外媒外刊-OCP亚太2026：人工智能基础设施正逐步超越GPU-OCP APAC 2026：AI Infrastructure Is Moving Beyond the GPU-20260817

AlInfrastructureIsMovingBeyondtheGPU

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◎/p/ocp-apac-2026-ai-infrastructure-is

SEMIVISIONAugust17,2026

OCPAPAC2026:AlInfrastructureIsMovingBeyondtheGPU

ThemostimportanttakeawayfromOCPAPAC2026isnotanotherGPUroadmap.ItisthattheAlinfrastructurebottleneckismovingoutward.

Forthelastthreeyears,theAltradehasbeendominatedbyarelativelyconcentratedsetofcomponents:GPUs,HBM,advanced-nodewafers,andadvancedpackaging.Thoseremaincritical,butthenextphaseofdeploymentisexposingconstraintselsewhereinthesystem.

·Powerdistributionisbecomingharder.

·Coolingisbecomingasystem-levelproblem.

·Fiberdensityisincreasingfasterthandata-centerphysicalinfrastructurewasdesignedtohandle.

·Managementcomplexityisrising.

·Packagesaregettinglarger.

2/26

·Andvalidationequipmentincreasinglyneedstohandlepowerlevelsthatwouldhavelookedabsurdforaserveronlyafewyearsago.

ThatiswhyOCPAPACincreasinglylookslesslikeaserverconferenceandmorelikeanAlinfrastructuresupply-chainconference.

OCPMeetingtheMarketandShaeigtheFreofAI

INTERNATIONALCOMMUNITY

HyperscaleCentric

Sustainability

OPEN

ComputeProject

OPENINNOVATION

·Hyperscale-provendesigns

·TrustedIPmodel

·Specificationsforbestpractices

·Rapidtechnologyadoptionsand

deployments-FTTM

·Mutti-Vendorecosystem

·Multi-VendorSupplyChain-costreductions

·FutureTechnologies(FT)

·OCPMarketPlace

·OCPReady

·OCPExperienceCenters

·OCPWWServiceProviderProgram

ThecompaniesworthwatchingarethereforenotlimitedtoNVIDIA,AMD,Broadcom,ortheserverODMs.

Thenextlayerofvaluecreationismovingintopower,thermalmanagement,optics,systemcontrol,packaging,andtest.

3/26

LeadingtheFutureofAI

Stats:

ForTheAPACOCPCommunity-Today!

APAC25%of

OCPMembers

10%ofOCPStartup

Members

~20%ofOCPContributions

participation

haveAPAC

$18B2029APAC

OCPRecognized

Equipment

Spend

SemiVisionattendedthefirstOCPAPACSummitinTaiwanlastyear,andwewerealreadyimpressedbythescaleandqualityoftheevent.Thisyear,itfeelsevenbigger.Lastyear,theeventwasmainlyheldonthe7thfloorofTaipeiNangangExhibitionCenterHall2;thisyear,theexhibitionboothsanddiningareahaveexpandedtothe4thflooraswell.

Youcanclearlyfeelthatmorecompanies,engineers,andindustryleadersarejoiningtheOCPcommunity.Taiwan'sroleasacriticalhubforAlandsemiconductorsmakesita

naturalmeetingpointforglobalcompaniestovisitthesupplychain,exchangeideas,andbuildnewconnections.WelookforwardtoseeingOCPAPACcontinuetogrowbiggerandstrongerinTaiwan.

Belowwewillshare:

·AlInfrastructureIsShiftingFromServerstoRacks

·PowerlsBecomingOneofAI'sHardestEngineeringProblems

·LiquidCoolingHasEnteredtheQualificationPhase

·KAORIandtheHeat-ExchangeLayer

·AINetworkingIsRunningOutofPhysicalSpace

·CPOIsanEcosystemProblem

·A'sBottleneckIsMovingThroughtheStack

4/26

LeadingtheFutureofAI

MANYTHANKSTOOUR2026OCPSUMMITSPONSORS

u2=

intel

arm

AlInfrastructureIsShiftingFromServerstoRacks

Thefirstarchitecturalshiftisstraightforward:

Theserverisnolongertherelevantunitofdeployment.Therackis.

CompaniessuchasMiTACareincreasinglypresentingAlinfrastructureattheracklevelratherthanasindividualcomputenodes.

5/26

MiTACComputingshowcasednewrack-scaleinfrastructureforAgenticAlatOCPAPAC2026,including

theglobaldebutofitsC2810Z6andC2610Z6HPCservers.Co-developedwithAMD,bothsystems

feature6thGenAMDEPYCprocessors,SP7/SP8platforms,andPCleGen6.

ThismattersbecausetheeconomiccontentofanAlsystemchangessignificantlywhenthecustomerbuysarackratherthanaserver.

AtraditionalserverODMprimarilyintegrates:

CPU+DRAM+storage+NIC+PSU.

AnAlrackrequiresintegrationacrossamuchlargerstack:

GPU+CPU+HBM+networking+storage+powershelves+busbars+BBU+CDU+manifolds+firmware+rackmanagement.

Thedeploymentmodeliseffectivelymovingthrough:

Server→Rack→Cluster→AlFactory

ThischangeshowinvestorsshouldthinkabouttheODMopportunity.

Serverunitshipmentsbecomelessinformative.

Themoreusefulquestionis:

Howmuchofthetotalrack-levelBOMcaneachsuppliercontrol?

Avendorresponsibleonlyforassemblingcomputetrayscapturesaverydifferent

economicopportunityfromoneresponsibleforrackintegration,cooling,powervalidation,firmware,anddeployment.

6/26

TheMostDemandingDataCenterWorkloads

RequiresEnd-to-EndLeadershipinCPU,GPU,andNetworking

AMDA

AMDA

AMDA

EPYC

INSTINCT

PENSANDO

HighperformanceAlsystemsforthedatacenter

ThewinnerinAlservermanufacturingmaythereforebethecompanythatmovesfurthestupstreamintosystemintegration,notnecessarilythecompanyshippingthelargest

numberofserverboxes.

PowerIsBecomingOneofAlI'sHardestEngineeringProblems

Thenextbottleneckispower.

Asrackpowermovesfromtensofkilowattstowardhundredsofkilowatts,traditionallow-voltagedistributionbecomesincreasinglyinefficient.

7/26

TheIndustryIsConvergingon800VDCMorecompute,network,andpowerdensity|Moreintelligencepermegawatt

P

AC

026

StrongOCPcommunityalignmentaround800VDCfaciltypowerdistribution

Adoptioncanstartnow

·PhasedAc/DCcoexistence,openOEMecosystemdevelopmentJointindustryandregulatorycolaborations

·Ensuresaferelableoperationsandstandards

OCPacceleratingscalebydrivingopenstandardsandbroadecosystemparticipation

Thebasicphysicsissimple.

Foragivenpowerlevel:

P=V×1

Increasevoltageandcurrentdecreases.

Atmegawatt-scalepowerlevels,thatmattersenormously.

Lowercurrentreducesconductorsize,busbarrequirements,resistivelosses,connectorstress,andthermalload.

Thisiswhy800V-classHVDCarchitecturesarebecomingstrategicallyimportant.Butthereisamisunderstandingaround800V.

800Vdoesnoteliminate48V.

Themorelikelyarchitectureishierarchical.

Higher-voltageDCmovespowerefficientlyacrossthedatacenterandtowardtherack.Conversionthenhappensclosertotheserverboardoraccelerator.

Theemergingstackcouldincreasinglyresemble:

Grid→MVAC→SST/Rectifier→800VDC→48V→PointofLoad

8/26

【价值目录】网整理：

Thiscreatesseveralnewsemiconductorandequipmentopportunities.

Butoneoftheleastappreciatedistest.

Chroma:ThePicks-and-ShovelsPlayBehind800V

ChromaisoneoftheTaiwanesecompaniesworthpayingcloseattentionto.

MostdiscussionaroundAIpowerfocusesonDelta,Vertiv,Eaton,Schneider,orpowersemiconductorsuppliers.

Buteverynewpowerarchitecturemustbevalidatedbeforedeployment.

Andvalidatingan800VarchitectureismateriallydifferentfromvalidatingaconventionalserverPSU.

Thesystemneedstotest:

Input-voltagebehaviorOutputregulation

ConversionefficiencyRippleandnoise

Loadtransients

GPUpowerexcursions

Overvoltageandundervoltageprotection

OvercurrentprotectionShort-circuitbehaviorFaultrecovery

Hot-swapoperationCommunication

Long-durationreliability

Thetestequipmentalsoneedstohandleextremelyhighpower.

Thisisthehiddenproblem.

Testinga100kWpowersystemmeansthetestplatformitselfmustsourceorsink100kW.

9/26

At1MW,theproblembecomesinfrastructure-scale.

Thismakesregenerativetestingincreasinglyimportantbecausesimplyconvertingalltestenergyintoheatbecomeseconomicallyandoperationallyinefficient.

Thetransitiontoward800Vthereforecreatesasecond-orderbeneficiary:

High-powerprogrammabletestequipment.

Chromasitsdirectlyinthislayer.

ThecompanyisnotsellingGPUs.

Itissellinginfrastructurerequiredbeforenext-generationpowersystemscansafelyentermassproduction.

Thatisexactlythetypeofsecond-orderAlsupply-chainexposureinvestorsshouldbelookingfor.

PowerDeliveryIsAlsoMovingTowardtheSilicon

Powerissimultaneouslymovingintheoppositedirection.

Whiledatacentersareincreasingvoltageatthefacilitylevel,chipdesignersaretryingtodeliverpowerclosertothecomputedie.

CompaniessuchasEmpowerSemiconductoraredevelopingverticalandlocalizedpower-deliveryarchitecturestargetinghigh-currentAlprocessors.

ENABLINGNEWLEVELSOF

Top/DiesiceiPD

POWERANDSIGNALINTEGRITY

·Deeptrenchcapacitortechnology

·Singleormulti-domainscapacitors

·UItra-lowESL

·Lessthan5pH

·UItra-lowESR

·Widebandwidth10MHz-10GHz

·Highcapacitancedensityformfactor

·Uitra-thinproflle:downto50μm

·Customprofileavallable

·Substrateembedding

·Die/landsidemounting

·Stabilityandreliability

·NoDCorACderating

·Noagingortemperaturederating

·Standard&customsolutions

EMPOWER:POWERINTEGRITYSILICONCAPACITORS

Thisillustratesthebroaderproblem.

10/26

Alpowerdeliveryincreasinglyspanstheentirestack:

Grid→DataHall→Rack→Board→Package→Silicon

OptimizingGrid-to-Chip

■Crilicalpowerproducls

■Embeddedpowerproduets

■Coolingproducts

$4.8Billion

switchgear

DataCenterbusinessFY2550%YoYgrowth

Posereditibulo

15%+

→Storoge

Remotepower

ponels(RPP)

ofFlexrevenue

Trackbuswcy

$6.5Billion

DataCenterbusiness

Powersupplies

FY26+20%3YRCAGR

LeadingtheFutureofAI.

Everylayercreatesadifferentengineeringconstraint.

Thedata-centerproblemisvoltageanddistributionefficiency.

Theboardproblemiscurrentdensity.

Thepackageproblemisparasitics.

Thesiliconproblemisvoltagedroopandtransientresponse.

AsacceleratorTDPcontinuesrising,powerdeliverystopsbeingasupportingfunctionandbecomespartofcomputearchitectureitself.

LiquidCoolingHasEnteredtheQualificationPhase

Liquidcoolingisanotherareawherethediscussionhaschangedsignificantly.

Theindustryisnolongerdebatingwhetherhigh-endAlrackswilluseliquidcooling.Thatdecisionhaseffectivelybeenmade.

Therelevantquestionisnow:

Whichcomponentsbecomestandardizedandqualified?

Thisiswheretheeconomicsbecomeinteresting.

11/26

【价值目录】网整理：

Aliquid-coolingloopcontainscomponentssuchas:

ColdplatesPumps

Quickdisconnects

Hoses

Manifolds

Heatexchangers

CDUs

Sensors

Leakdetectionsystems

ManyofthesecomponentsareinexpensiverelativetotheGPU.

Buttheirfailurecostisenormous.

A$50connectorcanpotentiallyinterruptarackcontainingmillionsofdollarsofcompute.

Thischangescustomerbehavior.

Hyperscalersarethereforeunlikelytooptimizesolelyaroundcomponentprice.Theyoptimizearound:

Reliability+Qualification+Serviceability+Standardization

ThatiswhysupplierssuchasCPC,Danfoss,nVent,andKAORIdeserveattention.

12/26

FactSheet|DCmarket

Danfoss'Solutionto

Onepartner,completesolution

DanfossHansen®FD83Series

Anindustrystandard,ourstainlesssteel

FD83hasbeensupportingdatacenter

liquidcoolingreliablyfordecades.

BostonbyDanfoss

EHW194EPDM-PHose

Engineeredfordurablltyandeaseofuse,EHW194UL94V-0hosesfeature

industryleadingsafetyratings,superiorkinkresistanceand

long-lastingpertormance.

DanfossHansen°UniversalQuick

DisconnectBlind-Mate(UQDB)

OffersaseM-alignmentfeaturetohelpcon-

nectinlocationwithlimitedaccessorvisibill-

tyandguarantees100%helium-leaktesting.

DanfossHansen°OCPORV3

Blind-MateQuickConnector

Itsself-centeringdesignoffersmis-

alignmentcompensation,ensuring

simpleandsecureconnectionbetweenthebladeandrackmanifold.

DanfossHansen°Universal

QuickDisconnectCoupling

ComplyingtoOCPstandards,theUQDprovideshighflowandreduced

pressuredroptofitinner-rackapplicationneeds.

EverCool”"GH001Hose&EZClipFittings

Compatiblewithmainrefrigerantonthemarketwithlowpermeationassembly-idealsolutionfortheapplication.

90°SwivelAdapter

Specifcallydevelopedfor

liquidcoolinghoseassemblyconnection.

SocketlessHoseandFitting

Engineeredtobeflexible,abrasion

resistance,perfectforlowpressureandveryeasytoassembly,notoolsneeded.

1|oDanfoss|ProducedbyPowerSolutionsISeptember2025AM493434529845en-000102

KAORlandtheHeat-ExchangeLayer

Taiwan'sKAORIrepresentsanotherpartofthecoolingchain.

ColdplatesreceivemostinvestorattentionbecausetheysitdirectlyabovetheGPU.Butheatstillneedstoleavetheloop.

ThisbringsbrazedplateheatexchangersandCDU-levelcomponentsintotheAlinfrastructurestack.

13/26

KAORIHeatExchangersin

OCPAPACSummit

OCPAUGUST11-12,2026

TAIPEI,TAIWAN

KBRAZEDPLATE

Asrackpowerrises,heat-exchangerperformancebecomesincreasinglyimportant

becausethesystemmustmoveenormousamountsofheatwhileminimizingpressuredropandmaintainingreliability.

Theliquid-coolingopportunityshouldthereforenotbeviewedasasingle-productmarket.Itisanentirethermal-managementstack:

GPU→ColdPlate→Manifold→CDU→HeatExchanger→FacilityWaterDifferentsupplierscapturevalueatdifferentlayers.

14/26

LeadingtheFutureofAI

BPHEistheinterfacebetweentwocontrolledworlds

Brazed.permanemer

TechnologyCoolingSystem

FacilityWaterSystem

Grayspace/primaryloop

Whitespace/ITloopColdplates

Rackmanifolds

CDUpumps&filtration

TAIPEI,TATUAN

KAORIisaleadingsupplierofBrazedPlateHeatExchangers(BPHEs),whichare

increasinglyimportantinhigh-densityAldatacentercooling.BPHEsusestackedstainless-steelplatesbrazedtogethertoprovidehighheat-transferefficiencywithinacompact

footprint.Inliquid-cooledAlinfrastructure,KAORI'sBPHEscanbedeployedinCDUsandfacilitycoolingloops,transferringheatbetweenserver-sidecoolantandfacilitywater.AsAlrackpowerdensityrisestowardhundredsofkilowatts,efficientheatexchangebecomescritical.KAORIthereforerepresentsanimportantthermal-managementsupplierbenefitingfromtheshifttowarddirectliquidcoolingandhigher-densityAlinfrastructure.

AINetworkingIsRunningOutofPhysicalSpace

Theoptical-networkingconversationhashistoricallybeendominatedbybandwidth.

400G.

800G.

1.6T.

Nextcomes3.2T.

Butbandwidthisnolongertheonlyproblem.

15/26

【价值目录】网整理：

Thephysicalinfrastructurerequiredtocarrythatbandwidthisbecomingincreasinglydifficulttomanage.

ThisiswhyCorning’smulticorefiberisinteresting.

Thefundamentalproblemisfiberdensity.

AsGPUclustersgrowfromthousandstotensofthousandsofaccelerators,thenumberofopticalconnectionsincreasesrapidly.

Thatcreatessecondaryconstraints:

CabletraycapacityRackcongestion

ConnectorcountInstallationlaborCableweight

MaintenancecomplexityBendradius

Airflowobstruction

Multicorefiberattackstheproblembyputtingmultipleopticalcoresintoonephysicalfiberfootprint.

Thischangestheoptimizationtarget.

Theindustryismovingfrom:

Bandwidthpertransceiver

toward:

Bandwidthperunitofphysicalinfrastructure.

Thatdistinctionmatters.

Asclustersscale,theindustrywillincreasinglyoptimizenotjustbitspersecond,butbitspercable,bitsperconnector,andbitsperrackvolume.

CPOIsanEcosystemProblem

ThisisalsowhyCPOneedstobevieweddifferently.

16/26

【价值目录】网整理：

Mostinvestorsthinkaboutco-packagedopticsprimarilyasaBroadcom,NVIDIA,orswitch-ASICstory.

Thatisincomplete.

AproductionCPOarchitecturerequiresanecosystemaround:

PICsEICslasers

fiberarrays

opticalconnectorspackaging

thermalmanagementalignment

testing

repairabilitymanufacturing

ThisiswherecompaniessuchasLightmatterbecomeinteresting.

Thestrategicquestionisnotwhethersiliconphotonicsworks.

Wealreadyknowitworks.

Thequestioniswhethertheindustrycanbuildamanufacturableandinteroperablephotonicsecosystemaroundit.

CPOadoptionwillthereforebedeterminedbymuchmorethanopticalperformance.

Thewinningarchitectureneedstosolve:

Yield+Cost+Packaging+Test+Reliability+FieldService

Theopticalenginemaybetechnologicallyimpressive.

Ifhyperscalerscannotrepairitefficiently,qualifymultiplesuppliers,ormanufactureitatscale,deploymentwillremainconstrained.

CPOisfundamentallyasupply-chainproblem.

17/26

GrowingDemandsandChallengesinAlEra

Performance

2x-7x

increased

compute

workload

Memory

Power

Exascale21MWto

zettascale500MW

powerdelivery

Area

2x~10xreticle2x-6xPkgsize(upto150mm)

2x-10xnetwork

3~8KWsystem

thermalcooling

bandwidth&

memorycapacity

CPO(Co-PackagedOptics)

Moore's

Law&Chiplets

BMCIsBecomingtheOperatingSystemoftheRack

AnotherunderappreciatedpartoftheAlinfrastructurestackissystemmanagement.ThismakesASPEEDandNuvotonparticularlyinteresting.

Historically,aBMCwasessentiallyamanagementprocessorforaserver.

Ithandledremoteaccess,telemetry,firmwareupdate,fancontrol,andbasicsystemmonitoring.

Alracksaredifferent.

Thecontrolarchitectureincreasinglyneedstomonitorandcoordinate:

GPUtemperaturesCPUtemperaturespowershelves

BBUspumpsCDUs

fans

networking

firmware

security

faultstates

racktelemetry

Asthenumberofcomponentsrises,managementcomplexitygrowssignificantlyfasterthanrackcount.

ThisturnstheBMCfromaperipheraldeviceintopartoftherackcontrolplane.

ASPEED'snewerplatformsincreasinglysupporthigher-speedinterfacesandstrongersecurityfunctionsaimedatnext-generationserverarchitectures.

ASPEEDSMC(SatelliteManagementController)+LatticeFPGATechnology

AST1840KeyFeatures:

·441-ballpackages,17x17mn

FPGATechnoloigygrovidedbyLatice5emiconductor

1.Dedicated2001/0pins+25KWTs

2.SupportFPGADesignTool-LatbceDiamondSMCAST1040.

1.ARMCortexM4,(400MHz)

..itl0viO-IAverUS8

4.LTPIwith1Gb/sBandwidth

5.Caliptra2xIntegratedRoT

6.0CPStreamingBoot

7.PhysicalAnti-Tamper

ASPEEDLATTICE

NowadaysServerStructure

Servwrstws

futureServerDesignwithAST1840AS71840AST1040+IPGA,protectrtbycilytnot

NuvotonisexpandinginasimilardirectionthroughBMCs,satellitemanagementcontrollers,securityfunctions,andbattery-managementsolutions.

19/26

ContributiontoBatteryManagementSystem

FutureofEV

20102015202020232030

andSecure

accuracy

PlatformCirculation

DevelopmentSociety

Safe

High

Liionbatteryonvehicle

BatteryMeasurementEvolution

3dGeneration

BM-IC

+COM-IC

NextGeneration

√Extendbatterylife√Reuse/Recycle

4thGeneration

BM-IC+PM-IC+COM-IC

MeasurementIC

+MonitoringIC

1#Generation

nUVOTon

Thesearerelativelylow-costICscomparedwithGPUs.

Buttheysitinanincreasinglystrategicposition.

TheAlboomdoesnotonlyincreasecomputesiliconcontent.

Italsoincreasescontrolsiliconcontent.

WhyASEMattersatOCP

Advancedpackagingwasonceasemiconductormanufacturingproblem.

Itisincreasinglybecomingasystem-architectureproblem.

ThatiswhyASEbelongsatOCP.

ModernAlacceleratorsarenolongersinglechips.

Theyareheterogeneoussystemscontainingcombinationsof:

GPUdies

HBM

I/Odies

chiplets

interposersbridges

powerstructures

potentiallyphotoniccomponents

20/26

Thepackageiseffectivelybecomingthemotherboard.

AdvancedPackagingwithNewGenerationOpticalEngine

3DIC

(PICFace-Up)

3DFOPOP

(PICFace-Down)

KeyFeatures:

KeyFeatures:

·EmbeddedEIC&Non-moldingPIC

PIC3DinterconnectwithTSV

·EICandFAUontopofPIC

OntimumonticalnerformancewitherPeCOuDlinE

·Toward200G/Lane

·OptimumCoupler

Thisiswhy2.5Dintegration,hybridbonding,fan-out,siliconbridges,andpanel-levelpackagingareincreasinglyrelevanttodata-centerarchitecture.

ASE'smoveintolarger-formatpanel-levelpackagingisthereforeworthwatching.Alpackagescontinuegettinglarger.

Largepackagescreateanobviousgeometricinefficiencywhenmanufacturedoncircular

wafers.

Rectangularpanelspotentiallyimprovesubstrateutilizationandthroughput.

Thisdoesnotmeanpanel-levelpackagingreplacesCoWoS.

Themorelikelyoutcomeisarchitecturalsegmentation.

Differentacceleratorswillusedifferentcombinationsof:

·SiliconInterposer

·RDLInterposer

·SiliconBridge

●Fan-Out

21/26

·Panel-LevelPackaging

·HybridBonding

Therewillnotbeoneuniversalsolution.

Therewillbemultiplearchitecturesoptimizedaroundcost,bandwidth,packagesize,thermals,andyield.

ASE'sVIPackTM

anadvancedpackagingplatformdesignedtoenableverticallyintegratedpackagesolutions,featuringsixtechnologypillars

IⅢ

IV

FOCoS

FOSiP2.5D/3DIC

Bridge

(Embedded)

IntegratedDesignEcosystem

AdvancedPackagingCreatesaMuchLargerSupplyChainThanOSAT

TheinvestmentopportunityextendswellbeyondASE.

LargeAlpackagescreatedemandacross:

·RDLequipment

·Lithography

·Temporarybonding

·Debonding

·Carriermaterials

22/26

【价值目录】网整理：

Moldcompounds

Underfill

Substrates

InspectionMetrologyTest

Thermalinterfacematerials

Thisisimportantbecauseadvancedpackagingcapacityexpansioncreatesmultipliereffects.

AnewpackaginglinedoesnotonlygeneraterevenuefortheOSAT.

Itpullsequipment,specialtymaterials,testing,andsubstratecapacityalongwithit.Thekeyinvestmentquestionthereforebecomes:

WhichpreviouslysmallsemiconductorsuppliersareseeingAIchangetheiraddressablemarket?

Thoseareoftenmoreinterestingthantheobviousheadlinebeneficiaries.

TheMostImportantFramework:FollowQualification,NotAnnouncements

OneofthebiggestmistakesinanalyzingAIinfrastructureistreatingeverynewtechnologyannouncementascommerciallymeaningful.

Itisnot.

Therelevantprogressionis:

Concept→Prototype→Sample→Qualification→Design-In→MassProduction

Revenuegenerallyappearstowardtherightsideofthatsequence.

Thisframeworkisparticularlyusefulfor800V,liquidcooling,CPO,andadvancedpackaging.

For800V:

Architectureproposalsareinteresting.

Test-equipmentordersaremoreinteresting.

23/26

【价值目录】网整理：

Customerqualificationismuchmoreinteresting.

Production-lineinvestmentiswherethest