PCBA检验规范资料

PCBA检验规范

PCBA检验规范

编号：

版本:V1、0

生效日期：

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PCBA检验规范

1.修订情况表

修订历史

版本说明作者审核批准生效日期

2.术语表

术语表

名称说明

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PCBA检验规范

目录

1、目得(PURPOSE)...................................................................1

2、范围(SCOPE)........................................................................................................................................1

3、名词解释(WORDSEXPLANATION)....................................................................................................1

4、参考文件(REFERENCEDOCUMENT)..................................................................................................1

5、职责

(RESPONSIBILITY)..........................................................................................................................1

6作业流程及内容(Flowchartand

content).........................................................................................…、1

7、修订权限(AUTHORITYOFMODIFICATION).......................................................................................2

8、附件(ATTACHMENT).............................................................................................................................

2

8、1附件一(PCBA)..............................................................................................................................4

8、2附件二(机构类)......................................................................42

8、3附件三(其它)......................................................................52

PCBA检验规范

1H得(Purpose)

建立产品外观目视检验标准，使产品检验之判定有所依循，同时藉由检验资料得回馈分析建立良

好得wskmanship,防1L不良之发生、

Toestablishthestandardinspectionofproductcosmeticforoperationtofollow,andestablish

wellworkmanshipbyfeedbackandanalyzingtheinspectiondocumenttovoidfailure>

2范围(Scope)

本规范适用于所有产品(含半成品及成品PCBA)得外观目视检验，包含自行生产制造之PCBA,委

托外包生产制造之PCBA,以及外购入厂组立或单独包装出货之PCBA等、

Itfitsallproduct(containingproductandPCBA)appearanceinspection,includingPCBAmade

byselforbyotherpanyandother、

3名词解释(Wordsexplana:ion)

无(None)

4参考文件(Referencedocument)

ANS/IPC-A-610D

5职责(Responsibility)

生产单位(Productionunit):

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PCBA检验规范

负责产品检验之执行、

5.1Beresponsiblefordoingproductinspection

质量管理部(Qualityunit):

负责产品规格之制定及产品品质之抽样检验管制

5.2Beresponsibleformakingproductspecificationandcontrollingthespotcheckof

productquality

6作业流程及内容(Flowchartandcontent)

6、1检验前得准备(preparationforinspecting):

检验前须先确认所使用得工具，材料，胶，清洁剂等，就是否合乎规定、检验PCBA时必须配

戴防静电手套或防静电手环，而成品有外壳部分则K在此限、

Beforeinspecting,besureofthetool,material,glue,cleanser,etc、Operatorshould

havewriststraporelectrostaticgloveforpreventionESD(ElectronicstaticDischarge),

butthefinishedgoodwith。

6、2

若有检验标准未规范得异常现象发生时,不代表该产品允收或拒收，应向值班工程师询问。

Itisnotmeanstheproductacceptorrejectthatthestandardofinspectionhavesome

abnormal,butshouldfeedbacktoengineertoconfirm、

6、3

检验环境要求光线充足，以目视为主，辅以放大镜与卡尺

6、4

外观检验项目基准参见附件一~三.

TheitemofcosmeticinspectionstandardreferenceAppendix1to3、

7修订权限(Authorityofmodification)

本规范由质量管理部工程师撰写，经研发单位及生产单位会签，由质量管理部最高主管核准后实施，

修改程序亦同、

ThiscriteriaispreparedbyQualityunitengineerandsignedoffwithR&D(Researchand

Developdepartment)andProductionunit,andthenapprovebyQualitymanager.Modify

procedureasthesameabove、

8附件Attachment(含记录表单)

8、1附件一:PCBA

Appendix1:PCBA

8、2附件二:机构类

Appendix2:Mechanical

8、3附件三:其它

Appendix3:Other

附件预览总表

附件一：PCBA类附件二：机构类(Mechanical)附件三：其它(Other)

1SMT零件(SMTponent)1外壳(Housing)1标签(Label)

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PCBA检验规范

1-1焊点规格(Soldering2托架，承座(Chassis)2Barcode

SPEC)

3铭板(Overlay)3包装袋(PEbag)

1-2焊点异常(Soldering

abnormal)4散热片(Heatsink)4外箱(Carton)

1-3零件损坏(ponent5绝缘片(Insulator)5Housing

damage)

”4点胶(Stakingadhesive6螺丝，螺帽，垫片(Screwnut)

gluing)7DCseriesconverter系列成品

外观检验标准

2Dip零件(DIPponent)

2-1焊点规格(DIPSPEC)8Transformer

引脚突出

2-2(Leadprotrusion)9Shieldingcover外观检验标准

2-3通孔(PTH)

2-4插件外观(Appearance)

2-5点胶(Adhesivegluing)

2-6DIP高翘(DIPponent

lifted)

3PCB

3-1marking

3-2夕卜观(Surface

appearance)

3-3焊锡性(Solderability)

4Connector,PIN&金手

指(Goldenfinger)

5其它(Other)

5-1螺丝(Screw)

5-2跳线(Jump)

附件一：PCBA类

1SMT零件(SMTponent)

1-1焊点规格(SolderingSPEC)

1-1-1Chip零件(Chipponent)

Defect

Sideoverhang(D)isgreaterthan50%ponent

terminationwidth(W)or50%landwidth(P)whicheveris

less

零件偏移D>50%W或D>50%P拒收

Defect

Sideoverhang(D)isgreaterthan50%ponent

terminationwidth(W)or50%landwidth(P)whicheveris

less

零件偏移D>50%W或D>50%P拒收

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PCBA检验规范

Defect

Anyendoverhang(B)

零件超出pad拒收

Defect

ponentinreservedtolacquertogotocircuittoforma

shortcircuit

零件在有保护漆之线路上造成短路拒收

Acceptable

Endjointwidth(C)isminimum50%ofponenttermination

width(W)or50%landwidth(P)whicheverisless

零件焊点宽度C>50%Wor050%P允收

Acceptable

Maximumfilletheight(E)mayoverhangthelendor

extendontotheoftheendcapmetallization,butnot

extendfurtherontotheponentbody

锡高超过金属端，但未延伸至零件本体允收

Defect

Solderfilletextendsontotheponentbody

锡延伸到零件本体上拒收

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PCBA检验规范

Defect

Minimumfillethgh(F)islessthan25%termination

high(H),orfillethigh(F)islessthan0、5mm

Highvoltagecapacitanceminimumfillethigh(F)isless

than50%terminationhigh(H),orfillethigh(F)isless

than0、75mm

爬锡高度F<25%H或F〈0、5mm拒收

高压电容爬锡高度F〈50%H或F<0、75mm拒收

Defect

Insufficientsolder

锡不足拒收

Defect

Insufficientendoverlap

空焊拒收

1-1-2圆柱体零件(CylindricalEndCapTermination)

Defect

Sideoverhang(A)isgreaterthan50%ofponent

diameter,(W),orlandwidth(P),whicheverisless

零件直径突出A>50%Wor>50%P、拒收

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PCBA检验规范

Defect

Anyendoverhang(B)

零件超出pad拒收

Acceptable

Endjointwidth(C)isminimum50%ponentdiameter

(W)orlandwidth(P),whicheverisless

零件连接直径宽度C王50%Wor50%P允收

Acceptable

Sidejointlength(D)isminimum50%lengthofponent

termination(T)crlandlength(S),whicheverisless

侧面焊点长度D^50%Tor50%S允收

Defect

Solderfilletextendsontotheponentbody

锡延伸到零件本体上拒收

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PCBA检验规范

Acceptable

Minimumfilletheitht(F)issolderthickness(G)plus25%

diameter(W)oftheponentendcap

焊锡高度F“5%(G+W)允收

Acceptable

Endoverlap(J)betweentheponentterminationandthe

landisminimum50%thelengthoftheponent

termination(T)

零件末端与PAD重叠部分JH50%T允收

Defect

Endoverlap(J)islessthan50%ofthelengthofponent

零件末端与PAD重叠部分J<50%T拒收

1-1-3Leadlesschip

Defect

Sideoverhang(A)exceeds50%

castellationwidth(W)

侧面偏移A>50%W拒收

Defect

Endjointwidth(C)islessthan50%castellationwidth

(W)

零件末端焊点宽度C<50%W拒收

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PCBA检验规范

Defect

Minimumsidejcintlength(D)islessthan50%minimum

filletheight(F)orlandlengthexternaltopackage

(S),whicheverisless

零件末端焊点长度D<50%S或50%F拒收

Defect

Minimumfilletheight(F)is25%castellationheight(H)

焊锡高度F<25%H拒收

Defect

Anyendoverhang(B)

零件超出pad拒收

Defect

Minimumfilletheight(F)is25%castellationheight(H)

焊锡高度F<25%H拒收

1-1-4扁平、L型与翼型弓|脚(FlatRibbon,L,andGullWingLeads)

Acceptable

Maximumoverhang(A)isnotgreaterthan50%lead

width(W)

侧面偏移A皂50%W允收

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PCBA检验规范

Defect

Sideoverhang(A)isgreaterthan50%leadwidth(W)

侧面偏移A>50%W拒收

Defect

Minimumendjointwidth(C)isless50%leadWidth(W)

焊点宽度C<50%W拒收

W

Defect

Sidejointlength(D)islessthan80%ofleadlength(L)

焊锡长度D<4/5L拒收

Defect

Soldertouchesthebodyorendsealofhigh-lead

configurationponent

焊锡延伸至零件本体上或封装末端拒收

Acceptable

爬锡高度：Fillet接触到正面吃锡面允收

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PCBA检验规范

Defect

Soldertouchespackagebody

锡延伸到零件本体上拒收

OK

牌f另

Fillet仃接便到正面之用而Fillet波行接寓到正面吃翱面

GoodAcceptable

Transformerhichvoltagepin'ssolderisovertheAcorner

portion,butexnofunctionpin(forallinverters,except

specialcase)

变压器高压Pin吃锡度已达到A处(第一弯角处)允收

Acceptable

SolderisovertheBportion(forallinverters,except

specialcase)

吃锡度超出B处允收

Defect

SolderisalreadyovertheBportion,andbobbinhad

Beendamagedbyiron、

Bobbin被烙铁烫伤拒收

Defect

Minimumheelfilletheight(F)islessthan25%lead

thickness(T)

焊锡高度F<25%T拒收

Defect

Sideoverhang(A)isgreaterthan50%leadwidth/

diameter(W)

零件偏移A>50%W拒收

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PCBA检验规范

Defect

Minimumendjointwidth(C)islessthan50%lead

width/diameter(W)

焊锡宽度C<50%W拒收

Defect

Sidejointlength(D)islessthan80%leadlength

焊锡长度D小于4/5引脚长度拒收

Defect

Soldertouchesthepackageorendseal

焊锡延伸至零件本体上或封装末端拒收

Defect

Minimumsidejointheight(Q)islessthansolder

thickness(G)plus50%diameter(W)ofroundleador

50%thicknessofleadatjointside(T)forcoinedlead

焊锡高度Q<G+50%WorQ<G+50%T拒收

1-1-6J形引脚(JLeads)

Defect

Sideoverhang(A)isgreaterthan50%W

偏移宽度A>50%W拒收

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PCBA检验规范

Acceptable

Minimumendjointwidth(C)is50%leadwidth(W)

焊锡宽度C工50%W允收’

Defect

Sidejointfillet(D)lessthan150%leadwidth

焊锡宽度(D)小于150%引脚宽度(W)拒收

Defect

Solderfillettouchespackagebody

焊锡延伸至零件本体上拒收

1-1-7I形引脚(Butt/IJoints)

Defect

Anytoeoverhang(B)

侧边突出拒收

Defect

Endjointwidth(C)islessthan75%leadwidth(W)

焊锡宽度C<75%W拒收

Defect

Soldertouchespackagebody

焊锡延伸至零件本体上拒收

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PCBA检验规范

Defect

Filletheight(F)islessthan0>5mm[0>02inch]

焊锡高度(F)小于0、5mm拒收

1-1-8向内L型弓I脚(InwardformedL-shapedribbonleads)

Defect

Endjointwidth(C)islessthan50%lead

with(W)

Sideoverhang(A)isgreaterthan50%W

Minimumfilletheight(F)islessthan25%E

焊锡宽度C<50%W拒收

偏移宽度A>50%W拒收

焊锡高度F<25%拒收

Acceptable

Minimumendjointwidth(C)isgreaterthan50%lead

wilh(W)

焊锡宽度CM50%W允收

1-1-9BGA零件(Areaarray/Ballgridarray)

Defect

Morethan50%overhang

偏移50%拒收

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PCBA检验规范

::♦••

:・•Defect

:••••1Solderbridge

•句

:•锡桥拒收

:••・

・•DarkspotsinX-Rayviewthebridgebetweensolderjoints

”•

J:•在X-Ray下焊点间桥接或拒收

♦Solderopen

・

—•

•锡散开拒收

•»•Missingsolder

・•

•漏锡拒收

•

•Solderball(S)thatbridgemorethan25%ofthedistance

::••betweentheleads

•锡珠超出焊点间距25%拒收

♦I

Defect

Fracturesolderconnection

锡裂拒收

1-2焊点异常(Solderingabncrmal)

1-2-1侧立(Mountingonside)

Defect

Chipresistancemountingonside

电阻侧立拒收

Acceptable

Chipcapacitance&Inductanceminimumtypeisless

than1206,mountingonsideandnomorethanfive(5)

chiponeachassemblyaremountedsideways

电容，电感类零件小于1206(含)以下，且单面少于5pcs允

收

1-2-2翻件(Mountingupsidedown)

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PCBA检验规范

Acceptable

Elementofchipponentwithexposeddeposited

electricalElementismountedtowardboard

能导通允收

1-2-3墓碑(Tombstone)

Defect

Chipponentstandingontheirterminal

end(Tombstone)

墓碑拒收

1-2-4共平面(Coplanarity)

Defect

Oneleadorseriesofleadsonponentisoutalignment

andfailstomakepropercontactwiththeland

零件得一个或多个引脚变形，不能与pad正常接触拒收

1-2-5锡未完全熔化(ReRownotplete)

Defect

Inpletereflowofsolderpaste

锡未完全熔化拒收

1-2-6空焊(Nonwetting)

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PCBA检验规范

Defect

Solderhasnotwettedtothelandortermination

空焊拒收

1-2-7冷焊(Dewetting,Disturbedsolder)

Defect

Characterizedbystresslinesfrommovementinthe

connectionwhilesolidifying

冷焊拒收

1-2-8锡裂(Fracturedsolder)

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PCBA检验规范

Defect

Fracturedorcracksolder

焊锡断裂或破裂拒收

1-2-9针孔/吹孔(Pinholes/BIcwholes)

Defect

Blowholes,pinholes,voids,etc

焊锡连接出现气泡，气泡，空白，流出物等

拒收

Acceptable

焊点上紧临零件脚得气孔/针孔,一个焊

点只允许有一个，且其大小须小于零件脚

面积得1/4允收

Acceptable

焊点上未紧临零件脚得气孔/针孔，一个

焊点容许有不超过两个（含），且其大小须

小于零件脚面积得1/4允收

1-2-10锡桥(短路)[Solderbridge(short)]

Defect

Asolderconnectionacrossconductorsthatshouldnotbe

joined

锡桥(短路)拒收

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PCBA检验规范

Acceptable

OnthesamePAD,solderbridge(short)acrossconductors

同PAD上两焊点短路允收

Onthesametrace(Visualization)butnotsamePAD,

solderbridge(short)acrossconductors

目视同线路不同PAD短路允收

1-2-11锡珠(Solderball)

Defect

Solderballdislodge

非附着性锡珠拒收

Entrappedorencapsulatedsolderballsthatare

exceed。、2mmindiameter

附着性锡珠但锡珠直径大小为0、2mm（含）以上

变压器高压端及高压电容旁有附着性锡珠拒收

Solderballattachedonhighvoltagesideof

transformeroraroundhighvoltagecapacitor

Morethan5solderballs（diameterlessthan0、

2mm）per600mm2

锡珠直径大小为0、2mm以下但锡珠数量多于5颗

/6平方公分（含）拒收

PS:锡珠以静电毛刷刷不掉者，判为附着性锡珠

1-2-12锡渣(Soldersplash)

Defect

Soldersplashesthatareexceed0^2mminlength

锡渣长度最长边0、2mm(含)以