安迈半导体公司环保物质标准.ppt

1、RoHS Compliant & Green Components,Content,Environmentally Friendly Materials Drivers Legislation AMIS RoHS & Green Component Definition Hazardous Substances in Current Components Re-Flow Profile for Moisture Sensitivity Assessment Impact Pb-Free Solder on Package Construction AMIS Changes in Bill of

2、 Assembly Materials Qualification Stress Test Conditions Product Marking and Labeling AMIS RoHS-Green Qualification Status,Environmentally Friendly Materials Drivers,RoHS Directive 2002/95/EC Effective July, 2006 LeadPb 1000 ppm MercuryHg 1000 ppm CadmiumCd 100 ppm Hexavalent ChromiumCr+6 1000 ppm P

3、olybrominated BiphenylPBB 1000 ppm Polybrominated Diphenyl EtherPBDE 1000 ppm Market Pressure Japanese Consumers Demand Green Components New Designs for Consumer Products are all Green High Temperature Applications Solders Required for Harsh Environments Automotive Avionics High Ambient Temperature

4、Applications for well Defined Duration,Worldwide Legislation,RoHS(Restriction of Hazardous Substances) Pb, Hg, Cd, Cr+6 PBB & PBDE,JGPSSI (Japan Green Procurement Survey Standard Initiative) Pb, Hg, Cd, Cr+6 PBB, PBDE, TBBP-A-bis Chlorinated Organic Compound PCB, PCN, CP, Mirex Organic Sn Compound A

5、sbestos Azo Formaldehyde PVC & PVC Blends,Situation of Banned Substances in the World,Different Definitions & Thresholds are being Debated in EU, Japan & US Whether all Worldwide Brominated Substances or only Specified Types will be Banned is still Unclear,Japanese Legislation,Japanese The Japanese

6、Ministry of Trade (MITI) Passed a Recycling Law for Electrical Appliances with Effect from April 2001 This Suggests but does not Include Lead Phase-out Timetable OEMs are Removing Lead from Electronics Mainly due to Market Pressures The JGPSSI (Japan Green Procurement Survey Standard Initiative) is

7、Followed by many OEMs,Directive 2002/95/EC (RoHS) Proposal for an Directive on Eco-Design of End-Use Equipment (EUP) that will have some Regard to Hazardous Materials in Equipment,EU Legislation,Applicable for: Large Household Appliances Small Household Appliances IT & Telecom Equipment Consumer Equ

8、ipment Lighting Equipment Electrical & Electronic Tools Toys, Leisure & Sports Equipment Medical Equipment Systems Monitoring & Control Instruments Automatic Dispensers,Who is Exempt: Medical Implanted & Injected Products Pb in Servers, Storage & Storage Systems until 2010 Large Stationary Industria

9、l Tools Pb in High-End Manufacturing & Telecommunications Products Automotive, Aerospace, Military,United States Legislation,United States Although a Number of States are Heading Towards Lead-Free and/or Recycling Regulation There is not yet a Published Federal Position In September 2003 California

10、Enacted an E-Waste Recycling Bill The EPA (Environmental Protection Administration) has Proposed a Crack-down on Lead Emissions from Plants that may Impact the Soldering Industry,AMIS RoHS & Green Definition,RoHS Compliant = AMIS Pb-Free Pb 1000 ppm Hg 1000 ppm Cd 100 ppm Cr+6 1000 ppm Polybrominate

11、d Biphenyl 1000 ppm Polybrominated Diphenyl Ether 1000 ppm Full Green = AMIS Green All of the Above Requirements Plus Bromine 900 ppm Chlorine 900 ppm Antimony 900 ppm Tributyltin OxideNot Used PhosphorusNot Used,Hazardous Substances in Current Compounds,Pb as Solder Plated Leads or Balls of Package

12、s Pb Content Solder Plated Leads: 0.1 0.3% by Weight Pb Content Solder Balls of BGA Packages: 4.9% by Weight Bromide &/or Antimonated Flame Retardant of Epoxy Molding Compound Bromide Content: 0.2 1.8% by Weight Antimony Content: 0.3 0.7% by Weight,Laminated Package,Solder Lead Finish,Leaded Package

13、,Solder Balls,Re-Flow Profile for Moisture Sensitivity Assessment,AMIS Solder Peak Temperature for Pb-Free is 260 +0/-5C,Re-Flow Profile for Moisture Sensitivity Assessment,AMIS Solder Peak Temperature for Pb-Free is 260 +0/-5C,Impact Pb-Free Solder on Package Construction,Exposure to Higher Solder

14、Temperatures The Impact from 220 to 240 or 260C Solder Temperatures Solderability The Interaction Between the Pb-free Component Finish & Solder Paste Interface Adhesion Between Materials The Higher Probability that Interfaces will Separate as they are Exposed to the High Solder Temperature Thermal S

15、tability in Compound/Die Attach/Substrate Electrical Contact Resistance,Changes in Bill of Assembly Materials,Lead Frame Packages = AMIS goes Green New Materials for Die Attach & Mold Materials that Withstand 260C Halogen Free Materials Lead Finish Pure Sn Plating is Selected as Solution Pure Sn is

16、the most Mainstream Solution Post plate bake is part of the AMIS process flow and demonstrated good results as whisker mitigation process NiPdAu is available as an alterative finish option,Changes in Bill of Assembly Materials,Laminate Packages = AMIS goes RoHS Compliant Existing Substrates are RoHS

17、 Compliant & Qualified Green Substrates are Available but more Expensive & not yet Qualified New Materials for Die Attach & Mold Materials that Withstand 260C Halogen Free Materials Lead Finish Sn- 4.0Ag- 0.5Cu has been Selected (most std at Subs),Qualified Stress Test Conditions,- 65/150C, 500 x -

18、65/150C, 1000 x,- 65/175C, 500 x - 65/175C, 1000 x,- 50/150C, 500 x - 50/125C, 1000 x,- 65/150C, 500 x - 50/150C, 1000 x,- 65/175C, 500 x - 50/175C, 1000 x - 50/150C, 2000 x,Temp Cycle,Per J-STD-020 for SMD components,Preconditioning,175C, 1000 hrs 175C, 2000 hrs,150C, 1000 hrs 175C, 500 hrs,175C, 1

19、000 hrs 150C, 2000 hrs,High Temp Storage Life (plastic pkg),121C / 100% 96 hrs HAST 130C / 85% 96 hrs,Autoclave or unbiased HAST,85C / 85% / Bias 1000 hrs,THB or HAST,- 40/125C, 1000 x,- 40/150C, 1000 x,- 40/105C, 1000 x,- 40/125C, 1000 x,- 40/150C, 1000 x,Power Temp Cycle,Grade 2 (- 40 / 105C),Grad

20、e 1 (- 40 / 125C),Grade 0 (- 40 / 150C),Part OperatingTemperature Grades,Per J-STD-020 Minimum Level 2260C max. Re-Flow Temperature,HAST 130C / 85% / Bias 96 hrsFor Product Qualifications,121C / 100% 96 hrsFor Package Qualifications,AEC Q100 REV-F,AMIS,150C, 1000 hrs 150C, 2000 hrs,125C, 1000 hrs 150C, 500 hrs,Grade 0 (- 40