封装专用英语词汇概要

/常见封装形式简介DIP=DualInlinePackage=双列直插封装HDIP=DualInlinePackagewithHeatSink=带散热片的双列直插封装SDIP=ShrinkDualInlinePackage=紧缩型双列直插封装SIP=SingleInlinePackage=单列直插封装HSIP=SingleInlinePackagewithHeatSink=带散热片的单列直插封装SOP=SmallOutlinePackage=小外形封装HSOP=SmallOutlinePackagewithHeatSink=带散热片的小外形封装eSOP=SmallOutlinePackagewithexposedthermalpad=载体外露于塑封体的小外形封装SSOP=ShrinkSmallOutlinePackage=紧缩型小外形封装TSSOP=ThinShrinkSmallOutlinePackage=薄体紧缩型小外形封装TQPF=ThinProfileQuadFlatPackage=薄型四边引脚扁平封装PQFP=PlasticQuadFlatPackage=方形扁平封装LQPF=LowProPackage=薄型方形扁平封装eLQPF=LowProfileQuadFlatPackagewithexposedthermalpad=载体外露于塑封体的薄型方形扁平封装DFN=DualFlatNon-leadedPackage=双面无引脚扁平封装QFN=QuadFlatNon-leadedPackage=双面无引脚扁平封装TO=Transistorpackage=晶体管封装SOT=SmallOutlineofTransistor=小外形晶体管BGA=BallGridArray=球栅阵列封装BQFP=QuadFlatPackageWithBumper=带缓冲垫的四边引脚扁平封装CAD=ComputerAidedDesign=计算机辅助设计CBGA=CeramicBallGridArray=陶瓷焊球阵列

CCGA=CeramicColumnGridArray=陶瓷焊柱阵列CSP=ChipSizePackage=芯片尺寸封装

DFP=DualFlatPackage=双侧引脚扁平封装

DSO=DualSmallOutline=双侧引脚小外形封装

3D=Three-Dimensional=三维

2D=Two-Dimensional=二维FCB=FlipChipBonding=倒装焊IC=IntegratedCircuit=集成电路I/O=Input/Output=输入/输出LSI=LargeScaleIntegratedCircuit=大规模集成电路MBGA=MetalBGA=金属基板BGAMCM=MultichipModule=多芯片组件MCP=MultichipPackage=多芯片封装MEMS=MicroelectroMechanicalSystem=微电子机械系统MFP=MiniFlatPackage=微型扁平封装MSI=MediumScaleIntegration=中规模集成电路

OLB=OuterLeadBonding=外引脚焊接PBGA=PlasticBGA=塑封BGA

PC=PersonalComputer=个人计算机

PGA=PinGridArray=针栅阵列

SIP=SystemInaPackage=系统级封装SOIC=SmallOutlineIntegratedCircuit=小外形封装集成电路

SOJ=SmallOutlineJ-LeadPackage=小外形J形引脚封装

SOP=SmallOutlinePackage=小外形封装

SOP=SystemOnaPackage=系统级封装WB=WireBonding=引线健合

WLP=WaferLevelPackage=晶圆片级封装常用文件、表单、报表中英文名称清除通知单Purgenotice工程变更申请ECR(EngineeringChangeRequest)持续改善计划CIP(continuousimprovementplan)戴尔专案DellProject收据Receipt数据表Datasheet核对表Checklist文件清单Documentationchecklist设备清单Equipmentchecklist调查表，问卷Questionnaire报名表Entryform追踪记录表Trackinglog日报表Dailyreport周报表Weeklyreport月报表Monthlyreport年报表Yearlyreport年度报表Annualreport财务报表Financialreport品质报表Qualityreport生产报表Productionreport不良分析报表FAR(Failureanalysisreport)首件检查报告Firstarticleinspectionreport初步报告（或预备报告）Preliminaryreport一份更新报告Anundatedreport一份总结报告Afinalreport纠正及改善措施报告(异常报告单)CAR(CorrectiveActionReport)出货检验报告OutgoingInspectionReport符合性报告（材质一致性证明）COC(CertificateofCompliance)稽核报告Auditreport品质稽核报告Qualityauditreport制程稽核报告Processauditreport5S稽核报告5Sauditreport客户稽核报告Customerauditreport供应商稽核报告Supplierauditreport年度稽核报告Annualauditreport内部稽核报告Internalauditreport外部稽核报告ExternalauditreportSPC报表(统计制程管制)Statisticalprocesscontrol工序能力指数(Cpk)Processcapabilityindex（规格)上限Upperlimit（规格）下限Lowerlimit规格上限UpperSpecificationLimit(USL)规格下限LowerSpecificationLimit(LSL)上控制限（或管制上限）UpperControlLimit(UCL)下控制限（或管制下限）LowerControlLimit(LCL)最大值Maximumvalue平均值Averagevalue最小值Minimumvalue临界值Thresholdvalue/criticalvalueMRB单(生产异常通知报告)MaterialReviewBoardReport工艺流程图ProcessFlowDiagram物料清单（产品结构表/用料结构表）BOM(BillofMaterials)合格供应商名录AVL(ApprovedVendorList)异常报告单CAR工程规范报告通知单（工程变更通知）ECNTECN自主点检表SelfCheckList随件单（流程卡）TravelingCard(RunCard)压焊图Bondingdiagram晶圆管制卡Waferinspectioncard晶圆进料品质异常反馈单FeedbackReportforWaferIncomingQualityProblems订购单PO(PurchaseOrder)出货通知单AdvancedShipNotice送货单/交货单DO(DeliveryOrder)询价单RFQ(Requestforquotation)可靠性实验报告ReliabilityMonitorReport产品报废单PSB特采控制表CRB返工单PRB异常处理行动措施OCAP减薄：Wafer

[‘weifə]

n.威化饼干、电子晶片（晶圆薄片）Grind

[ɡraind]

vt.&vi.磨碎;嚼碎n.磨,碾Crack

[kræk]

vt.&vi.

(使…)开裂,破裂n.

裂缝,缝隙Ink

[iŋk]

n.

墨水,油墨Die[dai]

vt.&vi.

死亡（芯片）Dot

[dɔt]

n.

点,小圆点Mounting

[‘mauntiŋ]

n.

装备,衬托纸Tape

[teip]

n.

带子；录音磁带;录像带Size

[saiz]

n.

大小,尺寸，尺码Thick

[θik]

adj.厚的，厚重的Thickness

[‘θiknis]

n.

厚(度),深(度)宽(度)Position

[pə‘ziʃən]

n.

方位，位置Rough

[rʌf]

adj.

粗糙的;不平的Fine

[fain]

adj.

美好的,优秀的,优良的,杰出的Speed[spi:d]

n.

速度,速率Spark[spɑ:k]

n.

火花;火星Out

[aut]

adv.离开某地,不在里面；(火或灯)熄灭Grindstone

[‘ɡraindstəun]

n.

磨石、砂轮Mount[maunt]

vt.&vi.

装上、配有Mounter

装配工;安装工;镶嵌工Mounting

[‘mauntiŋ]

n.

装备,衬托纸Magazine

[,mæɡə‘zi:n]

n.

杂志,期刊，弹药库（传递料盒）Cassette

[kə‘set]n.盒式录音带；盒式录像带Inspect

[in‘spekt]

vt.检查，检验，视察Inspection

[in‘spekʃən]

n.

检查，视察Card

[kɑ:d]

n.

卡,卡片,名片划片：Saw

[sɔ:]

n.

锯vt.&vi.

锯，往复运动Sawing

['sɔ:iŋ]

n.

锯,锯切,锯开Film

[film]

n.

影片,电影（薄膜，蓝膜）Frame[freim]

n.

框架，骨架，构架Clean

[kli:n]

adj.

清洁的,干净的；纯净的Cleaner

[‘kli:nə]

n.

作清洁工作的人或物Oven

[‘ʌvən]

n.

烤箱,炉Cassette

[kə‘set]n.

盒式录音带；盒式录像带Handler[‘hændlə]n.(物品、商品)的操作者Scribe

[skraib]

n.抄写员,抄书吏Street

n.

大街,街道Blade

[bleid]

n.

刀口,刀刃,刀片Cut

[kʌt]

vt.&vi.

切,剪,割,削Speed[spi:d]n.

速度,速率Spindle

[‘spindl]

n.

主轴，(机器的)轴Size

[saiz]

n.

大小,尺寸

,尺码Cooling

['ku:liŋ]adj.

冷却(的)Kerf

[kə:f]

n.

锯痕,截口,切口Width

[widθ]

n.

宽度,阔度,广度Chip

[tʃip]

n.

碎片、缺口Chipping[‘tʃipiŋ]n.

碎屑,破片Crack[kræk]vt.(使…)开裂,破裂n.裂缝,缝隙Missing

[‘misiŋ]adj.失掉的,失踪的,找不到的Die[dai]

vt.&vi.

死亡（芯片）Saw

[sɔ:]

n.

锯vt.&vi.

锯，往复运动Street

[stri:t]n.

大街,街道Film

[film]

n.

影片,电影（薄膜，蓝膜）Frame[freim]

n.

框架，骨架，构架Tape

[teip]

n.

带子；录音磁带;录像带Bubble

['bʌbl]n.

泡,水泡,气泡mount贴wafer晶圆

frame框架blade刀片tape膜cassette盒子completion完成loader上料un-loader出料initial初始化open打开air空气pressure压力failure失败vacuum真空alignment校准ink黑点die芯片error错误limit限制cover盖子device产品data数据saw切割water水elevator升降机spindle主轴sensor感应器wheel轮子setup测高rotary旋转check检查feed进给

cutter切割speed速度height高度new新shift轮班pause暂停clean清洗

center中心chip崩边

change变换enter确认Offcenter偏离中心broken破的alarm报警上芯：Attach

[ə‘tætʃ]

vt.&vi.

贴上;系;附上Bond

[bɔnd]

n.

连接,接合,结合vt.

使粘结,使结合Bonder

[‘bɔndə]

n.联接器,接合器,粘合器Dieattachmaterialepoxy粘片胶Epoxy

[e‘pɔksi]

n.环氧树脂（导电胶）Material

[mə‘tiəriəl]

n.

材料,原料Non-conductiveepoxy绝缘胶Conductive

[kən‘dʌktiv]

adj.传导的Dispenser

[dis‘pensə]

n.

配药师,药剂师Nozzle

[‘nɔzl]

n.

管嘴,喷嘴Rubber

[‘rʌbə]

n.

(合成)橡胶，橡皮Tip

[tip]

n.

尖端,末端Diepick-uptool吸嘴Tool

[tu:l]

n.

工具,用具Collect

[kə‘lekt]

vt.

收集,采集（吸嘴）Ejector

[i‘dʒektə]

n.

驱逐者,放出器,排出器Pin

[pin]

n.针,大头针,别针LeadFrame引线框架Lead

[li:d]

vt.&vi.

带路,领路,指引Frame[freim]

n.

框架，骨架，构架Magazine

[,mæɡə‘zi:n]

n.杂志,期刊（料盒）Curing

[‘kjuəriŋ]

n.

塑化,固化,硫化,硬化Oven

[‘ʌvən]n.

烤箱,炉Scrap

[skræp]

n.

小片,碎片,碎屑Dent

[dent]

n.

凹痕,凹坑DieLift-off晶粒脱落（芯片脱落，掉芯）Skew

[skju:]

adj.

歪,偏,斜Misorientation

[mis,ɔ:rien‘teiʃən]

n.

定向误差,取向误差Presqueezedel写胶前气压延时Postsqueezedel写胶后气压延时Squeeze

[skwi:z]

vt.榨取,挤出n.

挤,榨,捏Eject

[i‘dʒekt]

vt.&vi.

弹出,喷出,排出Delay

[di'lei]

n.

延迟Height

[hait]

n.

高度,身高Level

[‘levl]

n.

水平线,水平面;水平高度Head

[hed]

n.

头部，领导,首脑Ejectupdelay顶针延迟Ejectupheight顶针高度Bondlevel粘片高度PickLevel捡拾芯片高度Headpickdelay粘接头拾取延迟Headbonddelay粘接头粘接延时Pickdelay捡拾芯片延时Bonddelay粘接芯片延时Index

[‘indeks]

n.

索引;标志,象征;量度Clamp

[klæmp]

vt.&vi.

夹紧;夹住n.

夹具Indexclampdelay步进夹转换延时Indexdelay框架步进延时Shear

[ʃiə]

vt.

剪羊毛,剪n.

大剪刀Test

[test]

n.

测验,化验,试验,检验Diesheartest推晶试验Thickness

['θiknis]

n.

厚(度),粗Coverage

[‘kʌvəridʒ]

n.

覆盖范围Epoxythickness&coverage导电胶厚度和覆盖率Orientation[,ɔ:rien‘teiʃən]

n.

方向,目标DieOrientation芯片方向Void

[vɔid]adj.

空的,空虚的n.

太空,宇宙空间;空隙,空处;

空虚感,失落感Epoxyvoid导电胶空洞Chip

[tʃip]

n.

碎片Damage[‘dæmidʒ]

vt.&vi.

损害,毁坏,加害于n.损失,损害,损毁Chipdamage芯片损伤Backside

[‘bæksaid]

n.

臀部,屁股，背面Chipbacksidedamage芯片背面损伤Tilt

[tilt]

vt.&vi.

(使)倾斜Tilteddie芯片歪斜Epoxyondie芯片粘胶Crack

[kræk]

vt.&vi.

(使…)开裂,破裂n.

裂缝,缝隙Crackdie芯片裂缝/芯片裂痕Lift

[lift]

vt.&vi.

举起,抬起n.

抬,举Lifteddie翘芯片Misplace

[,mis‘pleis]

vt.

把…放错位置Misplaceddie设置芯片NOdieonL/F空粘Insufficient

[,ɪnsə‘fiʃənt]

adj.

不足的,不够的Insufficientepoxy导电胶不足Epoxycrack导电胶多胶Epoxycuring银浆烘烤Edge

[edʒ]

n.

边,棱,边缘Partial

[‘pɑ:ʃəl]

adj.

部分的,不完全的Mirror

[‘mirə]

n.

镜子Missing

[‘misiŋ]adj.

失掉的,失踪的,找不到的Edgedie/partialdie边缘片/边沿芯片Mirrordie光片/镜子芯片Missingdie掉芯/漏芯/掉片Splash[splæʃ]vt.使(液体)溅起vi.(液体)溅落Splatter

[‘splætə]vt.&vi.

(使某物)溅泼Diagram[‘daiəɡræm]

n.

图解,简图,图表Inksplash/inksplatter墨溅Diebondingdiagram上芯图Dieshesrtest推片实验/推晶试验Diesheartester推片试验机Dieshesrtool推片头Metalcorrosion晶粒腐蚀/芯片腐蚀Wafermappingsystem芯片分级系统System

['sistəm]

n.

系统;体系wafer晶圆

die芯片attach粘贴glue银胶substrate基板

magazine盒子inspection检查parameter参数manual操作手册reset重设enter确定error错误input输入speed速度stop停止pressure压力vacuum真空sensor传感器backside背面pin针statistics统计calibration校正bond贴片conversion改机thickness厚度tilt倾斜度shape形状adjust调整contact接触cover覆盖device产品chip崩边pause暂停elevator升降机initial初始化alignment校准cassette盒子tape膜frame框架ring铁圈temperature温度rubbertip吸嘴frametype框架型号nozzle点胶头writer划胶头压焊：Wire

[‘waiə]

n.

金属丝,金属线;电线,导线Bond

[bɔnd]

n.

接合,结合vt.

使粘结,使结合Wirebond/Wiringbonding压焊/焊丝/球焊Goldwire金丝Pad

[pæd]

vt.

给…装衬垫,加垫子n.垫,护垫Bondpad焊点、铝垫1stbond第一焊点Padsize焊点尺寸/铝垫尺寸Capillary

[kə‘piləri]

n.毛细管;毛细血管（劈刀）Pitch

[pitʃ]

程度;强度;高度Padpitch铝垫间距/焊点间距Elongation

[i:lɔŋ‘ɡeiʃən]n.延长;延长线;延伸率Breaking

[‘breikiŋ]

n.

破坏,阻断Load[ləud]

n.

负荷;负担;工作量,负荷量BreakingLoad破断力Pull

[pul]

vt.&vi.拉,扯,拔Shear

[ʃiə]

vt.

剪羊毛,剪n.

大剪刀Wirepull/ballpull（焊丝）拉力Wireshear/ballshear（焊丝）推力Ultrasonic

[,ʌltrə‘sɔnik]

adj.

(声波)超声的Power

[‘pauə]

n.

功力,动力,功率Force

[fɔ:s]

n.

力;力量;力气Ultrasonicpower超声功率Bondingforce压力Bondingtime时间Temperature

[‘tempəritʃə]

n.

温度,气温Bondingtemperature温度Ultrasonicwirebonding超声波压焊EFO打火烧球loop

[lu:p]

n.

圈,环,环状物Loopheight孤高Wirepulltest拉力试验Ballsheartest金球推力试验PIN1第一脚Ballheight球高Balldiameter球径Cratering

[‘kreitəriŋ]

n.

缩孔;陷穴（弹坑）KOHetchingtestKOH腐蚀试验BondCrateringtest压焊腐蚀试验(弹坑试验)Thermal

[‘θə:məl]

adj.热的，热量的Compression

[kəm‘preʃən]

n.

挤压,压缩TCB（ThermalCompressionBond）热压焊BondingDiagram压焊图/布线图WrongBonding布线错误Incomplete[,ɪnkəm‘pli:t]adj.不完全的,未完成的Incompletebond焊不牢Nobonding无焊N2BOX氮气柜RTPC实时过程监控Tray

[trei]

n.

盘子,托盘HandingTray产品盘FBI压焊后目检FBIinsp-M/C压焊检验机Microscope

[‘maikrəskəup]

n.

显微镜LowPowerMicroscope低倍显微镜Flux

[flʌks]

n.

熔剂、焊剂；助熔剂，助焊剂Hook

[huk]

vt.&vi.

钩住,吊住,挂住Wirepullhook线钩（测拉力）Ballsheartool推球头（测推力）Metal

[‘metl]

n.

金属Discolor

[dis‘kʌlə]

v.使脱色;(使)变色,(使)褪色Oxide

[‘ɔksaid]n.

氧化物MetalDiscolor铝条变色BondPadDiscolor铝垫变色BondPadOxide铝垫氧化Stick

[stik]

vt.&vi.

粘贴,张贴Peeling

[‘pi:liŋ]n.剥皮,剥下的皮Cratering

[‘kreitəriŋ]n.

缩孔;陷穴（弹坑）Nonstickbondonpad铝垫不粘Bondpadpeeling铝垫脱落Bondpadcratering铝垫弹坑Limit

[‘limit]

vt.

限制;限定Scratch

[skrætʃ]

vt.&vi.

抓,搔，

刮伤Overreworklimit超过返工数Bondremove/scratch剔球划伤Ballbondnon-stick金球脱落Balltolarge（small）金球过大（小）Ballbondshort金球短路Non-stickonlead引脚脱落（鱼尾脱落）misplace

[,mis‘pleis]

vt.

把…放错位置connection

[kə‘nekʃən]

n.连接,联结MisplacedbondonLD压焊打偏Wirebroken断线Missingwire漏打Wrongconnection错打defective

[di‘fektiv]

adj.

有缺陷的，欠缺的Defectivelooping弧度不良Sagging

[‘sæɡiŋ]

n.

下垂[沉,陷],松垂,垂度Loopsagging弧度下陷Lowloop弧度太低Highloop弧度太高Loopshort弧度短路Overhang

[,əuvə‘hæŋ]vt.伸出;悬挂于…之上Residue

[‘rezidju:]

n.剩余,余渣Distortion

[dis‘tɔ:ʃən]

n.歪曲,曲解WireoverhangonLD跨越引线框架Wireresidue残丝LFdistortion引线框架变形Quantity

[‘kwɔntiti]

n.

数目,数量Mismatch

[‘mis’mætʃ]

vt.使配错,使配合不当Scrap

[skræp]

n.

废料vt.

废弃,丢弃Scratch

[skrætʃ]vt.刮伤QuantityMismatch数量不符EmptyM.notscrap空粘未报废GoldWireScratch金丝受损Parameter参数Statistics统计Utility应用Teach教习Bondtipoffset—焊线点纠偏Contactsearch接触测高Zoomoffcenter放大倍数偏心校准Calibration校准BQM焊接质量控制PR—patterrecognition—图像识别Alignmenttolerance—对点偏差PRindexing—图像控制下的步进Capillary焊线劈刀Wirespool—送线卷轴Windowclamp—窗口夹板Transducer—功率换能器FTN功能键Wirethreading—送线器EFO电子打火Linearpower线性马达Vacuumsensor真空感应器Stepdriver—步进驱动Postbondinspection—焊接后检查Wirepull—拉线Ballshape—推球Ballsize—焊球大小Ballthickness—焊球高度Loopheight—线弧高度Loopshape—线弧形状Neckcrack—线颈折损Fineadjust–精确调整Conversion–换产品1stbondnonstick—第一点不粘2ndbondnonstick—第二点不粘peeling拔铝垫（扯皮）Bondoff脱焊Balldeformation—焊球变形servomotor—伺服电机weldoff管脚脱焊crater裂缝goldwire金线missingball球未烧好weakbond虚焊塑封：Mold

[məuld]

n.

模子,铸型vt.

浇铸,塑造Molding

[‘məuldiŋ]

n.

成型（塑封）Compound

[‘kɔmpaund]

n.

复合物,化合物MoidingM/C；MoldPress塑封机Press

[pres]

n.

印刷机Heater

[‘hi:tə]

n.

加热器;炉子Pre-heater预热机Chase

[tʃeis]

n.

追捕,追猎Molddie/Moldchase塑封模具MGPmoldMGP多缸模具Automold自动包封机load

[ləud]vt.&vi.

1

把…装上车[船]2

装…loader

['ləudə]

n.

装货的人,装货设备,装弹机AutoL/Floader自动排片机handler

[‘hændlə]

n.

(动物)驯化者（抓手）temperature

[‘tempəritʃə]

n.

温度,气温Pre-heatTemperature料饼预热温度MoldTemperature模具温度Clamp

[klæmp]vt.&vi.

夹紧;夹住n.

夹具Pressure[‘preʃə]n.压(力),压强ClampPressure合模压强Transferpressure注塑压强Transfer[træns‘fə:]vt.&vi.转移;迁移n.

转移Curing[‘kjuəriŋ]

n.

塑化,固化,硫化,硬化Curingtime固化时间Curingtemperature固化温度Pre-heatTime（料饼）预热时间Transferspeed注塑速度Transfertime注塑时间PMCtime(PostMoldCureTime)后固化时间Load/unload上料/下料Sweep

[swi:p]

vt.&vi.

扫,打扫,拂去WireSweep冲丝Open开路Short短路Fill

[fil]vt.&vi.

(使)充满,(使)装满,填满Underfill

['ʌndəfil]

n.

(孔型)未充满Bodyunderfilled胶体未灌满Incomplete[,ɪnkəm‘pli:t]adj.不完全的,未完成的Incompletemold未封满Chip

[tʃip]

n.

碎片，缺口Chippackage/bodychip-out崩角Porosity[pɔ:‘rɔsiti]

n.

多孔性,有孔性PorosityBody胶体麻点Bubble[‘bʌbl]

n.

泡,水泡,气泡Blister

[‘blistə]

n.

气泡vt.&vi.

(使)起水泡Smear[smiə]

vt.

弄脏,弄污n.

污迹,污斑Surface

[‘sə:fis]

n.

面,表面Rooughsurface不均匀（表面）Delaminate[di:‘læməneit]

v.

将…分层,分成细层Delaminating分层Void[vɔid]adj.

空的,空虚的PKGVoid胶体空洞Deep[di:p]

adj.

深的Scratch[skrætʃ]

vt.刮伤Bodydeepscratch胶体刮痕Dimension[di‘menʃən]

n.

尺寸,度量MoldPKGdimension塑封体尺寸BTMwidth/length背面宽/长Topwidth/length正面宽/长PKGthick塑封体厚度Mismatch[‘mis’mætʃ]vt.

使配错,使配合不当Moldmismatch/PKGmismatch包封偏差(胶体错位)Offset[‘ɔfset]vt.

抵消,补偿Misalignment[‘misəlainmənt]

n.

未对准Moldoffset/PKGmisalignment偏心PMC（postmoldcure）后固化Dummy[‘dʌmi]

n.

人体模型Strip[strip]

vt.

剥去,

剥夺,夺走Dummymoldedstrip空封Moldflash废胶Gate[ɡeit]

n.

门,栅栏门Moldgate注浇口、进浇口Remain[ri‘mein]

n.

剩余物;残余Gateremain小脚Compound

[‘kɔmpaund]

n.

复合物,化合物Aging[‘eidʒiŋ]

n.

老化,成熟的过程Compound

Aging料饼醒料（回温过程）Locator[ləu‘keitə]

n.

表示位置之物,土地Block[blɔk]n.

大块(木料、石料、金属、冰等)LocatorBlock定位块Ejector[i‘dʒektə]

n.

驱逐者,放出器Pin[pin]n.

大头针,别针，针Depth[depθ]

n.

深,深度EjectorPin顶针E-pinDepth顶针深度Storage[‘stɔ:ridʒ]

n.

储藏处,仓库Coldroom/compoundstorage冷藏库/料饼存放库Air

[ɛə]

n.

空气

Gun[ɡʌn]

n.

枪,炮Coating[‘kəutiŋ]

n.

涂层,覆盖层Material

[mə‘tiəriəl]

n.

材料,原料,素材,资料AirGun气枪DieCoating芯片涂胶AutodiecoatingM/C芯片涂胶机DieCoatingMaterial覆晶胶Cart[kɑ:t]

n.

手推车ASS’YBCart后站推车Tablet[‘tæblit]

n.

药片、胶囊Loader[‘ləudə]

n.

装货的人,装货设备,装弹机Preheater[‘pri:’hi:tə]

n.预热器Fixture[‘fikstʃə]n.(房屋等的)固定装置AutoTabletLoader自动排胶粒机CompoudPreheater高频预热机Load/UnloadFixture上料/下料架TabletMagazine胶粒盒CompoudTablets塑封料饼MoldingCleaningCompoud洗模饼misorientation

[mis,ɔ:rien‘teiʃən]

n.定向误差,取向误差PKGMisorientation胶体压反Moldflashonlead塑封溢胶Moldcrack胶体裂痕Semiconductor半导体Molding–模封Onload上料Offload–出料Belt—皮带Preheaterturntable–预热转盘Transfer传送SafetyDoor安全门Pickandplace–机械手Motor马达Station–模腔Cleaningbrush—清洁刷Cylinder气缸Sensor传感器Solenoid电磁阀Turnover–翻转器Degate–切料口Bearing轴承Picker爪子Pusher–推动器Cullbin–垃圾箱Pin针Vacuumpump—真空泵Mornitor–显示器Cable–导线Pro温度曲线Alarm报警Error错误Driver驱动Sensor–感应器Inspection检查Parameter参数Manual手动,手册Reset复位Initialing初始化Guide–导轨Substrate基板Device产品种类LotTraveller随工单Magazine盒子Cylinder–汽缸Bearing–轴承Stop停止EmergencyStop紧急停止Gripper--夹子Heat–加热器Pipe–管子Temperature温度Hopper–漏斗Compressair–压缩空气Overflow—反面漏胶Semiconductor半导体Molding–模封Operation–操作Flange–法兰盘Pump–泵Chamber–腔体Vent–气孔Value–值Alarm报警Error错误Inspection检查Parameter参数Manual手动,手册Reset复位Initialing初始化Incompletefill模封不全inching扭曲Overflow漏胶Misalignment模封错位Packagemismatch模封错位ResinHole/Void气孔Foreignmaterials外来物Wiresweep线弯曲Roughsurface表面粗糙WrongOrientation模封方向反Eng.Sample工程师样品Stain/Dirtyonpackage表面脏污Resinburr树脂有毛刺Resinflashes毛刺DamageframeFRAME损坏Scratchonpackage树脂表面划伤Evaluation评估Crackpackage树脂开裂SPCsampleSPC样品切筋Trim-Form1切筋TrimmingDambarcut2切筋模Trimdie3成形模Formdie4分离模singulate5冲废De-junk6检测Inspection外观检测7再成型机模具ReformDie8再成型机Reformsystem9料盘Plastictray10连筋Uncutdambar11毛刺burr14溢料Junk15裂纹Crack16离层（分层）Delaminating17管脚反翘Leadtipbend18筋未切Dam-baruncut19筋凸出Dam-barprotrusion20筋切入Dam-barcutin打印Marking1打印Marking2印章Markinglayout3激光打印Lasermarking4油墨打印Ink(UV)marking5正印Topsidemark6背印Backsidemark7镜头Lens8打印不良\模糊Illegiblemarking9漏打Nomarking10断字Brokencharacter11缺字Missingcharacter12印字倾斜Slantmarking13印记错误Wrongmarking14重印Remark15印字模糊（褪色）Fademark16印字粘污Smear19电流current21字体（字形）Font22定位针Locationpin23胶皮打印机Padprinter24激光打印机LaserMarkingM/C25后固化PMC(PostMoldCure)26后固化烤箱PMCOven27打印污斑Markingstain28印记移位Markingshift电镀Plating1电镀Plating2来料Incoming3冲废Dejunk4热煮软化槽SockingTank7检验Inspection外观检测8烘烤Curing/Baking150℃9出料Unload10高速线电镀High-speedPlatingLine11统计过程控制SPC12搭锡Solderbridge13锡丝、锡须Solderflick/Whisker14镀层不良Platingdefects15发黄Yellowish16发黑Blacken17变色Discolor18露底材（露铜）Exposecopper19粘污Smear20镀层厚度Platingthickness7-20um21镀层成分Platingcomposition电镀成分,Sn22外观Outgoing23易焊性Solderability24无铅化Pb-free/leadfree25结合力Adhesiveforce26可靠性Reliability27电解Electrolyticdeflash28清洗（自来水）Citywater29高压清洗Highpressurerinse30脱脂Descale31清洗（纯水）DIwater32活化（合金）Activation33预镀、预浸Pre-dip34电镀Plating35吹风Airblow36中和Neutralization37褪镀Stripper38拖出Dragout39上料机Loader40下料机Unloader41纯锡Tin42纯水(去离子水)DIwater43水压Waterpressure44理化分析Physicalandchemicalanalysis45测厚仪PlatingThicknessMeter/ElectroplatedCoatingThicknessTest46离子污染度测试仪IonContaminationTesterContaminoCT10047C含量测试仪CarbonTester51去氧化HSCUDescale52预浸Pre-dip53电镀电流Current54镀液温度Temperature电镀液platingsolution55电镀槽platingtank56中和Neutralization59烘干Curing60锡球Solderball61锡厚度和成分Snthickness&composition62冲废De-junk去胶渣63去溢料Degate冲塑，冲胶64去飞边Deflash去胶(塑封工序)65锡铅电镀Tinleadplating66无铅电镀Leadfreeplating;Puretinplating67镀层起泡Solderbump68镀层剥落Solderpeeloff69镀层偏厚或偏薄ThickorThinPlating70退锡Solderremove71电镀报废Platingscrap72锡渣Solderpeeling73电镀锡块Solderbump74电镀桥接Platingbridge75电镀变色SPDiscoloration76电镀污染SPContamination77电镀锡攀爬SPadhere78电解除油Electro-degreasing测试Testing1测试Testing2打印Lasermark3编带机Tape&ReelMachine4编带Reel5测试机Tester6分选机TrayTestHandler7Vision检测Directionvision8划伤Scratch9打错Wrongmark10断字