStationofChinaElectronicsStandardizationInstitute，the2ndResearchInstituteof

ChinaElectronicsTechnologyGroupandotherrelevantorganizations.

Basedontheinvestigationandresearch，thecompilationteamsummarizedthepracticalexperience，

absorbedthescientificresearchresultsinrecentyears，drewontheadvancedforeignexperiencewhichis

inlinewiththenationalconditionsofourcountry，andextensivelysolicitedpinionsfromthedomestic

relatedunitsondesign，productionandresearch.Andthecodewasfinalizedafterreview.

Thiscodeconsistsof8chaptersand1appendix，covering：generalprovisions；terms；basic

requirements；installation，debuggingandcommissioningoflowtemperature专用co-finedceramicandthick

filmsubstrateproductionprocessequipment；thinfilmsubstrateproductionprocessequipment

installation，debuggingandcommissioning；installation，debuggingandcommissioningofassembling

andpackagingprocessequipment；installation，debuggingandcommissioningofprocessinspection

equipment；engineeringacceptance，etc.

Theprovisionsprintedinboldtypearemandatoryonesandmustbeimplementedstrictly.

Thiscodeisunderthejurisdictionof，anditsmandatoryprovisionsareinterpretedbytheMinistry

ofHousingandUrban-RuralDevelopment.TheMinistryofIndustryandInformationTechnology

takescareoftheroutinemanagement，whilethe2ndResearchInstituteofChinaElectronics

TechnologyGroupCorporationisresponsiblefortheinterpretationoftechnicalspecifications.All

relevantorganizationsarekindlyinvitedtosummarizeandaccumulateactualexperienceswhen

implementingthiscode.Relevantcommentsandrecommendations，whenevernecessary，shallbe

submittedtothe2ndResearchInstituteofChinaElectronicsTechnologyGroupCorporation（Address：

No.115HepingSouthRoad，TaiyuanCity，ShanxiProvince，Postcode：030024）forfuturerevision.

ChiefDevelopmentOrganizations，Co-DevelopmentOrganizations，ChiefDrafters，Chief

Reviewers，Chief人人文库TranslatorsandChiefTranslationReviewersofthiscode：

ChiefDevelopmentOrganizations：

ElectronicEngineeringStandardQuotaStationofChinaElectronicsStandardization

Institute

The2ndResearchInstituteofChinaElectronicsTechnologyGroup

Co-DevelopmentOrganizations：

The214thResearchInstituteofChinaNorthIndustriesGroupCorporation

The14thResearchInstituteofChinaElectronicsTechnologyGroup

The29thResearchInstituteofChinaElectronicsTechnologyGroup

The43rdResearchInstituteofChinaElectronicsTechnologyGroup

ChinaElectronicSystemEngineeringNo.2ConstructionCorporationLimited

TheITElectronicEleventhDesignandResearchInstituteScientificand

TechnologicalEngineeringCorporationLimited

The26thResearchInstituteofChinaElectronicsTechnologyGroup

ChinaElectronicsEngineeringDesignInstitute

ChiefDrafters：

CHAOYuqingHEZhongweiYANWeiDUBaoqiangGAONengwu

WANGZhengyiWANGKaiyuanZHENGBingxiaoLIXiaoxuan

QIAOHailingWANGGuipingLVQinHongHUANGWensheng

WUJianhua

ChiefReviewers：

WUXiangXUEChangliSHENXianfengCHENGKaiQIUYingxia

HULaipingLIYangxingHEChangfengZHANGYu

ChiefTranslators：

LIJingzhaoZHOULiDUBaoqiangZHANGXiaomingZHUZongjiu

ChiefTranslationReviewers：

LIAOYanlinSONGGuixiaYANGKegui专用

人人文库

Contents

1Generalprovisions…………………（1）

2Terms…………………（2）

3Basicrequirements………………（3）

3.1Constructionconditions……………（3）

3.2Equipmentunpacking…………………（3）

3.3Equipmentmoving………………………（4）

3.4Equipmentinstallation…………………（5）

3.5Debuggingandcommissioningofequipment……………（6）

4Installation，debuggingandcommissioningoflowtemperatureco-finedceramicand

thickfilmsubstrateproductionprocessequipment………………（7）

4.1Generalrequirements……………………（7）

4.2Tapecaster……………（7）

4.3Blanker……………………………专用（8）

4.4Greentapepuncher……………………（8）

4.5Laserscribingmachine…………………（9）

4.6Viafillingmachine………………………（9）

4.7Screenprinter…………………………（10）

4.8Stackingmachine…………………………（10）

4.9Isostaticlaminator……………………（11）

4.10Hotcutter……………………………（12）

4.11Lowtemperatureco-finedceramicboxfurnace（LTCCboxfurnace）………（12）

4.12Thick-filmbeltfurnace……………（13）

4.13Laserresistortrimmer……………（13）

5Thinfilmsubstrateproductionprocessequipmentinstallation，debuggingand

commissioning………………………（15）

5.1Generalrequirements……………………（15）

5.2Magneticsputteringdepositionsystem…………………（15）

5.3Vacuumevaporative人人文库copper-coatedmachine……………（16）

5.4Chemicalvapordepositionsystem………………………（17）

5.5Spincoatingandhotplatesystem…………（18）

5.6Exposuremachine……………………（19）

5.7Developingsystem……………………（19）

5.8Reactiveionetchingmachine……………（20）

5.9Chemicalmechanicalpolishingmachine…………………（21）

6Installation，debuggingandcommissioningofassemblingand

packagingprocessequipment……………………（23）

6.1Generalrequirements……………………（23）

6.2Dieattachingmachine……………………（23）

6.3Dieeutecticbonder………………（23）

6.4Eutecticoven………………………（24）

6.5Wirebonder………………………（25）

6.6Flipchipbonder………………………（25）

6.7Plasmacleaner……………………（26）

6.8Selectivespraycoatingmachine…………（26）

6.9Parallelseamwelder………………（26）

6.10Energystoragewelder…………………（27）

6.11Laserwelder……………………（28）

7Installation，debuggingandcommissioningofprocessinspectionequipment……（29）

7.1Generalrequirements…………………（29）

7.2Probetester………………………（29）

7.3Acousticscanner…………………（30）

7.43Dopticalprofiler………………………（30）

7.5Automaticopticalinspector……………（30）

7.6Laserthicknessgauge……………………（31）

7.7X-rayscanner……………（31）

7.8Chipshearing/wirepullingtester…………专用（32）

8Engineeringacceptance……………（33）

8.1Generalrequirements…………………（33）

8.2Handoveracceptance…………………（33）

8.3Completedacceptance…………………（34）

8.4Disposalofreject………………………（34）

AppendixARecordformsofacceptanceformicro-assemblingproductionlineprocess

equipmentinstallationengineering……………………（35）

Explanationofwordinginthiscode………………（40）

Listofquotedstandards…………………（41）

人人文库

1Generalprovisions

1.0.1Thiscodeispreparedwithaviewtostandardizingtheconstructionandqualityacceptanceof

micro-assemblingproductionlineequipmentinstallationengineering，guaranteetheinstallationquality

andreliableoperationofthemicro-assemblingline，andpromotingthedevelopmentofequipment

installationtechnologyinthisfield.

1.0.2Thiscodeisappliedtoconstruction，debugging，commissioningandacceptance，whilethemicro-

assemblingproductionlineisnewlybuild，reconstructedandextended.

1.0.3Inadditiontoimplementingthiscode，theconstructionandacceptanceofprocessequipmentfor

micro-assemblingproductionlineshallmeettherulesofnationalcurrentrelevantstandards.

专用

人人文库

2Terms

2.0.1Micro-assembling

Thetechnologyofformingadvancedmicroelectronicmoduleisassemblyofvariousmicroparts

andcomponents，integratedcircuitchipsandchipcomponentswhichconsistofelectroniccircuitsonthe

highdensitymultilayerinterconnectedsubstratebysurfacemountingandinterconnectionprocess.

2.0.2Multilayersubstrate

Substratewithembeddedconductorlayersforimplementingcomplexinterconnectioncircuits.

2.0.3Thickfilm

Filmwhichisdepositedonthesubstratebyscreenprintingprocessandsinteredatthehighest

temperatureofabout850℃.

2.0.4Lowtemperatureco-firedceramic（LTCC）multilayersubstrate

Aftermultipleunsinteredflexiblegreentapes，ofwhichthickfilmconductorsandresistancefigures

（includinginterconnectedlinesthatconsistofthesefigures，embeddedpassivecomponent，etc.）are

printedonthesurface，andwhichinterlaminarinterconnectedmetallized专用holesaremanufactured，are

stackedinorder，laminatingthemintoawholestructurebyheatingandpressingsimultaneously.By

sinteringthegreentapesandthickfilmelectronicpasteatamaximumtemperatureofabout850℃

（sinteringfurnace）rigidandhighdensitymultilayerinterconnectedsubstratesareformedfinally.

2.0.5Thinfilmmultilayersubstrate

Multilayerinterconnectedsubstratewhichoverlappedandinterconnectedmultilayerthinfilm

conductorandinterlaminarinsulatingfilmaremanufacturedoninsulatingsubstrateorsiliconwaferwith

filmformingprocessesofvacuumevaporation，sputtering，chemicalvapordepositionetc.and

technologyofphotoetching，etchingetc.

2.0.6Greentape

Atape-likeflexiblethinceramicmaterialwithsmoothsurface，uniformtextureandcertainstrength

whichismanufacturedbycastingprocess.

2.0.7Packaging

Microelectronictechnologyofinterconnection，protectionandheatdissipationforelectronicdevices

（microcircuitsormodule），whichmainlyincludeplasticpackaging，ceramicpackagingandmetal

packaging.人人文库

2.0.8Processinspection

Theprocessofmeasuringandinspectingtheproducts'shape，size，positionanditsmechanical，

physical，chemicalcharacteristicsandsoonbytools，instrumentsorequipmentofmeasuringortesting，

andcomparingwiththetechnologyrequirementsofproducts.Itistheinspectiontechniquetoevaluate

theconformityofprocedureorstateofproductcompletionwiththeruleofdesignandprocedure

documents.

3Basicrequirements

3.1Constructionconditions

3.1.1Thecleanroomshallbeinaccordancewiththefollowingrequirementsbeforeinstallationofthe

micro-assemblingequipment：

1Acceptanceofemptyroomshallbequalifiedandtheairconditioningsystemshalloperate

continuouslyandnormallyformorethan24h.

2Temperatureshouldbe20℃to26℃.

3Relativehumidityshouldbe30%to70%.

4Load-bearingcapabilityoffloorshallmeetrequirementsofequipment.

5Clearanceheightshallmeetinstallationrequirementsofequipment.

6Bodypurificationfacilityattheroomentranceshallhavebeeninoperation.

7Theequipmententryshallbeavailable.

8Firefightingfacilitiesshallhavebeenpassedspecialacceptanceandcanbeenabled.

9Theantistaticfacilitiesintheantistaticworkingareashallhavepassed专用thetestandacceptance.

10Powersupply，gassource，watersourceandgroundingterminalshallbeavailableandin

accordancewithrequirements.

11Employeesafeevacuationchannelsshallbesetup.

3.1.2Theinstallationofmicro-assemblingequipmentshallhavethefollowingtechnicaldocuments：

1Equipmentinstallationplan.

2Equipmentpackinglist.

3Technicaldocumentsforinstallation，operation，maintenanceandinstallationtechnicalparameters

ofequipmentprovidedbyequipmentmanufacturers.

3.1.3Theconstructionpersonnelshallenterthepurificationroomwithapassportofenteringtheclean

area.Specialtypesofworkersshallbecertificatedinaccordancewithrelevantprovisions.

3.1.4Equipmentinstallationandhook-upengineeringmaterialsshallmeettherelevantrequirements

ofcurrentnationalstandardGB50472CodeforDesignofElectronicIndustryCleanRoom.

3.1.5Equipmentandtoolsusedinconstructionshallmeettherelevantrequirementsofcurrent

nationalstandardGB50467CodeforConstructionandAcceptanceofMicro-electronicsManufacturing

EquipmentInstallation人人文库Engineering.

3.2Equipmentunpacking

3.2.1Equipmentshallbeunpackedwithjointparticipationofresponsiblepersonnelofsupplyunit，

constructionunitanddevelopmentunit.Unpackingofimportedequipmentforstatutorycommodity

inspectionshallbeattendedbycustomsinspectionrepresentatives.

3.2.2Packingcaseshallbecheckedfordamageanddamagedegreebeforeequipmentunpacking，anti-

vibrationandanti-tiltmarksshallnotbeabnormal.

3.2.3Equipmentunpackingshallbeinaccordancewiththefollowingrequirements：

1Packingcaseshallbeunpackedbyeffectivetoolsandfollowingreasonableproceduresunder

thepremiseofcausingnodamagetotheequipmentanditsaccessoriesinthecase.

2Thetopcoverofthecaseshallberemovedfirstafterremovingroofnailsorrelevantfasteners.

3Afterremovingthetopcoverandpart（orall）sidecoversofthecase，smallpartsandaccessories

shallberemovedfromthecasepriortomainframe，andthencarryouttheremainingworkofunpacking.

3.2.4Afterequipmentunpacking，packingmaterialshallberemovedintime.

3.2.5Afterequipmentunpacking，intactnessofinternalequipment，packageandaccessoriesshallbe

checked，anyabnormalsituationshallhaveimagerecordimmediatelyandputforwardtheprocessing

advice.

3.2.6Afterequipmentunpacking，equipmentshallbecheckedinaccordancewiththefollowing

requirements：

1Typespecificationontheequipmentnameplateshallbeconsistentwithequipmentlistor

technicalparameterlist.

2Iftheexteriorandprotectivepackageofequipmenthavedefects，damageorrustiness，itshallbe

putforwardandrecordedintime.Formanufacturingdefects，notifytheequipmentmanufacturerto

researchthehandlingmethod.

3Checkwhethertheparts，components，tools，accessories，subsidiarymaterials，andother

technicaldocumentsarecompleteonebyoneaccordingtothepackinglist，andshallmakearecord.

4Afterunpackingandinspectingtheequipment，theparts，accessories专用，accessorymaterials，tools

andfixtures，andtechnicaldocumentsthatneednottoinstallorbeusedforinstallationshallbeputinto

thecustodyoftheuser.

3.2.7Inspectionrecordsshallbefilledinwhenunpackingequipment，thecontentandformatshallbe

inaccordancewiththosespecifiedinTableA.0.1ofthiscode.

3.3Equipmentmoving

3.3.1Equipmentmovinginmethodofliftingshallbeinaccordancewiththefollowingrequirements：

1Steelcableusedinliftingshallbeabletowithstandover10tofweight.

2Craneoperatorsshallbecertificated.

3Cablebindingpositionshallavoidinstrumentandfragilestructure.Theequipmentcenterof

gravityshallbepaidattentionwhenlifting，andpreventtheequipmentfromdumpingandfalling.

4Theliftingheightofequipmentshouldbesuitableforremovingtheouterbottompackaging.

5Liftingandloweringspeedshallbecontrolledwhenoperating，noimpactorcollisionshall

occur.

3.3.2Themechanical人人文库facilitiesofforkliftsoraircushionsetc.shallbeusedwhenpositioninglarge-

scalemicro-assemblinglineproductionprocessequipmentintheroom.

3.3.3Thelengthoftwoforksshallexceed100mmofgravitycenterofequipmentwhenforkliftisused.

3.3.4Operationshallbesteadywhenmovingequipmentwithahydraulicloader.

3.3.5Movingequipmentwithaircushionshallbeinaccordancewiththefollowingrequirements：

1Aircushionsshallbeplacedundertheloadbeamatthebottomofequipment，andthenumberof

aircushionsforeachequipmentshallnotbelessthan4.

2Aircushionsshalltravelsteadilyafterinflating.Theheightofequipmentbottomfromthe

groundshallnotbelessthan2mm.

3.3.6Theprotectivemeasuresforthefloorshallbetakenwhenequipmentismovedintheroom.

3.4Equipmentinstallation

3.4.1Installationofmicro-assemblingequipmentshallbeinaccordancewiththefollowing

requirements：

1Full-openspaceofelectricboxandspaceofoperationandmaintenanceshallbereservedwhen

positioningtheequipment.

2Theprimarypipeandlinedistributionofpowersupply，gassource，watersourceandground

terminalsshallhavebeeninplace.

3Surfaceofequipmentshallbeprotectedduringinstallation.Sealingsurfaceshallnotbe

damagedorscratched.Installationofequipmentshallbefirmandreliable.Sunkscrewshallnotprotrude

overthesurfaceofconnectedparts.

4Whentheequipmenthasrequirementsofanti-vibrationcontrolorparticularload-bearing，

correspondingmeasuresofanti-vibrationorimprovementofload-bearingcapabilityshallbetaken.

5Hook-upofequipmentshallbecompletedbyprofessionalsinaccordancewithtechnical

requirementsofequipment.TheSS316Lstainlesssteelpipeshouldbeusedforthevacuumpipelineof

accessequipment.Pipingofpurewater，compressedair，etc.shouldbeconnectedwithequipmentby

PTFEandpolyurethanehoses.

3.4.2Directinstallationofmicro-assemblingequipmentonthefloorshall专用beinaccordancewiththe

followingrequirements：

1Basegasketshallbeplacedonthegroundfirst，andconfirmedthatbasicgasketcanevenly

supporttheequipment.

2Handshallnotbeplacedabovethebasegasketduringoperation.

3Ifequipmentisequippedwithbottombolts，eachbottomboltshallbeproperlyinstalledinits

screwhole.Aircushionsshallbeusedtomovetheequipment.

4Theequipmentshallbeleveledgraduallybyadjustingtheheightofanchorboltsortheeffective

thicknessofbasegasket，andensurethatthelocknutisgaplessandeachbottomboltisfixedtothe

correspondingbasegasketonthefloor.

3.4.3Directinstallationofmicro-assemblingequipmentontheplatformshallbeinaccordancewith

thefollowingrequirements：

1Operatingplatformshallbehorizontal，steadyandfirm.

2Antistaticmaterialshallbelaidontheplatformandeffectivelyconnectedtoantistatic

groundingsystemofroom.

3.4.4Horizontal人人文库adjustmentofequipmentshouldusethecross-testleveltomeasure，andthe

equipmentwithhighprecisionrequirementsmayusetwobracket-typelevels.

3.4.5Groundingofmicro-assemblingequipmentshallbeeffectiveandreliable，andgroundingterminal

shallbefirmlyconnectedtogroundingsystemofcleanroom.Groundingresistanceofequipmentshall

notexceed4Ω；Groundingsystemshallmeettherelevantrequirementsofcurrentnationalstandard

GB50169CodeforConstructionandAcceptanceofGroundingConnectionElectricEquipment

InstallationEngineering.

3.4.6Aftertheequipmentisinplace，powerconfigurationofequipmentshallbecheckedbytechnicians.

3.4.7Recordofinstallationprojectshallbefilledinaftertheequipmentisinstalled，contentandformat

shallbeinaccordancewiththosespecifiedinTableA.0.2ofthiscode.

3.5Debuggingandcommissioningofequipment

3.5.1Debuggingandcommissioningofmicro-assemblingequipmentshallbeinaccordancewiththe

followingrequirements：

1Theequipmenthasbeeninstalledinplace.

2Allkindsofpowerhook-upsshallensurethattheconnectiontotheequipmentissealedand

firm，thevariousparametersofthepowershallmeettherequirementsoftheequipment.

3Compressedairandprocessgasshallbecleanedbeforepumpingintotheequipment.

3.5.2Wiringofmicro-assemblingequipmentshallbecheckedbeforeoperating.

3.5.3Safetyofmicro-assemblingequipmentshallbetestedtomeetrequirementsbeforeoperation.

3.5.4Inthebootstate，aclampammetershallbeusedtomeasurewhetherthevoltageandcurrent

meettherequirementsofequipment.

3.5.5Inthebootstate，theequivalentcontinuousAweightedsoundlevelatpersonneloperating

positionshouldnotbegreaterthan70dB.

3.5.6Equipmentshallcontinuouslyoperatewithoutfailurefor48h.Beforeandafterthecontinuous

operation，themainperformanceindicatorsofequipmentshallbetested.Theresultsshallmeetthe

technicalrequirementsofequipment.

3.5.7Thedebuggingandcommissioningrecordsofmicro-assembling专用equipmentshallbefilledinfor

thesinglecommissioningwhichiscompliedwiththerelevantprovisionsofChapters4to7ofthiscode.

ThecontentandformatoftherecordsshallbeinaccordancewiththosespecifiedinTableA.0.3.

人人文库

4Installation，debuggingandcommissioningoflowtemperatureco-fined

ceramicandthickfilmsubstrateproductionprocessequipment

4.1Generalrequirements

4.1.1Lowtemperatureco-finedceramic（LTCC）andthickfilmequipmentshallmainlyincludethe

tapecaster，blanker，greentapepuncher，laserscribingmachine，viafillingmachine，screenprinter，

stackingmachine，isostaticpresslaminator，hotcutter，LTCCsinteringfurnace，thick-filmsintering

furnaceandlaserresistortrimmer.Allofthemmaybedirectlyinstalledontheground.

4.1.2LTCCsubstratemanufacturingprocessequipmentshallmeettherequirementsoflinkage，and

relevantperformanceindexofkeyLTCCprocessequipmentshallbeverifiedbytestingproductionand

performanceindicatorsofLTCCstandardtest-versionproducts.

4.1.3CleanlinessofroomusedforinstallationofLTCCandthickfilmequipmentshallbeatleast7

Level，thetemperatureofcleanroomshouldbe18℃to25℃，andtherelativehumidityshouldbe40%to

60%.

4.2Tapecaster专用

4.2.1Theinstallationofthetapecastershallbeinaccordancewiththefollowingrequirements：

1Castcarrierplateshallbegraduallylevelledbyadjustinganchorbolts.

2Thedirectionofwhichthedrycastwindsuppliedtotheexhaustwindshallbeoppositetothat

ofthecasttape.

3Theelectriccontrolcabinetshallbeinstalledatthepositionofmorethan1meterawayfrom

themaincastingcavity，andthemetalcabinetshallbedense.

4Openflameorotherdangeroussourcesofelectricalsparksmustnotappeararound

castingcavity.

5InstallationofPETfilmcarriertapeshallensurethatconveyissteadywithoutdeviatingandthe

tapeworkssmoothlywithoutarching.

4.2.2Thedebuggingandcommissioningofthetapecastershallbeinaccordancewiththefollowing

requirements：

1Theporcelainslurrytobecastthathasbeenballmilledmixtureandvacuumdefoamingshallbe

prepared.人人文库

2Gasleakagealarmandsafetyprotectiondeviceofequipmentshallworknormally，doorof

castingcavityshallbereliablylocked.

3Mainparametersofspeedandtensionofconveyerbelt，temperatureofeachtemperaturezone

ofcastingcavity，speedofwindsuppliedandexhausted，andtheheightofcastingscraperetc.shallbeset

reasonably.

4Carriertapeshallconveywithconstantspeedandwindingfreely，andthesurfaceshallbe

smoothwithoutprotrusions.

5Castershallworksteadilywithoutshaking.

6Whensupplyingporcelainslurrytotroughoftapecastertoscrapandcast，castershallsupply

thereverseexhaustwind，thecastingcavityshallbesealedwell，andtheoperatorsinthecastingroom

shallnotsmellthepeculiarodorofsolventfromcastingcavitywhiledryingporcelainslurry.

7Whentheperformanceandqualityofporcelainslurryarequalifiedandcastingparametersare

setreasonably，greentapeproducedbycastershallbedryandflat.Thethicknessofthegreentapeinthe

left，middleandrightlateralpositionsshallbemeasuredwithmicrometerandallowabledeviationof

thicknessuniformityshallbe±5%.

4.3Blanker

4.3.1Installationofblankershallbeinaccordancewiththefollowingrequirements：

1Forblankerthatcanbecompatiblewithgreentapesofdifferentwidth，componentsofblanker

shallbereplacedandpresetbyprofessionalsaccordingtodifferentrequirements.

2Foursuctioncupsofmanipulatorshallbeadjustedonthesamehorizontalplane.

4.3.2Debuggingandcommissioningofblankershallbeinaccordancewiththefollowing

requirements：

1Aftertheinitializationofeachkinematicshaft，thegreentaperollshallbeinstalledontheair

expansionshaftandinflatetofixit.Greentapeshallbetowthroughthetoolbithorizontallyandneatly.

2Conveyrollersshallbeproperlyadjustedtoavoiddeviationswhenfeedingtape.

3Blankershallbeabletoaccuratelyandeffectivelyblankwhenmultilayer专用thingreentapesstack

to1mmgreentapewithpolymerfilm.

4Underthepremisethatblankingisqualifiedandparametersissetreasonably，thecutofgreen

tapeshallbeclean，tidy，sharp，andfreeofmicro-crackunderthemicroscopeof30timesmagnification.

Allowabledeviationofthesizeforgreentapeshallbe±0.5mm.

4.4Greentapepuncher

4.4.1Installationofgreentapepunchershallbeinaccordancewiththefollowingrequirements：

1Withoutdoorinoperationarea，punchershallbeequippedwithprotectivelightcurtainand

enabled.

2Forgreentapepuncherthatcanbecompatiblewithdifferentlengthandwidth，thecomponents

shallbereplacedandpresetbyprofessionalsaccordingtodifferentrequirements.

4.4.2Debuggingandcommissioningofthegreentapepunchershallbeinaccordancewiththe

followingrequirements：

1Pretreatmentofgreentapeshallbecompletedaccordingtobakingcondition.

2Greentape人人文库thatneedtobeontheframeshallbeflattenedwithnegativepressureontheporous

stonefirstly，andthenadhesivetapeisusedtostickgreentapetotheframe.Adhesivetapeshallbeflat

andframeshallbewithoutwarping.

3Mainprocessparameterssuchaswaitingtimeofpunch，waitingtimeofXYmanipulatorafter

suckingmaterialandpunchspeedshallbeset.

4XYmanipulatorshallmovesteadilywhenresettingpuncher，andtheupanddownmodulesof

punchercomponentsshallpunchfreely.

5Specialmoduleadjustmenttoolshallbeusedtoadjustthepositionofupperandlowermodules

tomakethemcoaxial.Thepositionofpunchingpinshallbere-calibratedafterreplacingthepunching

pin.

6Punchershalloperatesteadilywithoutshaking.

7Palletofgreentapeshallbekepthorizontallywithoutwarpingetc.Greentapeshallbelocated

inthecenterofvacuumchuckafterbesuckedup.Attachmentlengthofgreentapewithfoursidesof

vacuumchuckshallbethesame，andsuctionshallbeintightwithoutgaps.

8Underthep