工程英文确认常用词及常用语句

工程英文确认常用词及常用语句汇总HYPERLINK厚度HYPERLINK公差HYPERLINK线路层HYPERLINK孔层HYPERLINK阻焊层HYPERLINK字符层HYPERLINK外形层HYPERLINK叠层单词附件：attached样品：sample认可：approval答复：answer;reply规格：spec与...同样的：thesameas前版本：previousversion(oldversion)生产：production确认：confirm再次确认：doubleconfirm工程问题：engineeringquery（EQ）尽快：ASAP(assoonaspossible)生产文献：productiongerber联系某人：contactsomebody提交样板：submitsample交货期：deliverydate电测成本：ET（electricaltest）cost通断测试：Openandshorttesting参考：refertoIPC标准：IPCstandardIPC二级：IPCclass2可接受的：acceptable允许：permit制造：manufacture修改：revision公差：tolerance忽略：ignore(omit)工具孔：toolinghole安装孔：mountinghole元件孔：componenthole槽孔：slot邮票孔：snapoffhole导通孔：via盲孔：blindvia埋孔：buriedvia金属化孔：PTH(platingthroughhole)非金属化孔：NPTH(noplatingthroughhole)孔位：holelocation避免：avoid原设计：originaldesign修改：modify按原设计：leaveitasitis附边：wastetab铜条：copperstrip拼板强度：panelstrong板厚：boardthickness删除：remove(delete)削铜：shavethecopper露铜：copperexposure光标点：fiducialmark不同：bedifferentfrom(differfrom)内弧：insideradius焊环：annularring单板尺寸：singlesize拼板尺寸：panelsize铣：routing铣刀：routerV-cut：scoring哑光：matt光亮的：glossy锡珠：solderball(solderplugs)阻焊：soldermask(solderresist)阻焊开窗：soldermaskopening单面开窗：singlesidemaskopening补油：touchupsoldermask补线：trackwelds毛刺：burrs去毛刺：deburr镀层厚度：platingthickness清洁度：cleanliness离子污染：ioniccontamination阻燃性：flammabilityretardant黑化：blackoxidation棕化：brownoxidation红化：redoxidation可焊性：solderability焊料：solder包装：packaging角标：cornermark特性阻抗：characteristicimpedance正像：positive负片：negative镜像：mirror线宽：conductorwidth线距：conductorspacing做样：buildsample按照：asper成品：finished做变更：makethechange相类似：similarto规格：specification下移：shiftdown垂直地：vertically水平的：horizontally增大：increase缩小：decrease表面解决：SurfaceFinishing

波峰焊：wavesolder钻孔数据：drillingdate标记：LogoUl标记：UlMarking蚀刻标记：etchedmarking周期：datecode翘曲：bowandtwist外层：outerlayer内层：internallayer顶层：toplayer底层：bottomlayer元件面：componentside焊接面：solderside阻焊层：soldermasklayer丝印层：legendlayer(silkscreenlayeroroverlayer)兰胶层：peelableSMlayer贴片层：pastemasklayer碳油层：carbonlayer外形层：outlinelayer(profilelayer)白油：whiteink绿油：greenink喷锡：hotairleveling(HAL)水金：flashgold插头镀金：platedgoldedge-boardcontacts金手指：Gold-finger防氧化：Entek(OSP)沉金：Immersiongold(chem.Gold)沉锡：ImmersionTin(chem.Tin)沉银：ImmersionSilver(chem.silver)单面板：singlesidedboard双面板：doublesidedboard多层板：multilayerboard刚性板：rigidboard挠性板：flexibleboard刚挠板：flex-rigidboard铣：CNC(mill,routing)冲：punching倒角：beveling倒斜角：chamfer倒圆角：fillet尺寸：dimension材料：material介电常数：Dielectricconstant菲林：film成像：Imaging板镀：PanelPlating图镀：PatternPlating后清洗：FinalCleaning叠层：layup(stack-up)污染焊盘：contaminatepad分孔图：drillchart度数：degree被…覆盖：becoveredwith负公差：minustolerance标靶盘：targetpad外形公差：routingtolerance芯板：core常用语句－、厚度规定孔内铜厚0.001"太紧对我们的生产，建议按IPC二级0.0008"。Thecopperthicknessofthewalloftheplated-throughholesisspecified0.001".It'stootightforourproduction.WesuggestasperIPCclass2.that'stosay,It's0.0008".2.规定金手指镀金厚度为1.2-1.5um，我们加工太困难，建议按我们常规0.45um。TheplatingthicknessofAuinedgecontactisspecified1.2-1.5um,itistootoughforus,wesuggestfollowingournormalstandard,thatistosay0.45uminstead.3.建议所规定的铜厚2OZ为成品铜厚，并且我们将用基铜1.5OZ电镀到2OZ。Thecopperthicknessisspecified2OZ.Wesuggestthefinishedcopperthickness2OZ.Andwewillusethebasematerialwith1.5OZcopperthicknessandplateto2OZforourproduction.4.规定锡厚为0.0005-0.003"，我们做不到这么厚，建议按IPC二级，即保证可焊性，Thesolderthicknessisrequiredtoplated0.0005-0.003",Wecannotreachtherequirement.WesuggestfollowingIPCclass2forthesolderthicknessandwewillassurethesolderability.二、公差1.XXX.的尺寸公差为+/-0.005，这规定是太紧对我们生产，建议公差放松到+/-0.008"。ThetoleranceofdimensionisspecifiedXXX.+/-0.005".Itistightforourproduction.Wesuggest+/-0.008"instead。2.在*.pdf文献中规定外形公差为+/-0.005"，建议按IPC二级+/-0.01"代替。Theprofiletoleranceisspecified+/-0.005"in*.pdffile.WesuggestasperIPCclass2，thatistosay,itis+/-0.01".3.在叠层图中规定板厚公差为+/-0.007"，而notes1中规定板厚公差为+/-0.005"，他们是不同的，建议0.062"+/-0.007"是可接受的，由于+/-0.005"对我们来说太难控制了。Thetoleranceoftheboardthicknessisspecified+/-0.007"inlayupdetailwhichisdifferentformNOTES1+/-0.005".Wesuggest0.062"+/-0.007"isacceptablefor+/-0.005"isverytoughforustocontrol.4.外形公差规定+/-0.1mm，这超过了我们生产，建议按+/-0.2mm控制。Thetoleranceoftheoutlineisspecified+/-0.1mm.It'saboveus.Wesuggest+/-0.2mminstead.5.v-cut留厚公差为+/-0.06mm上下偏移公差为+/-0.05mm，这两个公差都太紧，建议两个公差都按+/-0.1mm控制。Theremaintoleranceofv-cutisspecified+/-0.06mmandoffsettoleranceis+/-0.05mm.theyaretootightforus,wesuggestbothtoleranceare+/-0.1mminstead.6.孔位公差为0.05mm，这是太紧对我们，建议用+/-0.076mm替代。Thetoleranceoftheholepositionisspecified0.05mm.It'stootightforus,Wesuggest+/-0.076mminstead.7.角度公差为+/-0.5mm，这是太紧对我们，v-cut角度我们将控制在30+/-5度。Thetoleranceofangleis+/-0.5degree,itistightforus,wewouldliketocontroltheangleofv-cutwithin30+/-5degree.8.在1MB5476-01.pdf文献中规定孔到板中心的公差是+/-0.05mm，这是太紧对我们，建议安IPC二级。Itisspecialthatthetoleranceoftheholetoboardcenteris+/-0.05mminthe1MB5476-01.pdffile,itistootightforus,wesuggestasperIPCclass2.9.规定线宽和线间距公差为+/-0.03，这是太紧对我们，请确认放松到+/-20%。Itstatedthatconductorwidthandspacingshallbewithin+/-0.03(0.001)ofgerberdata,itistightforus,wewouldliketorelaxto+/-20%.Plsconfirm.10.Φ3.0的孔径公差规定+0.05mm，这太紧对我们，请确认放松到+0.1/-0mm。Thetoleranceoftheholeswithdiameter3.0mmisrequiredtocontrolwithin+0.05mm,itistightforus,wewouldliketorelaxto+0.1/-0mm.Plsconfirm.三、线路层1.两个孔到外形很近，这将引起露铜和破孔，建议允许露铜与破孔。Twoholesareneartheoutline,itwillcausecopperexposedandholebroken,wesuggestcopperexposedandholebrokenispermitable.2.有些盘离外形很近，建议削铜皮0.4mm，避免露铜。Somepadsareclosetotheoutline.Wesuggestshavingthepadsabout0.4mmavoidtothecopperexposure.3.焊盘延伸出板外，如按原设计，板边将会露铜，建议允许露铜。Thecopperpadextendtotheboardoutline,itwillleadtocopperexposedifwefollowGerbertodo,Wesuggestcopperexposedisacceptable.4.有三个盘离v-cut线很近将会引起露铜，建议削焊盘0.4mm避免露铜。Thethreepadsaresoclosetothev-cutthattheywillcausecopperexposure.Wesuggestshavingthepads0.4mmavoidtothecopperexposure.5.底层有些地方线路网格间距仅有0.178mm，这种网格间距我们生产无法做到，建议减小线宽使间距达成0.2mm.Thecoppergridsonbottomsideisonly0.178mminsomeplaces,wecannotdoitperthisgap,sowesuggestdecreasingthetracewidthtomakecoppergridsto0.2mm.6.既然没有功能上的影响，我们建议所有层附边均加些铜皮以提高电镀质量。Wesuggestputtingsomeextracopperonthewastetabinalllayerstoimproveplatingqualitysincethisisnofunctioneffect.7.建议加在顶层空白区域加些铜以提高电镀质量。Wesuggestputtingsomecopperinblankareaontopsidetoimproveplatedquality.8.我们发现有两处铜皮间距仅有0.013mm，建议把它们连接起来。Wehavefoundthatthegapbetweentwoblockcopperisonly0.013mmonbottomside,wesuggesttheyareconnected.9.两个光标点处在v-cut线上，它们将被削到，我们建议向左边移1.0mm。Thetwofiducialmarksareoverv-grooveline.Theywillbecut.Wesuggestmovingthem1.0mmtowardtheleft.四、孔层1.两个直径2.0MM的孔，4个直径4.0MM的孔，4个直径1.3MM的孔双面没有焊盘，但它们被定义成PTH孔，我们建议做NPTH孔The2holeswithdia.2.0mm,4holeswithdia.4.0mmand4holeswithdia.1.3mmhavenopadsontopandbottomcopperlayer.ButtheyarespecifiedPTHindrillchart.WesuggestbuildthemasNPTH.2．这些孔（直径1.4MM，1.6mm,1.8mm,2.5mm）被定义成PTH孔，但它们的焊盘与孔径等大，我们建议做NPTH孔。Theseholes(1.4mm,1.6mm,1.8mm,2.5mm)arespecifiedPTH.Buttheyhavepadswhicharethesameastheholesincopperlayer.WesuggestthemNPTH.3.六个直径0.25MM的孔在分孔图中定义为NPTH孔，但它们的线路焊盘比孔大，我们建议做PTH孔。The6holeswithdia.0.25mmarespecifiedNPTHindrillchart.Buttheyhavepadswhicharelargerthantheholesincopperlayers.WesuggetthemPTH.4.直径0.11“的孔相应的焊盘比孔大，但它们被定义成NPTH孔，我们建议沿孔边削铜皮0.3MM，请确认Theholewithdia.0.11"havepadwhichislargerthantheholeintopandbottomcopperlayer.Butit'sspecifiedNPTH.wesuggestshavingthepads0.3mmaroundthehole.Plsconfirm.5.GERBER中孔的类型没有定义，2个直径0.120“的孔双面没有焊盘，我们想确认这2个直径0.120”的孔为NPTH孔。Theholetype(PTHorNPTH)didnotbedefineintheGerber,thetwoholesofdiameter0.120inchhavenotcopperpadsonbothsides,wewouldliketoconfirmthetwoholesofdiameter0.120incharenon-platingholes,pleaseconfirm.6.一些1.5mm的孔靠得非常近，建议把他们制成槽孔。Someholeswithdia.1.5mmareverycloseeachother,wesuggestdoingthemovalhole.7.有两个Φ0.991、Φ0.762重叠在一起，建议保存一个0.991mm的孔。Therearetwoholeswithdia.0.991mmanddia.0.762mmoverlapeachotherinoneplace,wesuggestonlydia.0.991mmremainthere.8.在DRD孔表中直径0.012英寸孔数是291，而在钻孔文献中孔数是290，请确认孔数是290而不是291。Thequantityofdiameter0.012inchintheholechartoffileDRDis291,but(thruhole,tap)itisonly290.pleaseconfirmthequantityofdiameter0.012inchholesinthedrillflieshouldbe290not291.9.在孔表中标明1.7*1.9mm的槽数量为4个，但gerber中仅有两个，建议按gerber制作。Inthedrilldrawfile,itstatedthatthequantityofslots1.7*1.9mmis4,butwehavefoundtwoslotsinthegerberfile,wesuggestaspergerberfile.10.由于铣外形没有定位孔，我们建议附边加四个Φ2.0mm孔。Asnolocatedholesforourrouting,wesuggestfouradditionalholeswithdia.2.0mminwastetab.五、阻焊层1．在字符"J3"处，一些0.065inch&0.0461inch的孔两面没有开窗，未避免阻焊污染焊盘，在对孔双面加开窗。Onthelocationof"J3",someholesofdiameter0.065inch&0.0461inchhavenotmaskopeningonbothsides,wewouldliketoaddmaskopeningfortheseholestoavoidsolderresistencroachthesolderpadonbothsides.2.这些焊盘仅TOP面有阻焊开窗，为了避免油墨渗上焊盘，我们建议在BOTTOM面也加上与TOP面等大的阻焊开窗Thesepadshavesinglesidemaskopeningonthetopside,wesuggestextramaskopeningonthebottomsidewithsamesizeaspadstoavoidmaskontopad.3.我们发现6个直径0.8MM的孔双面没有阻焊开窗，我们认为它们应为元件孔，建议双面加直径1.75MM的阻焊开窗。Wefoundthe6holeswithdia.0.8mmhavenotsolder-maskopeningonbothsides.Wethinktheyshouldbecomponentholes.Wesuggestputtingdia.1.75mmsoldermaskopeningontheirpadsonbothsides.4.我们发现单板内有些光标点没开窗，这点我们应当按原设计吗？Wefoundsomefiducialswithoutmaskopeningintheunit.Shouldwefollowingtheoriginaldesign?5.锡珠，小挡点根据原设计多数过孔没有开窗，它们也没有堵孔规定，在我们生产过程中，由于孔内没充满绿油锡将会流进这些孔内，为此我们有三种建议：建议1：允许部分过孔孔内有锡珠。建议2：若不批准建议1，我们将对这些孔双面加一比孔大些的开窗，使用这种方法的结果是：这些过孔的孔壁不会有绿油，过孔焊盘被绿油覆盖但有部分锡环。建议3：若不批准以上两点，我们将对双面未开窗的过孔进行堵孔，但这将增长成本和增长制程时间，对我们来说这种是最不利的选择。我们希望你能选择建议1或建议2。Mostviashavenosoldermaskopeningasperoriginaldesignandnovias-pluggedrequest.Duringourprocess,thesolderwillflowintothevias,fortheyaren'tfilledwithsolderresistcompletely.Sooursuggestionhavethree:suggestion1:Solderballinpartialviasispermitted.Plsconfirm.suggestion2:Ifyoudon'tagreewithoursuggestion1,wewouldliketoputanopeningwithasizelittlelargerthanholesonbothside.Inthisway,thewalloftheviaswillhavenoanysolderresist,onepartialpadswillbesolderedandtheotherwillbecoveredwithsolderresist.Plsconfirm.suggestion3:Ifyoudon'tagreewithabovetwo,wewillhavetoplugthoseviaswhichhavenoopeningonbothsidewithsolderresist.Butitwillincreaseourproductioncostandcauselead-timemuch.Itistheworstwayforus.Wewouldliketohopeyoucouldchooseoursuggestion1or2.9.过孔规定堵孔，但一些过孔顶层有开窗，建议保存过孔开窗且对Φ0.46mm的过孔堵孔。Theviaisspecifiedtobeplugged.Butsomeviashavemaskopeningintoplayer.Wesuggestallviaswithdia.0.406mmwillbepluggedandtheirmaskopeningintoplayerwillbekept.12.根据原设计光标点开窗压到周边的些线或盘，建议削光标点开窗，避免露线。Intheborad,somesoldermaskopeningoffiducialmarkscoverthenearbytracesorpadsontopsideperoriginaldesign.Wesuggestthatshavealittlesoldermaskopeningoffiducialmarkstoavoidthetraceexposed.14.开窗与线路盘现状不同，我们应当修改开窗使按键处所有上金还是依据原设计制作？Thesoldermaskopeningshapemismatchthecircuitpad,shouldwemodifythesoldermaskopeningshapetoassureallthekeypadwillbecoveredwithgoldcompletely,orwewillfollowGerbertodo.15.能我们使用太阳PSR2023油墨代替太阳PSR4000油墨？由于我们没有这类型的油墨。Canweusethesolder-masktypewithTAYOinkPSR2023insteadofTAYOinkPSR4000H85?becausewehavenotthistype六、字符层1.大部分的丝印字符都在焊盘上。我们建议此板没有白字，假如需要丝印字符，我们建议删去上焊盘的字符。Mostofsilkscreenisonthepads,wesuggestnosilkscreen,ifweneedtodosilkscreenwesuggestremovalofthosewhichareonpads.2.原设计白油上焊盘，为了避免油墨污染焊盘，我们建议削去上焊盘的白油，请确认。Thereiswhiteinkonthetoppadsperoriginaldesign,Wesuggestshavingthewhiteinkincaseoftheycontaminatepads.Plsconfirm.3.一些字符靠近焊盘，恐怕它们会污染焊盘，建议允许削少许字符，也就是说字符残缺是允许的。Somelegendsareclosetopads.weareafraidtheywillcontaminatethepads.sowesuggestshavingthemabit.thatistosaythedefectivelegendsispermittable.4.GERBER文献没有发现丝印层，因此建议此板没有字符，假如需要丝印字符，请将字符文献发给我们。Wedidn'tfindanysilkscreenlayeringerberfile.Sowesuggestnosilkscreenlayers.Ifneed,Plssendusthefile. 5.在U1和U5区域，两个IC焊盘的间距只有0.3MM，假如按原设计制作，白油会污染焊盘，要不白油做少许更改，白油上焊盘是允许的。InU1&U5areathegapbetweentwoICpadsisonly0.3mmandthewhiteinkwillcontaminatepadsifwefollowtheoriginalgerber,theotheristomakeminorchangetowhiteinkandICpadscontaminatedisallowed.Plsconfirm.6.按原设计，字符在大锡面上，是否为了避免白油污染锡面需要削掉白油，或者需要我们按原设计制作？请指示Thenotationjustlieonthelargesolderpadperoriginaldesign,ifneedustoshaveinktoavoidinkcontaminatethesolderpadorneedustofollowgerbertodo?pleaseadvise.7.所有底层字符都没镜像，建议没有底层字符或假如要做出他们需要镜像，请提出你的建议。Allthelegendsonbottomsidearenomirrorpergerberfile,wesuggestnobottomsidesilkscreenortheyaremirrorifweneedtodothem.Plsadvise.8．在GM4层有些字符，我们忽略它们或是加到顶层？TherearesomelegendsontheGM4,shouldweomitthemorputthemontopsidesilkscreen?9.由于单元比较小，没有足够的空间加我们的UL标志及周期在每个单元内，我们只能丝印我们的UL标志及周期在附边。Astheunitissosmall,thereisnolargeenoughbarespacetoaddourULlogoanddatecodeineachunitwehavetoaddourULlogoanddatecodeonthewastetabbysilkscreen.10.我们发现其他制造商的标志及周期在附边上，我们建议用我们的UL标志及周期替代加在附边上（同样板同样），请确认。WefindtheLOGOandthedatecodeofotherPCBmanufactureisonlyinwastetab.WesuggestusingourLOGOinstead.(isonlyinwastetabthesameasthesample.).Plsconfirm.11.顶层字符模糊不清，是否按3.bmp图示修改？Thelegendisillegibilityonthetoplayersilkscreen.Shouldwemodifyitas3.bmp?12.板外有些字符和线路，建议删去,请确认。Therearesomecircuit¬ationoutoftheboard,wesuggestdeletethem.plsconfirm.13.字符层有些网格间距仅有0.076mm,对我们生产来说间距太小，建议按图示修改。Intopsilkscreenlayer,Thereissomegrids.Butthespaceisonly0.076mm.Thespaceistoosmalltoproduce.Wesuggestmodifyingthesegridslike3.bmpshown.七、外形层1.*.DWG中没体现拼板方向，建议拼板按照我们附件中的图所示。Wesuggestpanelizationperourattacheddrawingforitdoesnotshowtheunit-pcb'sexactdirectioninthe*.DWG.2.单板外形与拼板外形不重合，建议按单板调整外形。Theunitoutlinecann’tmatchthepanelprofile.Wesuggestfollowingtheunitoutlinetomodify.3.标注尺寸与实测尺寸不同，建议以标注尺寸为准。Theactualgerberdimensionisdifferentfromthedescriptionindrillchart.wesuggestperactualgerber.4.建议v-cut留厚按前版本0.3+/-0.1mm控制。Wesuggesttheremainofthev-cutlineasperoldversion.(0.3+/-0.1mm).5.规定的v-cut角度是30-45度，但我V-CUT刀是30,45,60度，它们的公差是+/-5度，因此我们建议V-CUT角度30+/-5是允许的。TheangleofV-CUTisspecified30-45degree.ButournormalreamerofV-CUTisonly30，45,60degree.Theirtoleranceis+/-5degree.Sowehavetosugg