笔记本图纸点位三星图纸ba41-01174a samsung np-r580 np-r780

1、4321DDCCBBAA4321D:/Users/mobile39/mentor/Bremen/PV/Bremen-M_MAINSAMSUNG PROPRIETARYTHIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS COS PROPERTY.DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG.Sheet 1.CoverSheet 2-6.Diagram (Block/Pow

2、er) & AnnotationsSheet 7.Clock Generator -CK505 Shrink Version Sheet 8Thermal Sensor & FANSheet 9-12Arrandale CPU Sheet 13.DDR3 SODIMM ASheet 14.DDR3 SODIMM B Sheet 15-19.IBEX PEAKSheet 20-24.GFx_External_N11XSheet 25-28.Graphics_Memory_gDDR3 1g bit Sheet 29.Graphic StrapSheet 30-32.Graphic Interfac

3、eSheet 33-34.High Definition Audio (ALC269Q-GR) Sheet 35.LAN_Marvell_88E8059Sheet 36.Express_CardSheet 37.MultiCard_AU6336 (3 in 1)Sheet 38.PCIE_Minicard_Slot (Half type only) Sheet 39.SATA I/F CONNSheet 40.MICOM_MEC1308-NUSheet 41.Micom Glue LogicSheet 42.LED_SwitchSheet 43.USB PortSheet 44.Touchpa

4、d LEDSheet 45.USB InterfaceSheet 46.ChargerSheet 47.PWR_3V_5VSheet 48.PWR_CalpellaSheet 49.PWR_MemorySheet 50.PWR_CPU_VRMSheet 51.PWR_GFX_ExtSheet 52.PWR_MV_SwitchedSheet 53.PWR_MV_DisChargerSheet 54.2 USB Port & Power S/W SUB BD Sheet 55.SATA ODD SUB BD Battery IF BD Sheet 56.EMC Capacitor & ICT Po

5、rtBREMEN-M 15/17CPU:Intel ArrandaleChip Set :Intel Ibex Peak(HM55)GFX:N11P/ M-GE1(40nm)Remarks:Calpella PlatformOwner : SEC Mobile R & DSignature :XDRAWMS YANGDATE8/11/2009TITLEBREMEN-MMAIN COVERSAMSUNGELECTRONICSCHECKSE LEEDEV. STEPPVAPPROVALMK KIMREVREV 0.9PART NO.BA41-01174AMODULE CODELAST EDITOc

6、tober 20, 2009 21:30:55 PMPAGE1OF56DesignCHECKAPPROVALModel Name : BREMEN-M PBA Name: MAINPCB Code: BA41-01174ADev. Step: PR Revision: 1.0T.R. Date: 2009.11.124321SAMSUNG PROPRIETARYTHIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS COS PROPERTY.DO NOT DISCLOSE T

7、O OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG.BLOCK DIAGRAMDDCPUPOWER LOGICPG 33HDMI - BArrandaleHDMIPG 31LCDPCIE X16N11X-GE1LCDPG 47PG 32CRT(133MHz)Channel A (Standard)CRTDDR 3PG 14DDR 3 1067SODIMM 0DDR 3 PowerPG 50Dual channelDDR 3PG 15CCL3 Cache : 6 MBPG 10,11,12Channel B (Reverse) DD

8、R 3 1067/1333SODIMM 1DMIx4, 1.5VPECIMarvell88E8059PCIE x1Lane 6PG 36RJ45PCHUSB 0,1,4,9ANTPG 44USB 0,1,4,952PPCIE x1Lane 1Mini Card 1USB 2PG 39ANTUSB 10BluetoothPG 46High Definition AudioHDAUDIOUSB 11CameraPG 46PCIE x1Lane 378pPG 34AudioALC269HD AudioExpress CardIBEX PEAKUSB 5PG 37PG 34PG 16 - 20USB

9、3SD(SDHC)PG 153 in 1(AU6336)PG 35BBMMCPG 152P 2PHP MIC-INPG 35SATA HDDPG 40SPI ROMSATA ODDSUB BDPG 56Touch PADe-SATAPG 44PG 56MICOMSMSC MEC13083.3V LPC, 33MHzKBDPG 54PG 4380 PortAADRAWDATETITLESAMSUNGELECTRONICSPG 49MS YANG8/11/2009BREMEN-MMAIN BLOCK DIAGRAMCHECKDEV. STEPSE LEEPVAPPROVALREVPART NO.B

10、A41-01174AMK KIMREV 0.9MODULE CODELAST EDIT256PAGEOFundefinedOctober 20, 2009 21:30:55 PM1432D:/Users/mobile39/mentor/Bremen/PV/Bremen-M_MAINSATA 0SATA 1SATA 2LPCSPISPKR LSPKR RCharging CircuitP1.8VGFX VRP5.0V_ALW P3.3V_AUXP1.05V_VTTCPU DC/DCIMVP-6.5ClockingCK-505-Shrink PG 8FANPG 9CPUThermistorEMC2

11、112 PG 94321SAMSUNG PROPRIETARYTHIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS COS PROPERTY.DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG.POWER DIAGRAMRev 0.1KBC3_SUSPWR (CHP3_SLPS4#)KBC3_PWRON(CHP3_SLPS3*)DDKBC3_VRONAC AdapterP1.0

12、5V (VCCP)MEROM CRESTLINE ICH8-MVCC_COREMEROMVDCBattery DCPEGgDDR-3 for EGFXP1.5VP1.5V_AUXSODIMM (DDR III) CFDP0.75VCCICH8-MPCMCIAHDDFDD CRT MICOMUSB HEATSINK MDCM_PCIFAN CIRCUIT AUX DISPLAYP3.3V_MICOMSPI ROMP5.0VPEGMICOMCFDNvidia n10PP1.8VP5.0V_STBP5.0V_ALWUSB CONNEGFX_COREP5.0V_ALWNvidia N10PUSB CO

13、NNP5V_AUXIBEX PEAK USB CONNWhen USB Charge EnableBTIBEX PEAKThermal SensorLCDIBEX PEAK LANFF SensorP3.3VNvidia N10PMDCP3.3V_ALWP3.3V_AUXMICOM MINI PCIE LEDsDDR3 EXPCARDHD AUDIO MMCBBP12.0V_ALWLANPower On/Off Table by S-stateRailS0S3S4S5StateS5-S4S0S3+V*A(LWS)+V*LANONONONONAA+1.8V_AUX+0.9VONONDRAWDAT

14、ETITLESAMSUNGELECTRONICSMS YANG8/11/2009BREMEN-MMAIN POWER DIAGRAM+V*AUXONONCHECKDEV. STEPSE LEEPV+VONAPPROVALREVPART NO.BA41-01174AMK KIMREV 0.9+V* (CORE)ONMODULE CODELAST EDIT356PAGEOFundefinedOctober 20, 2009 21:30:55 PM1432D:/Users/mobile39/mentor/Bremen/PV/Bremen-M_MAINP1.2V_LAN4321SAMSUNG PROP

15、RIETARYTHIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS COS PROPERTY.DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG.POWER RAILS ANALYSISRev. 0.6 (060920)220VDDAdapter BatteryMICOM 3V ( TBD A ) 1.8V ( TBD A )1.05VCPU CORE 1.05V (VCCP)

16、MICOM 3VPenryn-6M ( 35 W )KBCCPU CORE ( TBD A ) 1.05V ( TBD A )1.5V ( TBD A )1.25V ( TBD A )3.3V ( TBD A )5.0V ( TBD A )1.8V_AUX ( TBD A )0.9V( TBD A )41 A (TBD)4.5 A (TBD)0.13 A (TBD)Thermal Sensor0.08 A (TBD)0.08 A (TBD)3.3V3.3V0.75 A (TBD)1.5VMICOM 3VPWR LED0.1 A (TBD)1.05V (MCH CORE)7.7 A (TBD)4

17、.48 A (TBD)0.125 A (TBD) 2.43A (TBD)0.33 A (TBD)3.79 A (TBD)1.05V (VCCP)Cantiga GMCH(8 - 8.5 W )1.5V1.8VCCCLOCK3.3V1.25V3.3V0.25 A (TBD)3.3V1.8V_AUXKeyBoard3.3V0.2 A (TBD)3.3V_AUXLAN0.6 A (TBD)1.05V1.13 A (TBD) 2.4A (TBD)0.374 A (TBD)0.209 A (TBD)0.001 A (TBD)0.001 A (TBD)0.006 A (TBD)1.5V3.3VICH9-M

18、3.3VKBD LED0.01 A (TBD)3.3V_AUX3.3V_AUX5VSD Card0.1 A (TBD)5V_AUX( 2.0 W )SPIRTC_Battery3.3V3.3V0.015 A (TBD)5V1.0V-1.1V (EGFX CORE)3.3V17.75 A (TBD)0.06 A (TBD)0.07 A (TBD)HD Audio3.3V5V1.5 A (TBD)0.5 A (TBD) 0.75A (TBD)3.3V_AUX1.5V1.8VMini Card X 2PEG6.53 A (TBD)1.2V (PEX IO)5V1.75 A (TBD)0.67 A (

19、TBD)SATA1.5 A (TBD)ODD3.3V3.3V_AUXMDCBB0.5 A (TBD)1.8V_AUXDDR-3(Dual slots)( 5.0 W )3.1 A (TBD) 1 A (TBD)SATA HDD5V0.9V0.22 A (TBD)GDDRFAN1.8V5V3.1 A (TBD)0.16 A (TBD)3.3V (LCD 3V)5VAudio AMP0.67 A (TBD)0.5 A (TBD)LCD1.5 A (TBD)19V (VDC INV)P3.3V_AUX5VUSB (x 3)2 A (TBD)Touch Pad5V0.2 A (TBD)AADRAWDA

20、TETITLESAMSUNGELECTRONICSMS YANG8/11/2009BREMEN-MMAIN POWER RAILSCHECKDEV. STEPSE LEEPVAPPROVALREVPART NO.BA41-01174AMK KIMREV 0.9MODULE CODELAST EDIT456PAGEOFundefinedOctober 20, 2009 21:30:55 PM1432D:/Users/mobile39/mentor/Bremen/PV/Bremen-M_MAIN3.3V_AUX ( TBD A )5.0V_AUX ( TBD A )VDC INV ( TBD A

21、) PEX IO (TBD A) VGA CORE (TBD A)RTC_BatteryValue by Datasheet/Application notes (Value by measurement)0.08 A (TBD)0.29 A (TBD) LAN (88E8055)0.15 A (TBD)P1.2V_LANP1.8V/2.5V_LAN0.1 A (TBD)ITP43PRELIMINARY21SAMSUNG PROPRIETARYTHIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG

22、ELECTRONICS COS PROPERTY.DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG.POWER SEQUENCERev. 0.55) KBC3_ALWS_ON3) P3.3V_MICOM2) VDC4) P5.0V_ALWDDCHARGER5) KBC3_ALWS_ON7-1) KBC3_PWRBTN#4) ADP3_IN#6) P3.3V_ALW8) KBC3_RSMRST#TPS5112POWER_SW#10) P3.3V_AUX9) CHP3_SLPS4#7) POWER_

23、SW#KBC12) KBC3_ME_PWRGD10) P5.0V_AUX8) CHP3_SLPS5#13) KBC3_VRON9) CHP3_SLPS4#(START 110ms DELAY FROM P3.3V ON)SC486 MEM POWER10) P1.5V_AUX9) CHP3_SLPS4#9) CHP3_SLP_LAN#16) KBC3_PWRGD9-1) CHP3_SLPS3#9-1) CHP3_SLPM#10-1) P1.1V_VTT9-1) CHP3_SLPS3#15) VRM3_CPU_PWRGDSC415VTT / ME POWER10) P1.1V_M_LAN9) C

24、HP3_SLPLAN#19)CHPT3_SUSSTAT#CC11) VTT3_PWRGD8) CHP3_SLPS5#1) PRTC_BAT13) IGFX_CORE12) GFX1_VR_EN9) CHP3_SLPS4#IGFX_CORE8) KBC3_RSMRST#9) CHP3_SLP_LAN#15) VRM3_CPU_PWRGD12) CHP3_ME_PWRGD12) KBC3_ME_PWRGD9-1) CHP3_SLPS3#14) KBC3_VRONCPU_CORE9-1) CHP3_SLPM#15-1) VRM3_CLKPWRGD#PCH12) CHP3_LANRST#10-1) P

25、1.1V11) CHP1_DRAM_PWRGD10-1) P1.8V16) KBC3_PWRGD12) GFX1_VR_ENALL_SYS_PWRGD PWROKSWITCHED POWER10-1) P1.5V9-1) CHP3_SLPS3#18) CPU1_PWRGDLOGIC10-1) P3.3VB19)CHPT3_SUSSTAT#B10-1) P5.0V20) PLT3_RST#10-1) P1.1V_MSWITCHED POWER LOGIC9-1) CHP3_SLPM#10-1) P3.3V_M11) CHP1_DRAM_PWRGDMCP11) AND1_VTT_PWRGDVTT_

26、PWRGDANAN18) CPU1_PWRGDVCCP_PWRGD0 VCCP_PWRGD1AA20) PLT3_RST#SAMSUNGELECTRONICS432110) P1.1V_M_LANHANKSVILLE10) P1.0V_M_LAN10-1) P3.3V_M_L10-1) P3.3V_M10-1) P1.8V_M_L4321SAMSUNG PROPRIETARYTHIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS COS PROPERTY.DO NOT DIS

27、CLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG.CLOCKDISTRIBUTIONRev. 0.1ArrandaleDDXTAL133M, 100MHCLK0:1, SRC_2CCPLL196M DOT96PLL2PLL& SSC BLOCK27M/27M_SSBBPLL3100M SATA / SRC_1PLL414.318MHzAADRAWDATETITLESAMSUNGELECTRONICSMS YANG8/11/2009BREMEN-MMAIN CLOCK DIAGRAMCHECKDEV. STEPSE

28、LEEPVAPPROVALREVPART NO.BA41-01174AMK KIMREV 0.9MODULE CODELAST EDIT656PAGEOFundefinedOctober 20, 2009 21:30:55 PM1432D:/Users/mobile39/mentor/Bremen/PV/Bremen-M_MAINBCLK 133MDMI 100MDP 120M4321SAMSUNG PROPRIETARYTHIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS

29、 COS PROPERTY.DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG.CK505M SHRINK VERSIONCPU_MODE SELDDP1.5VP3.3VB7 BLM18PG181SN1VDD_CPU_IOB11 BLM18PG181SN1VDD_SRC_IOVDD_REF VDD_USB VDD_LCD VDD_SRC VDD_CPUCLOCK_P1.5V_MNP3.3VCCU15 SL28748CLOCK_P3.3V_MNR20210K1518291VDD_SRC_IO VDD

30、_CPU_IOVDD_REF VDD_DOT VDD_27 VDD_SRC VDD_CPU1%5171624CPU_STOP#CLOCK_CPU_STOP#_MN2523 VRM3_CLK_PWRGD#_INVSMB3_CLK SMB3_DATACLK0_HCLK0 CLK0_HCLK0#CKPWRGD_PD#CPU_022CPU_0#32SCL SDA3120 CPU_1 CPU_1#19R20922.61%CLOCK_CPU_SEL_MN30CLK3_CHP14REF_0_CPU_SEL13 SRC_2 SRC_2#CLK1_PCH3GPLL_IN CLK1_PCH3GPLL_IN#CLK

31、1_SATA CLK1_SATA#CLK1_DREFCLK_IN CLK1_DREFCLK_IN#CLOCK_XTAL_IN_MN2814XTAL_IN XTAL_OUTCLOCK_XTAL_OUT_MN2710 SRC_1_SATA SRC_1#_SATA#1182R211 10M5%VSS_27 VSS_DOT VSS_SATA VSS_SRC VSS_CPU VSS_REF THERMAL3 DOT_96 DOT_96#9124nostuff21266 CLOCK_CLK3_27M_MN R20022.6 1%CLK3_27MY327MHZ27MHZ_SS7R19922.61%CLK3_

32、27M_SSR21010K1%33CLOCK_CLK3_27M_SS_MN 14.31818MHz2801-0046671205-0038964.6VnostuffBB4mmHC249C2500.022nF0.022nF50V50VP3.3VR20110K1%52-A4 9-C3 8-C4AAVRM3_CLK_PWRGD#_INVD 3Q22DESIGNDATETITLESAMSUNGELECTRONICSRHU002N06MS YANG8/11/2009VRM3_CLK_PWRGD#G1BREMEN-MCLOCK CK505-SHRINK60V59-B4CHECKDEV. STEPS 2SE

33、 LEEPVAPPROVALREVPART NO.BA41-01174AMK KIMREV 0.9MODULE CODELAST EDIT756PAGEOFOctober 20, 2009 21:30:55 PM1432D:/Users/mobile39/mentor/Bremen/PV/Bremen-M_MAIN12 C230100nF 10VC229C228100nF 10V10000nF-X5R6.3VC231100nF 10VC226 C227 C232100nF 10V100nF 10V10000nF-X5R6.3VPlace 14.318MHz within 500mils of

34、CK-505Pin 30CPU_0CPU_1CPU_SEL = 0133MHz133MHz4321SAMSUNG PROPRIETARYTHIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS COS PROPERTY.DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG.THERMAL SENSOR & FAN CONTROLDDConnected to SML1 in PCHP5

35、.0VP3.3V_AUXP3.3V_AUXR56649.91%nostuffC542C543C544100nF10V10000nF-X5R 100nF10VCCU504EMC2112-BP-TRnostuffTHERMAL_VDD_MN1161415VDD_3V VDD_5V_1 VDD_5V_2SMDATA SMCLKKBC3_THERM_SMDATA# KBC3_THERM_SMCLK#1912 THERMAL_ALERT#_MNALERT# SYS_SHDN#8THM3_STP#GFX3_THERMDN 9RESET#2DN1 DP13C5452.2nF17FAN5_VDDFAN_1 F

36、AN_2 TACHGFX3_THERMDP184 THERMAL_DN2_MN50VPlace CPU Bottom sideDP3_DN2 DN3_DP2205FAN3_FDBACK#P3.3V_AUX20111 101xb (7A)THERMAL_SHDN_SEL_MN10C5462.2nF50VC7190.022nFMMBT3904 Q517ADDR_SEL1R56910K1%6750V3SHDN_SEL TRIP_SET11CLKTHERMAL_DP2_MNnostuff5.5VC5471000nF-X5RDefault1321GND THERMAL_PAD6.3VR568Place

37、near pin of diode. To remove noise.After test it can be removed.1.5K1%1209-001887BBtemp : 102c 103cP3.3VR6910K1%Line Width = 20 milJ2HDR-4P-1R-SMDFAN5_VDDFAN3_FDBACK#1234MNT1 MNT256C6110000nF-X5R6.3V3711-000456To support heatsinkAADESIGNDATETITLESAMSUNGELECTRONICSMS YANG8/11/2009BREMEN-MTHERMAL SENS

38、OR THERMAL SENSOR EMC2112CHECKDEV. STEPSE LEEPVAPPROVALREVPART NO.BA41-01174AMK KIMREV 0.9MODULE CODELAST EDIT856PAGEOFOctober 20, 2009 21:30:55 PM1432D:/Users/mobile39/mentor/Bremen/PV/Bremen-M_MAINR555 R554 R55610K 1%10K 1%10K 1%R57010K 1%M500M3M2M501HEADHEADHEADHEADDIADIADIADIA LENGTHLENGTHLENGTH

39、LENGTHBA61-01090ABA61-01090ABA61-01090ABA61-01090ASHDN_SEL MODE0HIGH Z 1INTEL TR MODEAMD CPU/DIODE MODE EXT.DIODE 2 MODEADDRESSS_SEL MODE0HIGH Z 10101 111xb0111 101xb (7A)0101 110xb6.3VP3.3V_AUX4321SAMSUNG PROPRIETARYTHIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRO

40、NICS COS PROPERTY.DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG.ARRANDALE PROCESSOR (DMI,PEG, FDI)CPU1-1 ARD/CFD_PGA1 / 5CPU_COMP_MNB26 A26R11649.91%R13920 1% AT23CPU_COMP3_MNPEG_ICOMPI PEG_ICOMPO PEG_RCOMPOCOMP3A16DDDMI1_TXN(0:3)BCLK BCLK#CLK0_BCLK_CPU CLK0_BCLK_CPU#R14

41、00A24B2720 1% AT24B16DMI_RX#_0CPU_COMP2_MNCOMP2C23A25R11771DMI_RX#_1PEG_RBIASR142R1412B2249.9 1% G16AR30CPU_PEG_RBIAS_MNDMI_RX#_2PEG1_RXN(15:0)CPU_COMP1_MNCOMP1BCLK_ITP BCLK_ITP#3A21K350AT30DMI_RX#_3PEG_RX#_0J3449.9 1% AT261DMI1_TXP(0:3)PEG_RX#_1 PEG_RX#_2 PEG_RX#_3 PEG_RX#_4 PEG_RX#_5 PEG_RX#_6 PEG

42、_RX#_7CPU_COMP0_MNP1.05V_VTTCOMP00B24J332E16DMI_RX_0 DMI_RX_1 DMI_RX_2 DMI_RX_3PEG_CLK PEG_CLK#CLK1_PCH3GPLL_OUT CLK1_PCH3GPLL_OUT#1D23G353D16B23G32AH2424SKTOCC#3A22F345A18DPLL_REF_SSCLK DPLL_REF_SSCLK#F316CPU_CATERR#_MN49.9 1% AK14A17Connect to GND Directly in case discrete GFX model.DMI1_RXN(0:3)0

43、D24D357R679DMI_TX#_0CATERR#1G24E338DMI_TX#_1PEG_RX#_8P1.05V_VTTF23C3329DMI_TX#_2PEG_RX#_9H23D32F6310MCP1_DRAMRST#_DRIVECPU_RCOMP_0_MN CPU_RCOMP_1_MNDMI_TX#_3PEG_RX#_10SM_DRAMRST#B3211AT15DMI1_RXP(0:3)PEG_RX#_11 PEG_RX#_12 PEG_RX#_13 PEG_RX#_14 PEG_RX#_15CHP3_PECIPECIR6900D25C3112AL1100 1%DMI_TX_0 DM

44、I_TX_1 DMI_TX_2 DMI_TX_3SM_RCOMP_0 SM_RCOMP_1 SM_RCOMP_2F24B28AM1R689113R67710K1%R67610K1%P1.05V_VTTAN1R691 2E23B3014CPU_PROCHOT#_MNCPU_RCOMP_2_MNR6173G23A311549.9 1% AN26PROCHOT#AN15PEG1_RXP(15:0)PM_EXT_TS#_0 PM_EXT_TS#_1J350H341H332AP15PEG_RX_0 PEG_RX_1 PEG_RX_2 PEG_RX_3 PEG_RX_4 PEG_RX_5 PEG_RX_6 PEG_RX_7 PEG_RX_8 PEG_RX_9 PEG_RX_10 PEG_RX_11 PEG_RX_12 PEG_RX_13 PEG_RX_14 PEG_RX_15AK15MCP1_THRMTRIP#THERMTRIP#E22 D21 D19 D18 G21 E19 F21 G18F353FDI_TX#_0 FDI_TX#_1 FDI_TX#_2 FDI_TX#_3 FDI_TX#_4 FDI_TX#_5 FD