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1IntroductiontoSemiconductorPartIIntegratedCircuitFundamentals-
SemiconductorPhysics
IntroductiontoSemiconductorsPrimarymaterialsforIntegratedCircuits(ICs)anddevicesliketransistorsanddiodesEnableinformationprocessing,speed,efficiency,andpowercontrolAdvancedmaterialsincludeGaNandSiCforcutting-edgeapplicationsDefinition&ElectricalResistivitySemiconductorshaveelectricalpropertiesbetweeninsulatorsandconductorsResistivityrange:10^-4to10^8Ω-cm(e.g.,Silicon,Germanium)CriticalforcontrolledelectronflowinelectronicsClassificationofSemiconductorsElementalsemiconductorsfromGroupIVelementsCompoundsemiconductorsfromcombinationslikeGroupIII-VIntrinsic(pure)vsExtrinsic(doped)materialsElementalvs.CompoundMaterialsElemental:Silicon(Si)andGermanium(Ge)Compound:GaAs,GaPwithsuperioropticalandspeedpropertiesUsedinhigh-speedandoptoelectronicapplicationsAtomicStructureofSiliconSiliconhas4valenceelectronsformingcovalentbondsCreatesastablecrystallatticestructureAt0K,siliconbehavesasaperfectinsulatorThermalGeneration&CarrierMovementThermalenergybreakscovalentbondsatroomtemperatureGeneratesfreeelectronsandholesConductivityincreaseswithtemperatureIntrinsicCarrierConcentrationInintrinsicsilicon:n=p=ninidependsontemperatureandbandgapenergyForSiatroomtemperature:~1.5×10^10cm^-3IntroductiontoDopingIntrinsicsiliconhaslowandtemperature-sensitiveconductivityDopingintroducesimpuritiestocontrolconductivityDonorscreateN-type;AcceptorscreateP-typeExtrinsicSemiconductor:N-TypeDopedwithpentavalentelementslikePhosphorusExtraelectronbecomesfreeandincreasesconductivityElectronsaremajoritycarriersExtrinsicSemiconductor:P-TypeDopedwithtrivalentelementslikeBoronCreatesholesasmajoritycarriersKnownasP-type(positivetype)materialKeyTerminologyIntegratedCircuit:multiplecomponentsononechipBandgapEnergy:energytobreakcovalentbondsRecombination:electron-holeannihilationReview&ExercisesSemiconductorsbalanceconductivitybetweeninsulatorsandconductorsDopingcreatesN-typeandP-typematerialsExercises:resistivityrangeandintrinsicvsextrinsic2EnergyBandsandChargeCarriersinSemiconductorIntroductionElectricalconductivitycanbepreciselymanipulatedControlledbydoping,electricfields,andlightHighlysensitivetotemperatureandexternalstimuliTheFormationofEnergyBandsIsolatedatomshavediscreteenergylevelsInsolids,atomicorbitalsoverlapandformenergybandsInnerorbitelectronsremainlargelyunaffectedKeyEnergyBandClassificationsValenceband:highestoccupiedenergybandConductionband:freeelectronsresponsibleforcurrentForbiddengapseparatesvalenceandconductionbandsMaterialClassificationbyBandGapInsulatorshavelargebandgapspreventingconductionSemiconductorshavesmallgaps(Si:1.1eV,Ge:0.72eV)ConductorshaveoverlappingbandsChargeCarrierDynamics:DriftCurrentDriftiscausedbyanappliedelectricfieldElectronsmoveoppositetothefield;holesmovewithitElectronmobilityis~2.5xholemobilityinsiliconMathematicsofDriftandResistivityDriftvelocityproportionaltoelectricfieldandmobilityCurrentdensitydependsoncarrierconcentrationandmobilityResistivityinverselyrelatedtocarriertransportChargeCarrierDynamics:DiffusionCurrentDiffusiondrivenbynon-uniformcarrierconcentrationCarriersmovefromhightolowconcentrationDiffusionconstantsdifferforelectronsandholesTheEinsteinRelationshipLinksdiffusionconstantandmobilityDefinedbythermalvoltageVT=kT/qAt300K,VT≈25.9mVSummaryofKeyTermsValenceelectronsoccupytheouteratomicshellHolesactaspositivechargecarriersBandgapdeterminesconductioncapability3DiodePartIIIntegratedCircuitFundamentals-SemiconductorDevicesIntroductiontoDiodesFundamentalsemiconductordevicesbasedonthePNjunctionFormedbyjoiningP-typeandN-typeregionsonasinglesubstrateProvideunidirectionalcurrentflowformanyapplicationsPNJunctionFormationP-typehashighholeconcentration;N-typehashighelectronconcentrationDiffusionandrecombinationoccurattheinterfaceIonizedatomsformthespacecharge(depletion)regionInternalElectricField&EquilibriumInternalelectricfieldformsfromN-regiontoP-regionDiffusionanddriftcurrentsopposeeachotherEquilibriumresultsinzeronetcurrentwithoutbiasBiasingConditions:Zero&ReverseBiasZerobias:noexternalvoltage,barrierpreventscurrentflowReversebiaswidensthedepletionregionOnlyaverysmallleakagecurrentflowsBiasingConditions:ForwardBiasForwardbiasreducesdepletionwidthAllowslargecurrentflowwithlowresistanceBarriervoltage:~0.7V(Si),~0.3V(Ge)IVCharacteristicsofaDiodeNon-linear,exponentialcurrent-voltagerelationshipKneepointmarksrapidcurrentincreaseHighreversevoltagecausesavalanchebreakdownSpecialDiodes:ZenerDiodesOperateinreversebreakdownatafixedZenervoltageHeavilydopedtocontrolbreakdownpreciselyWidelyusedforvoltageregulationSpecialDiodes:SchottkyDiodesFormedbyametal–semiconductorjunctionVeryfastswitchingandlowforwardvoltagedropUsedinhigh-speedandRFapplicationsOptoelectronics:LEDs&SolarCellsLEDsemitlightthroughelectroluminescenceSolarcellsconvertlightintoelectricalenergyKeyparametersincludeIscandVocSummaryofKeyTermsSubstrate:basematerialfordevicefabricationSpacechargeregion:depletionlayeratthejunctionMajoritycarriers:holesinP-type,electronsinN-type4BipolarJunctionTransistors(BJTs)IntroductiontoBipolarJunctionTransistors(BJTs)TransistorsaretheprimarybuildingblocksofmodernelectroniccircuitsBJTswerethefirsttransistorsdevelopedandarestillwidelyusedUsedforsignalamplificationandswitching;current-controlleddevicesBJTStructureandTypesThreeterminals:Base(B),Collector(C),andEmitter(E)Constructedfromthreedopedregionsformingtwop–njunctionsTwotypes:npnandpnptransistorsBasicOperationPrinciplesBase–EmittercurrentcontrolsCollectorcurrentCollectorandEmitterarenotinterchangeableduetoasymmetryOperationinvolvesbothmajorityandminoritycarriersBJTvs.MOSFET(FET)BJTiscurrent-controlled;MOSFETisvoltage-controlledBJTisbipolar;MOSFETisunipolarBJTsamplifycurrent;MOSFETscontrolcurrentviavoltageCircuitConfigurationsandVoltagesThreeconfigurations:Common-Base,Common-Emitter,Common-CollectorSupplyvoltages:VCCandVBBTerminalandjunctionvoltagesdefineoperationOperatingRegimesSaturation:maximumcollectorcurrent,bothjunctionsforwardbiasedCutoff:nobase-emitterconduction,zerocurrentUsedasON/OFFswitchindigitalapplicationsTechnicalGlossaryBipolarJunctionTransistor(BJT):双极结型晶体管FieldEffectTransistor(FET):场效应晶体管Common-Emitter,Saturation,Cutoff:keyoperatingterms5Field-EffectTransistors(FETs)IntroductiontoFETsVoltage-controlledunipolardevicesusingmajoritycarriersControlledbyanelectricfieldratherthaninputcurrentHighinputimpedance,lowpower,idealforICsJunctionFET(JFET)StructureThreeterminals:Gate,Drain,andSourceConstructedfromathinsemiconductorbar(SiorGaAs)N-channelandP-channeltypesKeyCharacteristicsofJFETsVeryhighinputimpedanceandlownoiseCurrentcarriedonlybymajoritycarriersTemperature-dependentcharacteristicsJFETOutputCharacteristicsIdvsVdsatconstantVgsOhmic,Saturation,Pinch-off,andBreakdownregionsDraincurrentcontrolledbygatevoltageJFETTransferCharacteristicsRelationshipbetweenIdandVgsatfixedVdsIddecreasesasVgsbecomesmorenegative(N-channel)DefinestransconductanceMOSFETStructure&OperationInsulated-gateFETwithoxidelayerExtremelyhighinputimpedanceChannelformswhenVGSexceedsthresholdvoltageMOSFETModesandScalingEnhancementanddepletionmodesExcellentscalabilityforVLSIDominantdeviceinCPUsandmemoryComplementaryMOS(CMOS)TechnologyUsesbothNMOSandPMOSdevicesVerylowstaticpowerconsumptionGlobalstandardforintegratedcircuitsSummaryofKeyTermsThresholdvoltagedefineschannelformationTransfercharacteristicsdescribegatecontrolGaAsusedasalternativeJFETmaterial6SpecialSemiconductorDevicesIntroductiontoSpecialSemiconductorsDesignedforhigh-stakesrequirementsbeyondbasicdevicesEnablepowercontrolandphotonicapplicationsEssentialtopowerelectronicsandoptoelectronicsThyristors–GateTurn-Off(GTO)Threeterminals:Anode,Cathode,andGateCanbeturnedONandOFFusinggatecontrolUsedininverters,choppers,andtractionsystemsTRIACs(TriodeACSwitch)BidirectionalconductionforACpowercontrolEquivalenttotwoSCRsinantiparallelTurnedoffwhencurrentcrosseszeroDIACs(DiodeforAlternatingCurrent)BidirectionaldiodewithoutagateterminalConductsafterreachingbreakovervoltageCommonlyusedtotriggerTRIACsPhotonicDevices–PhotodiodesConvertincidentlightintophotocurrentOftenusePINjunctionforbetterperformanceBandwidthaffectedbyjunctioncapacitanceSolarCells(PhotovoltaicEnergy)ConvertsunlightintoelectricalenergyBasedonp–njunctioncarrierseparationFuturetrendsincludeadvancedsiliconstructuresPowerDiodesDesignedforhighvoltageandcurrenthandlingUseP+–N−junctionstructuresUsedinrectifiersandprotectioncircuitsPowerTransistorsHigh-powerBJTscontrollargecurrentsSmallbasecurrentcontrolslargecollectorcurrentUsedinSMPS,converters,andinvertersTechnicalSummaryGTO:gate-controlledpowerswitchingTRIAC&DIAC:ACpowercontrolandtriggeringPhotodiodes&SolarCells:optoelectronicenergyconversion7AnalogIntegratedCircuitsPartIIIIntegratedCircuitDesignWhyAnalogICsMatterNotallfunctionscanberealizeddigitallyFront-endsignalconditioningisalwaysanalogHigh-speeddigitalsystemsrelyonanalogprinciplesAnalogvsDigitalProcessingAnalog:continuous-time,sensitivetonoiseanddistortionDigital:discretelevels(0/1),toleranttonoiseModernsystemscombinebothdomainsOperationalAmplifiers(Op-Amps)High-gainmulti-stageamplifiersDifferentialinput,single-endedoutputCorebuildingblockofanalogICdesignOp-AmpSymbolandTerminalsInverting(−)inputNon-inverting(+)inputOutputterminalPositiveandnegativesupplyrailsSimplifiedOp-AmpModelModeledasavoltage-controlledvoltagesourceVeryhighinputresistanceLowoutputresistanceLargeopen-loopgainOp-AmpKeyParametersInputoffsetvoltageInputbiascurrentOpen-loopgainOutputvoltageswingPARAMETERTESTCONDITIONSLF411ALF411UNITMINTYPMAXMINTYPMAXVOSInputOffsetVoltageRS=10kΩ,TA=25℃
0.30.5
0.82.0mVΔVOS/ΔTAverageTCofInputOffsetVoltageRS=10kΩ
7
7
μV/℃IOSInputOffsetCurrentVS=±15V(2)(3)Tj=25℃
25100
25100pATj=70℃
2
2nATj=125℃
25
25nAIBInputBiasCurrentVS=±15V(2)(3)Tj=25℃
50200
50200pATj=70℃
4
4nATj=125℃
50
50nARINInputResistanceTj=25℃
1012
1012
ΩAVOLLargeSignalVoltageGainVS=±15V,VO=±10V,RL=2k,TA=25℃50200
25200
V/mVOverTemperature25200
15200
V/mVVOOutputVoltageSwingVS=±15V,RL=2k±12±13.5
±12±13.5
VVCMInputCommon-ModeVoltageRange
±16+19.5
±11+14.5
V
-16.5
-11.5
VCMRRCommon-ModeRejectionRatioRS≤10k80100
70100
dBPSRRSupplyVoltageRejectionRatioSee(4)80100
70100
dBISSupplyCurrent
1.82.8
1.83.4mAOp-AmpACCharacteristicsSlewrateGain-bandwidthproduct(GBW)InputnoisevoltageandcurrentTotalharmonicdistortion(THD)PARAMETER(1)(2)TESTCONDITIONSLF411ALF411UNITMINTYPMAXMINTYPMAXSRSlewRateVS=±15V,TA=25℃1015
815
V/μsGBWGain-BandwidthProductVS=±15V,TA=25℃34
2.74
MHzenEquivalentInputNoiseVoltageTA=25℃,RS=100Ω,f=1kHz
25
25
nV/√HzinEquivalentInputNoiseCurrentTA=25℃,f=1kHz
0.01
0.01
pA/√HzTHDTotalHarmonicDistortionAV=+10,RL=10k,VO=20Vp-p,BW=20Hz-20kHz
<0.02%
<0.02%
VoltageReferencesProvidestable,accuratevoltagesCriticalforADCandDACaccuracyAccuracydirectlylimitssystemresolutionTypesofVoltageReferencesSeries(three-terminal)referencesShunt(two-terminal)referencesTrade-offsinaccuracy,current,andflexibilityDiode-BasedReferencesForward-biaseddiodereferencesZener/avalanchediodereferencesSimplebutlimitedaccuracyandnoiseperformanceBandgapVoltageReferencesBasedonsiliconbandgap(~1.205V)ExcellenttemperaturestabilityOperatesatlowsupplyvoltagesBrokawBandgapCellUsesΔVBEandVBEsummationTemperaturecoefficientminimizedFoundationofmodernprecisionreferencesAnalogFiltersFrequency-selectivesignalprocessingSuppressinterferenceandnoiseEssentialincommun
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