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PhysicalAIandthe
FutureofRobotics
Alookattheforcesshapingthenextgenerationofhardwaretechnology,fromsilicontosteel.
Featuringawarehouseautomationspotlightpoweredby:
July2026
Contents
3LetterFromtheAuthor
5Macro
8ChipsandCompute
12FundraisingandInvestment
16Spotlight:WarehouseAutomation
svb》SBanck。nvaley
ADivisionofFirstcitizensBank
PHYSICALAIANDTHEFUTUREOFROBOTICS20262
svb》SBanck。nvaley
ADivisionofFirstcitizensBank
PHYSICALAIANDTHEFUTUREOFROBOTICS20263
EverythingIsHardwareEverywhere,AllatOnce
Whatmakesthishardwarecycledifferentfromthe
lastisintelligence.Forthefirsttime,robotshavethecapabilitytogeneralizeinnovelways,operatingin
unfamiliarenvironments.ThatshiftintophysicalAIisexpandingthe
addressablemarketforrobotsinunprecedentedways.”
SiliconValleyisre-embracingsilicon.Beforetheappstore,chipsanddevicesweren’tthesideshow;theywerethemainevent.Cisco,IntelandQualcommwerethemostvaluablecompaniesintheworldat
theturnofthemillennium.Fromtheearly2000sthroughtheearly2020’shardwarewassidelined.Itrepresentedlessthanone-fifthofallUSventurecapital(VC)investment.
VCsthisyearareonpacetodeploy$120B,roughlyone-thirdofallinvestment,intoUScompaniesdevelopingphysicaltechnologies.
OneinfiveglobalVCfirmsinvestingtodayhaveatleast10%ofits2026investmentsinUShardwarecompanies.
Whatmakesthishardwarecycledifferentfromthelastis
intelligence.Forthefirsttime,robotshavethecapabilityto
generalizeinnovelways,operatinginunfamiliarenvironments.ThatshiftintophysicalAIisexpandingtheaddressablemarketforrobotsinunprecedentedways.Virtuallyeverywarehouse,factoryand
logisticshubmaysoonbewithinreachofahumanoidhand—atleastifcostsaren’tanissue.
OneofthebiggestopportunitiesforphysicalAI’sdisruptivepotentialisakeyopportunity:supplychains.Moderntechsupplylinesarea
bewilderingmeshofcrisscrossingsuppliersfromaroundtheglobe.Noproductshowsthisbetterthanamodernacceleratorchip.
Just10countriesprovidenearlyallofthecomponentpartsneeded
formodernAIchips.AndwhileTaiwanrightfullyreceivesthefocusasalynchpinproducerofchips,otherAsiancountriesareequally
critical.Outofmorethan100primarysuppliersthatwecounted,57%comefromJapan.
Industrialsettingssuchasfactoriesandwarehousesareanideal
placeforrobotstoprovetheirmettle.Tounderstandhowlogisticsfacilitiesareadoptingandexperimentingwithautomation,we
partneredwithPrologisVentures—thecorporateinnovationarmoftheworld’slargestowneroflogisticsandindustrialrealestate.Withmorethan1.3billionsquarefeetofwarehousespaceunder
management,Prologishasaclearviewoftheinnovationsshapingthewarehousefloor.Inasurveyofroughly400Prologiscustomers,83%haveyettoautomateanyoftheiroperations.Industrial
automationisagreenfield—amassivemarketopportunity.
Executivesinthespaceofferedskepticismaboutthepotential
benefitsofbigswingslikehumanoids.Thegapbetweenthis
skepticismandthetechnology’strajectoryreflectstheuphillbattleroboticscompanieshavefaced.Whilethiscycleofinnovationisnodifferentinintermsofchallenges,theacceleratedcomputebehindthemachinesis.Companiesthatcanimprovetheeconomicsmayhavetheupperhandinawide-opennewmarket.
MarkHarris
HeadofFrontierandClimateTechnologySiliconValleyBank
mark.harris@
ClickThroughtoKeyTakeaways
Tradedisruptionshavestrainedsupplychainsandpushedinflationtoafour-yearhigh.
JumptoPage
ImportsareshiftingawayfromChinaandtowardfriendlier,chip-ladenmarkets.
JumptoPage
Over90%ofhigh-bandwidthmemory(HBM)is
consumedbyfourcompaniesasshortagegrows.
JumptoPage
USVCinvestmentinedgecomputinganddatacentertechareatarecordpace.
JumptoPage
↓
svb》SBanck。nvaley
ADivisionofFirstcitizensBank
UShardwareVCinvestmentisonpaceto
doublein2026,reachinganewrecordhigh.
JumptoPage
Automationisstillearlyatwarehouses.Amedianof40%oflargewarehousesreportsnoautomation.
JumptoPage
AIadoptionisgreatestamonglargersupplychain
facilities(46%)comparedtosmalloperators(28%).
JumptoPage
Onceimplemented,warehouseautomations
oftenexceedsavingsandupkeepexpectations.
PHYSICALAIANDTHEFUTUREOFROBOTICS20264
JumptoPage
Macro
⇨RETURNTOTABLEOFCONTENTS
PHYSICALAIANDTHEFUTUREOFROBOTICS20265
StraitTalk:Supply
LinesUnderStrain
Iran’sclosureoftheStraitofHormuzisripplingacross
worldwidetradingchannels.TheGlobalSupplyChain
PressureIndex(GSCPI),aUSFederalReservemetricthattracks27factorsimpedingtrade,isatitsmost
constrictedlevelinfouryears.WestTexasIntermediate(WTI)crudeisup70%sinceJanuary,andthecosttoshipgoods—byair,seaorland—isrisingwithit.
Adisruptionintheflowofrawmaterialslike
aluminumandresinsiscreatingadownstream
shortageinfinishedproductsforeverythingfrom
electricvehiclebatteriestofertilizer.Asaresult,pricesarerisingacrosstheboard.USinflationspikedto4.2%inMay,thehighestlevelsince2022.
Thestraittypicallyfacilitates$3.5Bworthofdailytrade,includingone-fifthoftheworld’spetroleumproducts.
Withoutthatsupply,manycountrieshavetappedinto
strategicenergyreserves,whichareabundantinwealthycountriesbutnotendless.TheclosureposesriskstothesupplyofsemiconductorsthatispoweringtheAIboom.
Japan,aprimarysupplierofchipinputs,sourcesover
90%ofitscrudeoilfromtheStraitandhasbeendrawingfromitsenergystoressinceMarch.1Taiwanismost
exposedthroughitsrelianceonLNGimports—criticalforpoweringfabs.Powerprovidershavebidaggressivelyin
thespotmarkettosecureLNG,whichhaskeptreservesintact,butatacostoftwicethepriorratepercargo.1
svb》SBianck。nvaley
ADivisionofFirstcitizensBank
SupplyChainsFeelMostPressureinFourYearsGlobalSupplyChainPressureIndex
GSCPI
(StandardDeviationsFromAverage)
5
4
3
2
1
0
-1
-2
-3
-4
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
Recalibration:
PeakBuying:
COVID-19Disruption:Globallockdowns
impedeflowofgoods.
Surgingdemandforconsumergoods
outrunssupply.
Supplypressuresstaynear
RelativeBalance:
thehistoricalaverage.
Spendingsubsidesand
supplypressureloosens.
IranWar:
Strikesonoil
refineriesandthe
closureoftheStraitofHormuzhave
slowedtheflowofgoodsandcausedaspikeinoilprices.
HoisttheSales:ShippingCostsRiseonOilSpike
USProducerPriceIndex:ShippingCostsvs.OilPrices
ShortonCircuitBoards
ProducersPriceIndex(Jan2019=100)
AllCommoditiesBarePrintedCircuitBoards
Trucking
Freight
Crude
Oil(WTI)
Air
Freight
DeepSeaFreight
180
170
160
150
140
130
120
110
100
90
PriceChange
SinceDec2025
+17%
CircuitBoards
+12%
AllCommodities
6
ShippingCostIndex
225
200
175
150
125
100
20192020202120222023202420252026
$140
$120
$100
$80
$60
$40
$20
$0
CrudeOilPrice
2019
2020
2021
2022
2023
2024
2025
2026
Notes:1)AccordingtoreportingfromS&PGlobalandothercommoditynewsoutlets.
Source:S&PGlobal,Reuters,USFederalReserve,USBureauofLaborStatisticsandSVBanalysis.
PHYSICALAIANDTHEFUTUREOFROBOTICS2026
ShiftingTradeWinds
BringChipsAshore
Arethereshoredsectorsintheroomwithus?IntheyearssincethetradebottlenecksofCOVID-19,theterms
“nearshoringandreshoring”haveneverstrayedfarfrompublicview.Googlesearchesforthetermshitsevenall-timehighsinthelastthreeyears,thelatestinJanuary.
Judgingbytherhetoric,youmightexpecthundredsofforeignfactoriestohavedecampedtoplaceslike
AlabamaorFlorida.Butthefactoryopeningshavenotfollowedthesearchtraffic.
Instead,whatwe’reseeingisashiftawayfromChinaandtowardother(mostly)distantmarkets.China’sshareofUSimportshasdropped9percentagepointssince
2019,whileplaceslikeTaiwan(achipmanufacturerfuelingthedatacenterboom),Vietnam(arising
computermaker),Ireland(apharmaceuticalshub)
andMexico(anautoassemblycenter)aredominatingtheirownspecializedpocketsofcommerce.
Onenotableexceptionissemiconductormanufacturing.
ConstructionofUSmanufacturingfacilities(primarilyforcomputerchips)hasjumped6xinthelastfouryears.Yet,thisinvestmentisstillyearsfrombearingfruit.For
example,outofsixfabplantsthatTSMChasannouncedforArizonasince2020,threehavebrokengroundandonlyoneisinproduction.Untilmoresuchplantscomeonline,theUSwillremainanetimporterofadvancedtech.
svb》SBianck。nvaley
ADivisionofFirstcitizensBank
Friendshoring:TradeShiftsAwayfromChinaLargestSwingsinImportShareforTopUSTradePartnersandProducts(2019-2025)1
PercentagePointChangeinImportSharebyCountry
AdvancedTechStillComesFromOverseasBalanceofUSTradeforAdvancedTechnologyProducts2
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
$60B
$40B
$20B
Exports
$0B
Imports
-$20B
-$40B
-$60B
-$80B
-$100B
-9.0
-1.6
-1.5
-0.8
-0.6
-0.5
China
Canada
Japan
Russia
UK
Germany
Taiwan
Vietnam
Ireland
Mexico
Thailand
Switzerland
3.7
3.0
1.4
1.4
1.3
1.3
HowTSMCIsInvesting$165BinArizonaTimelineofTSMCInvestmentsinPhoenixSince2020
HalfaTrillionDollarsonFabsandDataCentersUSConstructionSpendingonComputerandChipManufacturingandDataCenters(12-monthtotal)
ChipManufacturingDataCenters
Producing
Announced
Fab1
(4nm3Chips)
---$65B
$100B
$120B
$90B
$60B
$30B
$0B
Since2022:
$390B
ChipPlants
$120B
DataCenters
Fab2
(3nmchips)
Fab3G-●
(2nmchips)
Fabs4-6,R&D,
PackagingFacilities
2020
2021
2022
2023
2024
2025
2026
2027
2028
2029
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
Notes:1)Trademeasuredindollars.2)Censusdefinitionsofadvancedtechnologiesinclude500commoditycodes10core
groups:biotechnology,lifescience,optoelectronics,informationandcommunications,electronics,flexiblemanufacturing,advancedmaterials,aerospace,weaponsandnucleartechnology.3)Nanometer.
7
PHYSICALAIANDTHEFUTUREOFROBOTICS2026
Source:GoogleTrends,USCensusBureauandSVBanalysis.
ChipsandCompute
⇨RETURNTOTABLEOFCONTENTS
PHYSICALAIANDTHEFUTUREOFROBOTICS20268
AIChipsWeaveaGlobalTapestryofSupplyLines
FlowofMajorAIChipSuppliersbyManufacturingCountryandInputComponent1
ComponentGroup(Suppliers)
Components(Suppliers)
PrimaryManufacturingLocation(Suppliers)
RDLMaterial:8
UpstreamInputs:40
Photoresist:4
Underfill:5
Japansupplies57%ofinputsforsomeAIacceleratorchips.
HBMMoldCompound:3
SubstrateCoreMaterials:4
SolderMask:3
Japan:68
HeatSpreader:3
Lid/ModuleCover:3
C4Bump:3
Non-ConductiveFilm:4
Microbump:4
GlassFiber:4
LogicDie:26
CopperMaterials:2
WaferHandling:3
CleaningChemicals:3
Build-UpFilm:2
SiliconWafer:5
CMPSlurries:3
PackageSubstrate:5
TestSockets:2
TSVMaterials:7 ThermalInterface:4
US:19
HighBandwidthMemory:17
Taiwan:10
HBMTesting:2
CopperFoil:2
CMPPads:2
SouthKorea:8
Germany:7
Belgium:1
France:1
UK:1
HBMMemoryStack:5
SolderBall:5
BarrierMetalTargets:3
PackageTesting:2
SpecialtyGases:5
CoWoS2
Packaging:36
HBMandCoWoS2
packagingarethe
primarychokepointsforcurrentchip
production.
QuartzComponents:2
GraphiteComponents:2
SiliconInterposer:4 LogicFoundry:3
Austria:1
Singapore:1
Notes:1)AnalysisbasedonSVBreviewofprimarymanufacturinglocationsformorethan100suppliersacrosstheAIacceleratorsupplychain,including
upstreammaterials,logicfabrication,HBM,andCoWoSadvancedpackaging.Suppliercountsreflectprimarymanufacturinglocation.RDLisredistributionlayer.C4iscontrolledcollapsechipconnection.CMPischemicalmechanicalplanarization.TSVisthroughsiliconvia.2)Chip-on-wafer-on-substrate.
PHYSICALAIANDTHEFUTUREOFROBOTICS20269
Source:SVBanalysis.
2025
HungryHungry
Chippos
ThesupplychainforAIchipsisperhapsthemost
complicatedandcriticalofanyproducttoday.InsatiabledemandforcomputefromtherapidgrowthofAI
inferenceispushingcurrentdatainfrastructuretoits
limits.Advancedchipmakershaveadded13gigawatts(GW)ofannualsemiconductorpowertothemarket
since2022,withNVIDIAaccountingfortwo-thirdsofthatsupply.ThecumulativedrawfromthoseAIchipsisequivalenttoacountrythesizeoftheNetherlands.Morethan830datacentersareunderwayintheUS.1Major
marketslikeDallasandNorthernVirginiahavelessthan1%vacancyatexistingfacilities.Powerprojectsarelininguptomeettheexpecteddemand.Themedianwaitforaproposedprojecttobeapprovedforconnectiontothe
gridisnow45months,up36%fromtwoyearsago.
Beyondthepowerneeds,thechipsrequireacomplicatedwebofcomponentsthatcomefromaroundtheworld,yettherearesomevulnerablebottlenecks.WhileTaiwanis
theepicenteroffabrication,ouranalysismorethan100
suppliersfoundthat57%ofinputsforAIaccelerators
comefromJapan.ManufacturingseveralkeycomponentssuchasphotoresistsandHBMmolds,Japanhasanear
monopolyoncertainparts.ThatchokepointcouldslowthegrowthofAI-enableddevicesastheycompetewithdatacentersforscarcegoods.Thetopfourchipmakerscurrentlyconsume90%ofHBM.
svb》SBianck。nvaley
ADivisionofFirstcitizensBank
ChipsAddPowerDemandtotheGrid
CumulativeChipSalessince2022byTotalChipPower(GW)2
NVIDIAGoogleAMDHuaweiAmazon
TopFourChipmakersControl90%ofKeyInputsGlobalShareofSemiconductorComponentsConsumedin20253
NVIDIAGoogleAMDAmazonOther
14
12
10
8
6
4
2
0
8.67.0
5.74.7
3.7
1.81.01.21.5
0.6
2.2
2.8
0.8
2.2
1.6
0.4
Q1
Q2Q3
2024
Q4
Q1
Q2Q3
2025
Q4
CoWoS
Packaging
HighBandwidthMemory(HBM)
AdvancedLogicDies
9%
60%
69%
88%
10%
8%
0%20%40%60%80%100%
ApprovalTimesStretchforNewPowerProjectsMedianMonthsFromInterconnectionRequesttoAgreement4
TopDataCenterMarketsHave<1%VacancyColliers:DataCenterVacancyRatesbyUSMarket
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2020
2025
60
45
30
15
0
9622061
MedianMiddle50%
PowerCapacity
inQueue(GW)
SaltLakeCityReno,NVNorVA
Columbus
Austin
Dallas
Phoenix
Atlanta
NewYork
ChicagoNorCal
Houston
LosAngeles
0.2%
0.4%
0.4%
0.4%
0.6%
0.8%
1.1%
1.1%
2.0%
2.1%
3.5%
4.0%
5.3%
Notes:1)AccordingtoBloombergNEF.2)CumulativeannualpowerdrawequivalentofchipssoldaccordingtocalculationsbyEpochAI.AMDisAdvancedMicroDevices.3)EstimatesanddefinitionsfromEpochAI.4)Interconnectionrequestsarerequiredforpowerplantstosellpowertothegridbutarenotrequiredforplantsusingpowerforprivateprojects.
10
Source:Colliers,BloombergNEF,EpochAI,LawrenceBerkeleyNationalLabandSVBanalysis.PHYSICALAIANDTHEFUTUREOFROBOTICS2026
HavingYourAIandUsingIt,Too
IfAIisbecomingthenucleusofcomputing,tokensaretheatomicunitofAIcost.Yettheeconomicsofinference
differdramaticallydependingonhowyoudeployit.Cloudinferenceforknowledgeworkisgettingbothsmarterandcheaper,whichisdrivingadoptioninwhite-collarjobs.
HavingAIwriteanemailcostsabout1,000tokens,or
aboutfivecents.Summarizinga60-minuteteam
meeting?That’s100ktokens,or$5.Dollarcostsfor
individualtaskslikethesearealreadydropping
quickly.Thechallengeishowtostringthesetasksintofullyautomatedroles.
AgenticAIcandothat,butatasteeptokenmultiplierthatishardertoquantify;agentsuseupto1,000xmoretokensthansimplequeries.1GoldmanSachsestimatesagenticworkflowswilldrivea24xincreaseintokenconsumptionby2030.DatacentersrunningAIreasoningmodels
dependonHBM,whichisinshortsupply.Onegroup
competingforHBMisAI-embodiedmachines,which
mustcontendwithanotherfactor:latency.Real-worldAIneedshighmemoryitcan’toutsourcetothecloud.Lag
thatistolerableinachatbotmightbecatastrophicforahumanoid,makingHBMshortagesasupplychain
constraintforrobots.FoundersinwarehouseautomationtodaymustthereforenavigatebothtokenpricingandthebottleneckofsupplyforHBM.
svb》SBianck。nvaley
ADivisionofFirstcitizensBank
InferenceWillBecometheWayWeComputeWhatOfficeWorkCanYouAffordToInfer?
EstimatedGlobalDataCenterWorkloadsbyUseType3EstimatedTokenCostsforVariousInferenceTasks2
wTraditionalWorkloadsAITrainingwAIInference
Task
Tokens
2026Cost
Draftanintroductoryemail
~1K
$0.05
Review100linesofcode
~10K
$0.50
Summarizea5K-wordarticle
~25K
$1.25
Comparetwo50contracts
~100K
$5
Summarizea90-minutevideolecture
~180K
$9
Analyzea10-KFiling(Agentic)
~300K
$15
Route100CustomerTickets(Agentic)
~350K
$17
Screen200Candidates(Agentic)
~800K
$40
37%
ofdatacenterworkloadswillbeforAIinference
by2030.
9%
14%
13%
77%
50%
37%
20252030
EventheWorstAIModelsArePrettySmartNowPerformanceofAIModelsontheEpochCapabilitiesIndex
AIModelsAreGettingCheaper,butUnevenly
AIApplicationsbyApproximateMemoryandLatencyRequirements
160
140
120
100
80
60
40
USDper1milliontokens
40
35
30
25
20
15
10
5
0
2022202320242025
2023202420252026
Notes:1)StanfordDigitalEconomyLab“HowareAIagentsspendingyourtokens?”2)Estimatesbasedonblendedinferencerateoffivecentsper1,000tokensandpublishedbenchmarksoftokencostandperformance.3)Colliersestimate.
PHYSICALAIANDTHEFUTUREOFROBOTICS202611
Source:Colliers,EpochAIandSVBanalysis.
Fundraisingand
Investment
⇨RETURNTOTABLEOFCONTENTS
PHYSICALAIANDTHEFUTUREOFROBOTICS202612
WhatHaveYouDone
forMe,Latency?
Asedgecomputeandcloudinferencebothscale,theyarecompetingforthesameconstrainedsupplychains.
Yet,theeconomicsdifferinkeyways.
MachinesrunningphysicalAIhavestrictlatency
requirementscomparedtoinference.Adriverlesscarora
pick-and-packrobotmakingsplit-seconddecisionscan’t
toleratethesamelagthatisitacceptableforAIchatbots.Asaresult,thesedevicesmustcarrytheircomputehardwareonboard.Ratherthanbenefitingfromtheeconomicsof
tokenpricingthroughdatacenters,next-generationAIdevicesrequirethesameexpensivecomponentsthatarebeingchanneledtodatacenters.Thisstrainsthe
economicsandusecasesforadvancedrobots.
Asrobotsmovetowardgeneralizedtasks,theirlatency
andmemoryrequirementsgrow.Machinescapableofthekindofdexterityneededforassembly,forexample,
requireashiftfromtraditionalDRAMmemorytoHBM.
VC-backedcompaniesaresteppinginwithspecializedproductsforedgecompute.CompanieslikeHailoand
Rebellionsaremanufacturinginferencechipspurpose-builtforon-devicephysicalAI.Thespaceisearlyinits
evolution.Asthesechipsmatureandproliferate,the
economicsofon-deviceinferencecouldfollowthesamedeflationarycurvethatreshapedcloud-computing.
svb》SBianck。nvaley
ADivisionofFirstcitizensBank
Edgevs.Cloud:TwoAIPathsDivergingintheWorkingWorldAIApplicationsbyApproximateMemoryandLatencyRequirements1
CloudInferenceEdgeCompute
HighLatencyToleranceLow
PhysicalAIcompaniesfaceaconstraintthatcloudAI
companiesdonot:Theycannotaffordtolag.Toavoidcriticalglitches,deviceslikehumanoidrobotsmustcarrytheir
computewiththem.Companiesarerespondingwithhardwaretoimprovetheperformanceandeconomicsofedgecompute.USVCinvestmentinedgecomputeisontrackfor$3.4B
across100dealsin2026,whichwouldbothbeall-timehighs.
Traditional
HighBandwidth
Memory
Memory
Pick/Pack
Humanoids
Assembly
Robots
AVs
Robots
On-PremCompute
Video
Monitoring
CloudCompute
LLM
Inference
LowMemoryBandwidthRequiredHigh
Cloudinferenceapplicationslikedocumentprocessingcantoleratelatency,butthechallengeisaboutvolume.
Stringingtasksintoautonomousworkflowsconsumesmuchmorecomputethansimplequeries.Investorsaredeployingrecordamountsofcapitalintocompaniesmakingcomputemoreefficientfordatacenters.USVCinvestmentintodatacentercompaniesisonpacetoeclipse$12Bin2026.
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
USVCInvestmentinEdgeComputeCompanies
DealsCapital
$4B
$3B
10196100
89
8078768171
65
$2B
$1B
$0B
USVCInvestmentinDataCenterCompanies DealsCapital
283
$15B
232
$12B
181
158
149
138
$9B
114
128127113
$6B
$3B
$0B
Notes:1)VCinvestmentinedgecomputingincludescompanieswithkeywordsintheirdescriptionthatareassociatedwithedgecomputingsuchasedgecomputing,edgeai,aiofthings,embeddedai,neuromorphiccomputing,neuromorphicchips,andedgedevices.VCindatacentercompanieskeywordssuchas:datacenterinfrastructure,aiinfrastructure,cloud
computinginfrastructure,gpucloud,liquidcooling,anddatacenter.2)DRAMisdynamicrandom-accessmemory
PHYSICALAIANDTHEFUTUREOFROBOTICS202613
Source:PitchBookData,Inc.andSVBanalysis.
EarningsCall,
AutomationAnswers
VCsrecognizethecomingwaveofreal-worldautomation,andtheyareshiftingtheirinvestmentstomatch.In2022,just9%ofVCinvestorshadatleast10%oftheirdealsinUShardwarecompanies;in2026,thathasjumpedto22%.ManyVC-backedsoftwarefoundersworryabout
obsolescenceinthefaceofAIdisruption.Becauseofits
physicalIP,hardwareismoreresilienttodisruption.Infact,itismadepowerfulbynewAImodelswithpotentialto
improvehardwaregeneralizability.
Amidlaborshortagesandoperationalpressure,executivesincreasinglyseeautomationasacoregrowthstrategy.
Mentionsofautomationoncorporateearningscallshave
jumpedthreefoldsince2020.AIimplementationanda
broaderfocusoncorporateefficiencyhaveonlysharpenedthefocusonautomation.Formostcompanies,automationmeansnotjustimplementingAIsoftware,butalso
implementingphysicaltechnologiesinmanufacturing,
warehouses,andtransportation.VCinvestmentin
hardware-focusedcompaniesthisyearhasalready
eclipsedthefull-yeartotalin2025andisonpaceto
reach$120Bbyyear-end.Excludinginvestmentsin
AnthropicandOpenAI,hardwarecompaniesaccountfor
nearlyathirdofVCinvestmentthisyear.Oneareaof
particularinterestisdefensetech.Inasignofthe
enthusiasmforgovernmentapplications,defense-orientedcompaniesarecommandinga31%premiumtoall
hardwarecompanies.
svb》SBianck。nvaley
ADivisionofFirstcitizensBank
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
100in2010
Corporatefocusonautomation
outstripsinvestorfocusafter
COVID-19laborandsupplychain
disruptionsbegin.
Indexedto
CorporateAmericaObsessedWithAutomationAutomationMentionsinEarningsCallsandbyFormerly
VC-BackedCompanies
EarningsCallMentionsofAutomation
VCDealsintoCompaniesthatMentionAutomation
1600
1400
1200
1000
800
600
400
200
0
HardwareInvestmentReachesNewHeights
USVCInvestmentinHardwareCompaniesandShareofTotalVC
Capital
Year-End
%ofVCTotal
Extrapolation
(excludingAnthropic
andOpenAI)
30%
$160B
$120B
$80B
$40B
$0B
17%16%20%17%19%18%15%16%18%20%21%
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
InvestorsTurntoHardware
PercentageofGlobalVCInvestorsWithatLeast10%ofDealsinUSHardwareCompanies1
22%
15%
13%11%
9%9%9%9%
20192020202120222023202420252026
Dual-Use?VCsPayaPremiumforDefenseTech.Pre-MoneyValuationPremium/DiscountforUSVC-BackedDefenseTechCompaniesComparedtoUSVC-BackedHardwareCompanies
72%
31%
16%
11%
22%17%24%18%
6%
-3%
-17%
-23%
Notes:1)Numeratorisinvestorswithatleast10%ofVCdealsinUShardwarecompanies;denominatorisinvestorswithatleast10%ofVCdealsinUScompanies.
14
Source:PitchBookData,Inc.,CBInsightsandSVBanalysis.PHYSICALAIANDTHEFUTUREOFROBOTICS2026
Let’sGetPhysical
AI
Oneofthecorechallengeswithautomatingwarehousesisthatrobotshavehistoricallybeendevelopedfora
specifictask.Often,thesetasksarehighlystandardizedwithfewobstacles(smoothfloors,consistentparts,etc.).Inmanywarehouses,thissimplyisn’tthereality.As
physicalAIcommercializes,thepromiseismodels
thatallowrobotstogeneralizeandperformawide
rangeoftasksinavarietyofenvironments.Thisnot
onlydrasticallyincreasesthepotentialtoautomatemoreofthesupplychain,butitalsoincreasesthetotal
addressablemarketthatroboticscompaniescanserve,makingthemmoreattractivetoventureinvestors.
ThescalinglawsthatunlockedLLMslikeClaudeandChatGPTcatapultedusintotheAIage.Butthose
scalinglawsdon'tapplyinthesamewaytophysicalAI.PhysicalAIfaceshardconstraintsli
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