Inductor Introduction.ppt

1、TAI-TECH Advanced Electronics Co., Ltd. NO. 1, YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI, TAO-YUAN HSIEN, TAIWAN, R.O.C. TEL: +886-3-4641148 FAX: +886-3-4643565 http:/www.tai-.tw,Inductor Introduction,電感產品基本介紹,電感與磁珠主要特性介紹,Impedance阻抗值 在電流下所有阻抗的總和，可分直流阻抗與交流阻抗。 Inductance電感值 能抑制流經之電流的改變，電感值會受鐵

2、芯的材質、 形狀與尺寸，以及繞線的圈數與形狀所影響。 Q品質係數 為電感相對損失的指標。 SRF自我共振頻率 指一電感所分佈電容值與電感值產生共振時的頻率， 此時電感值與電容值相等而互相抵銷。 DC Resistance直流阻抗 電感在非交流電下測得之阻抗；阻抗愈小愈好，單位 為歐姆。,Application and processing,3,| Z | , X , R v.s. frequency,f0 : self resonant frequency,TEST INSTRUMENT HP 4291,Usually EMI engineer needs the curve of |Z| o

3、nly , but sometimes she/he wants to know R & X for reference .,Sorts of inductor,INDUCTOR,EMI INDUCTOR,INDUCTOR,DIFFERENTIAL MODE (SUPPRESSER),COMMON MODE,INDUCTOR,POWER INDUCTOR,SMD CHIP BEAD DIP BEAD,Common Mode Choke,SMD CHIP INDUCTOR, DIP INDUCTOR,SMD POWER INDUCTOR DIP INDUCTOR,電子資訊產品不斷地往輕、薄、短、

4、小及高速度的發 展，使得產品內部元件的組裝整合性亦日趨變高，裝 配密度高與裝配成本要低，對於電子工程師來說，將 許多電子元組件組合裝配於更小的電路面積，將會要 求更好的功能且成本更低的電子元件。 特別是在裝配新一代CPU的機板方面，可承受高電流的 元件已成為最主要的需求，而在電源用元件中電感是 在耐高電流的需求下，較難以達成的部份，因此大電 流電感器之開發重點，在於結合元件設計、材料選用 及製程整合以產出適合的大電流電感元件原型。,大電流電感元件概論,Power inductor application,PDA/Notebook/Desktop/Server application. High

5、 current POL converters. Lower profile, high current power supplies. Battery powered devices. DC/DC converters in distributed power systems DC/DC converters for Field Programmable Gate Array (FPGA),Loss mechanisms in magnetic devices,Low-frequency losses: DC copper loss(銅損) Core loss: hysteresis(磁滯損

6、失) High-frequency losses: the skin effect(集膚效應) Core loss: classical eddy current losses(渦流損失) Eddy current losses in ferrite cores,Core loss: hysteresis loss,W=(Aclm) HdB The term Aclm is the volume of the core. While the integral is the area of the B-H loop. Energy lost per cycle=(core volume) (ar

7、ea of B-H loop) PH=(f)(Aclm) HdB Hysteresis loss is directly proportional to applied frequency,One cycle,One cycle, HdB,One cycle,Area,B,H,Core loss: eddy current loss,Magnetic core materials are reasonably good conductors of electric current. Hence, according to Lenzs law, magnetic fields within th

8、e core induce currents (“eddy currents”) to flow within the core. The eddy currents flow such that they tend to generate a flux which opposes changes in the core flux (t). The eddy currents tends to prevent flux from penetrating the core. Classical Steinmetz equation for eddy current loss: PE=KEf2B2

9、max(core volume),Low-frequency copper losses,DC resistance of wire R= lb/Aw Where Aw is the wire bare cross-sectional area, and lb is the length of the wire. The resistivity is equal to 1.724x10-6 cm for the soft-annealed copper at room temperature. This resistivity increases to 2.3x10-6 cm at 100.

10、The wire resistance leads to a power loss of Pcw=I2rmsR,Core materials,Metal & Ferrite,Metals,Ferrites,1,Saturation,Initial Permeability,Curie Temperature,Resistivity, mm2/m,Tesla,Bs,ui,Tc,各種材料適用範圍,高飽和磁化量,高電阻率,頻率(Hz),導磁率u,各種材料的種類,金屬 純鐵(Cast Iron) 矽鋼(Si-Steel) 鎳鐵(Permalloy) 鈷鐵(Co-Fe) 非晶質(Amorphous),鐵

11、氧磁石/陶瓷 錳鋅系(Mn-Zn Ferrite) 鎳鋅系(Ni-Zn Ferrite) 銅鋅系(Cu-Zn Ferrite) 鎂鋅系(Mg-Zn Ferrite) 介電陶瓷,壓粉鐵芯 Iron Powder MPP Core Sundust,薄帶 Ni-Fe 非晶質(Fe-Base) 非晶質(Co-Base),軟磁材料之特性與應用重點,不同用途所需之材料特性,Loss-f特性,磁性材料之耐電流性:電感元件之材料系統以金屬 及鐵氧磁體為主，右圖為材質特性比較，鐵氧磁體其耐電流並不理想，因此如何正確選用材料以提高電感之耐電流性即為開發工作之第一要務。,積層繞線設計:大電流元件和傳統小訊號元件在結

12、構上有相當大之差別，主要在於繞線方式、線寬和線距之最佳化等，良好之繞線設計除可與材料性質有加成效果之外，更可提高產品良率及製程穩定性。 元件製程控制:大電流電感之製造方法基本上可分為壓縮成型式、環形繞線式及組裝式等數種，各種方法都有其製程條件上之特定需求，適當的製程條件才能得到特性合乎要求的的元件。(SMPI series屬於壓縮成型式),材料結構製程技術,Main Product,Main Products Introduction,Process Flow Chart,DLPI 電感,Core,印膠,組裝,整線,補膠 烘烤,外檢,銲錫,整腳,測試,製成 檢驗,入庫,包裝,出貨 檢驗,出貨,

13、DLPI產品規格,Choke Coil for Use in High Power Applications - DLPI Series -,特徵與應用,Features,Lowest height (9.0mm/max) in this package footprint. Shielded construction. Lowest DCR/H, in this package size. Handles high transient current spikes without saturation. Ultra low buzz noise, due to composite const

14、ruction. Lead Free(Pb).,外觀尺寸&銲墊Layout,Dimensions,銲墊Layout,電性規格,Part Numbering & Specifications,Note: 1. Testing Instrument : L:HP4192A,CH1302,CH3320 ,CH3320S LCR METER DCR:Agilent33420A MICRO OHMMETER. 2. Operating temperature -25 +125 3. All test data is referenced to 25 ambient. 4. Irms(A) will ca

15、use an approximately temp. rise within 100 . 5. Isat (A) will cause L0 to drop approximately 10% 6. The part temperature (ambient + temp rise) should not exceed 125 under worst case operating conditions.,加電流曲線,Typical Performance Curves,與競爭對手產品比較,DC Bias Test & Temp. Rise Test,產品使用電流超過40A ，感值降幅過大。,D

16、LPI客戶群,產能與專利,Customer,技嘉、環隆、鴻海,Starting Month for Sales,December 2004,Production Capacity,3KK pcs per month as of Q2 20055KK pcs per month scheduled starting in Q3 2005,Patents,Patent is already pended.,DYPI產品規格,Choke Coil for Use in High Power Applications - DYPI Series -,特徵與應用,Features,Lowest heig

17、ht (10.0mm/max) in this package footprint. Shielded construction. Lowest DCR/H, in this package size. Handles high transient current spikes without saturation. Ultra low buzz noise, due to composite construction. Lead Free(Pb).,外觀尺寸&銲墊Layout,Dimensions,銲墊Layout,電性規格,Part Numbering & Specifications,N

18、ote: 1. Testing Instrument : L:HP4192A,CH1302,CH3320 ,CH3320S LCR METER DCR:Agilent33420A MICRO OHMMETER. 2. Operating temperature -25 +125 3. All test data is referenced to 25 ambient. 4. Irms(A) will cause an approximately temp. rise T= 70 . 5. Isat (A) will cause L0 to drop approximately 10% 6. T

19、he part temperature (ambient + temp rise) should not exceed 125 under worst case operating conditions.,加電流曲線,Typical Performance Curves,與競爭對手產品比較,DC Bias Test & Temp. Rise Test,產品使用電流超過40A ，感值降幅過大。,DYPI客戶群,產能與專利,Customer,緯創、鴻海,Starting Month for Sales,May 2005,Production Capacity,1.5KK pcs per month

20、 as of Q2 20053.0KK pcs per month scheduled starting in Q3 2005,Patents,Patent applying in process.,DRPI產品規格,Choke Coil for Use in High Power Applications - DRPI Series -,特徵與應用,Features,Lowest height (10.0mm/max) in this package footprint. Shielded construction. Lowest DCR/H, in this package size. H

21、andles high transient current spikes without saturation. Ultra low buzz noise, due to composite construction. Lead Free(Pb).,外觀尺寸&銲墊Layout,Dimensions,銲墊Layout,電性規格,Part Numbering & Specifications,Note: 1. Testing Instrument : L:HP4284A,HP4192A,CH1302,CH3320 ,CH3320S LCR METER DCR:Agilent33420A MICRO

22、 OHMMETER. 2. Operating temperature -25 +125 3. All test data is referenced to 25 ambient. 4. Irms(A) will cause an approximately temp. rise within 100 . 5. Isat (A) will cause L0 to drop approximately 10% 6. The part temperature (ambient + temp rise) should not exceed 125 under worst case operating

23、 conditions.,加電流曲線,Typical Performance Curves,與競爭對手產品比較,DC Bias Test & Temp. Rise Test,產品使用電流超過40A ，溫度升幅過大。,DRPI客戶群與產能,Customer,緯創,Starting Month for Sales,June 2005,Production Capacity,1.0KK pcs per month as of Q2 20053.0KK pcs per month scheduled starting in Q3 2005,CONCLUSION,綜合以上幾點，西北臺慶之耐大電流線圈電感

24、，具備有以下特點： 1.西北臺慶產品設計之耐電流較競爭產品為高，在持續加高電流的情況下，仍可維持在一定的降幅內，且單顆耐電流可達50A，使用於CPU週邊3顆之耐電流可達150A，較正常使用120A能承受較大之工作電流，可見此產品在高電流的應用下，擁有優於現有市場上大電流電感的特性。 2.在產品結構方面也有減少工序與降低人力的優點，因此此產品不論在特性上、結構上及成本上，都極具產品競爭力，也因此我們對於此產品的推出深具信心。,SMPI series,SMPI series,Process Flow Chart,耐高電流 電感,繞線,整線,壓線,成型,外觀 檢察,導片 組裝,塗裝 (黑色),脫膜

25、預銲,特性 篩選,特性 檢驗,製成 檢驗,入庫,銲錫,印字,包裝,線徑0.5mm以下,線徑0.5mm以上,特徵與應用,Features,.Lowest height (3.5mm/max) in this package footprint. .Shielded construction. .Lowest DCR/H, in this package size. .Handles high transient current spikes without saturation. .Ultra low buzz noise, due to composite construction. 6.Fr

26、equency up to 5MHz. 7.Lead free.,外觀尺寸,Dimensions,電性規格,Note:,1. Test Frequency: 0.25V / 100KHz 2. Testing Instrument : L:HP4192A,CH1302,CH3320 ,CH3320S LCR METER DCR:Agilent 33420A MICRO OHMMETER. 3. Operating temperature -55 +125 4. All test data is referenced to 25 ambient. 5. Heat Rated Current (I

27、rms) will cause the coil temperature rise approximately T=40 without core loss. 6. Saturation Current (Isat) will cause L0 to drop approximately 20% 7. The part temperature (ambient + temp rise) should not exceed 125 under worst case operating conditions。Circuit design,component,PCB trace size and t

28、hickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.,0603尺寸電性規格,Electrical Characteristics,0603電性規格,Performance Curves,1004尺寸電性規格,Electrical Characteristics,1004電性規格,Performance Curves,1203尺寸電性規格,Electrical Charact

29、eristics,1203電性規格,Performance Curves,銲錫溫度,Recommended Soldering Profiles,Reflow Soldering,Hand Soldering,競爭對手比較,尺寸比較(0603),VISHAY vs. TAI-TECH,IHLP2525CZ-01,SMPI 0603HW SERIES,尺寸比較(1004),TOKO vs. TAI-TECH,FDH1040 SERIES,SMPI 1004HW SERIES,FDH1040B SERIES,尺寸比較(1203),VISHAY vs. TAI-TECH,IHLP5050CE-01,SMPI 1203HW SERIES,電性規格比較(VISHAY),Characteristics Comparison,VISHAY - IHLP5050CE-01,TAI-TECH - SMPI 1203HW SERIES,Seems higher than TAI-TECH,電性規格比較(VISHAY),DC Bias Test Comparison,VISHAY - Inductance Drop Lower,VISHAY - Temperature Rise Higher,電性規格比較(TOKO),Characteristics Comparison,TOKO