UL零部件认证产品提交信息.doc

Multilayer PWBUL RECOGNIZED COMPONENT PRODUCT SUBMISSION INFORMATIONUL零部件认证产品提交信息COMPANY INFORMATION:APPLICANT: The company that applies for the investigation, receives correspondence and invoices, makes payments, and receives Reports.申请者:该公司申请认证,接收信件,发票,付款,并接收报告.English英文Native Language (if applicable)中文Company Name:公司名称Address:地址City, Country:城市,国家Contact Person:联系人Title: 职位Phone: 电话Fax: 传真 Post code:邮编E-mail:邮箱RECOGNIZED COMPANY: The company whose name will appear in our published records as having Recognition. The Recognized company may be the same as the Applicant.列名公司:该公司的名称将会出现在我们公布的记录上作为已被认证的公司,列名公司和申请者可以相同.Company Name:公司名称Address:地址City, Country:城市,国家Contact Person:联系人Title: 职位Phone: 电话Fax: 传真 Post code:邮编E-mail:邮箱MANUFACTURER: The company who actually conducts the manufacturing of the product. The manufacturer may be the same as the Applicant and/or the Recognized. Attach information for additional manufacturing locations on a separate page.生产商:该公司实际执行产品的生产.生产商可以和申请者和/或列名公司相同.多个生产厂址的附加信息应该分开列出.Company Name: 公司名称Address: 地址City, Country:城市,国家Factory ID (if more than one location):工厂标志(适用于两个或以上的工厂)Contact Person:联系人Title: 职位Phone: 电话Fax: 传真 Post code:邮编 E-mail:邮箱MARKING REQUIREMENTS:标志要求:The UL Marking for your Recognized Component will consist of your full company name and the trade name of the product and possibly the Recognized Component Mark depending on the category. Please inform us if you wish to have the option of using a trademark instead of your company name and we will provide additional information. If more than one location will be producing this product, please provide a distinctive marking (Factory ID) for each product and manufacturing location combination.通过认证的产品上的UL标志必须包括公司全名,产品的商品名和这类产品的零部件认证标志.您若是选择用商标代替公司名称请通知我们,我们将为你提供附加信息.若是有多个厂址生产该产品,请为每个厂址的产品提供一个可以彼此区分的标志.Please note: If acting as an Agent - Agent Authorization Notification Form (Form L337) required.请注意:如果是代理商代理的,则需要代理授权通知（L337）.如在现有UL档案中添加认证，请说明UL档案号。如不是或从未有过UL档案，无需填写。Please provide the following information for Multilayer PWB: (请提供以下信息):Base Materials Recognized Parameters 基板材认证过的参数Your Desired PWB Parameters 需要认证的参数1.PWB Type Designation型号阴影处请勿填写(下同)2.Base Material 基板材料a. Laminate Manufacturer 基板料厂家名称填入TABLE I中 UL File No. （UL档案号码）填入TABLE I中 Material Designation材料型号填入TABLE I中 ANSI Grade（ANSI等级）填入TABLE I中 Individual Laminate Layer Minimum Thickness材料最薄厚度_mmb. Prepreg Manufacturer 半固化片制造厂商填入TABLE I中UL File No. （UL档案号码）填入TABLE I中Material Designation材料型号填入TABLE I中ANSI Grade（ANSI等级）填入TABLE I中Individual Prepreg Layer Minimum Thickness 半固化片最薄厚度_mm3.Total Build-Up Minimum Thickness 压板后的最薄厚度_mm4.Copper Thickness铜箔厚度a. External Maximum (oz) 外部铜箔最大厚度 _micb. External Minimum (oz) 外部铜箔最小厚度_micc. Internal Maximum (oz) 内部铜箔最大厚度_micd. Internal Minimum (oz) 内部铜箔最小厚度_mic5.Maximum Operating Temperature (oC) 最高操作温度_6.Soldering Limits 焊锡限制a. Temperature (oC) 温度_b. Time (seconds) 时间_sec7.Pattern Limits 线路限制(mm/in.)a. Minimum Conductor Width 最小线宽度_mmb. Maximum Unpierced Area Diameter 无线路导体最大直径_mmc. Minimum Edge Conductor Width 最小边缘线宽度_mm8.Manufacturing Process Designation (e.g. A or B)所用的工序，如A或B9.UL 94 Flammability Class 燃烧等级10.Solder Resist(s) 绿油Manufacturer(s) , Grade Name(s) and Color(s) 绿油厂家及型号和所用颜色填入TABLE II中填入TABLE II中Note:1. If a new process is involved, please provide a complete description of your intended manufacturing process. 如包括新工艺，请提供详细的工艺描述。2. Do not write in shaded areas. 阴影处请勿填写。3. There may be some differences between our parameter definition and the general understanding in this Data Sheet. Please do not revise it. And any question, please inquire our customer services for explanation. 表格中各种参数的定义与业界的定义有所区别。Multilayer PWB Material ListPWB Board Designation (线路板型号)： (如有多个PWB型号，请自行复印该页)TABLE I. LAMINATESLaminates Used (所用基材)No.Laminate /Prepreg MfrUL File No.DesignationANSI Grade1.Laminate:Prepreg:2Laminate:Prepreg:3Laminate:Prepreg:4.Laminate:Prepreg:TABLE II. SOLDER RESISTSSolder Resists Applied (所用绿油)No.Solder Resists MfrUL File No.DesignationColorANSI Grade..You can get more information for PWB materials desired per bellow website. 通过以下网址， 您可以获得更多有关电路板材料的信息。/Template02.aspx?SiteID=5&Ref=CCIC-ONLINE-DATABASE-CDREMARKS BOM Sheet (填写说明):1. PWB Type Designation 型号: Please fill the type designation in the blank, and note that please dont use ANSI grade or flame rating as the PWB Designation.请填写贵公司要申请的印刷线路板的型号，建议不要使用UL/ANSI Grade或者燃烧等级作为型号名称,如FR-4,V-0等.2. Base Material 基板材料: Please provide the information of lamintes/Prepregs used in your PWBs in PWB Material List Table I, including Manufacturers name, related UL file No., laminate/prepreg designation and UL/ANSI grade. The individual minimum thickness here is not the minimum thickness of the laminate/prepreg you choose, but the minimum thickness that you want to apply, want to use in your manufacturing process. 请将贵公司需要使用在所申请型号中的基材和半固化片的信息填写于原料清单（TABLE I）中包括 基材供应商的名称，UL档案号，基材型号和ANSI 等级。基材和半固化片的最小厚度不是指所选 用原材料中的最小厚度，是指贵公司希望申请的，能做到的基材和半固化片的最小厚度，通常应该 大于或等于所用材料的最小厚度，因此在选择材料的时候请注意.。 3. Total Build-Up Minimum Thickness 压板后的最薄厚度: The required minimum PWB thickness is not the minimum thickness of the laminate, but the minimum PWB thickness you have capability to produce through your manufacturing process, which is always not less than minimum laminate thickness. The minimum thickness of PWB is measured without any copper and/or plating. And please refer to “ATTACHMENT T3” to view some regular PWB thickness based on different ANSI Grades. 线路板的最小厚度不是指所选用基材的最小厚度，而是指贵公司希望申请的并能做到的线路板的最 小厚度，通常应大于或等于所用基材的最小厚度，因此在选择基材时请注意。PWB最小厚度不包 括任何内外层铜箔和绿油的厚度。另附表T3中列出了一些ANSI Grade的线路板常用的厚度。 4. Copper Thickness 铜箔厚度: Please use “mic” (micron) as unit when measuring copper thickness; 铜箔厚度建议用“mic”(微米)为单位。5. MOT最高操作温度: Maximum Operating Temperature is the maximum temperature for PWBs used in end product. Please refer to the assigned temperature rating of the expected base material (for instance: 90oC, 105oC, 130oC, etc), and MOT of PWBs should not exceed the MOT of expected base material.指印刷线路板在成品上的最高使用温度, 可参考所用基材的最高操作温度(常见为90oC, 105oC,130oC等), PWB的MOT不得高于所用基材的MOT。6. Solder Limits (焊锡限制): Solder limits is the operating condition used in PWB assembly. Normally, Solder Limits may be 260oC300oC / 5s30s. 焊锡限制是指PWB组装时的条件。常用焊锡限制（Solder Limits）为260oC300oC / 5s30s。 7. Pattern Limits (线路限制): Minimum Edge Conductor Width should be no less than the Minimum Midboard Conductor Width, and no more than three times of Minimum Midboard Conductor Width. When an edge conductor is not provided with a width of less than three times the minimum width of a midboard conductor, or the required Minimum Edge Conductor can not be provided (the distance from the board edge should be from 0 to 0.4mm, but should not be sheared along the board edge), then the board shall be assigned an edge conductor width at three times the minimum midboard conductor width. If no conductor width is provided in this sheet, they will be given based on the actual measurement of UL Lab. Normally, Maximum Unpierced Area Diameter(MAD) may be 25.4mm, 38.1mm, 50.8mm, 76.2mm, etc. And please refer to Figure 7.2 to view the definition of MAD.最小边缘导线线宽应大于等于最小中间导线线宽，且小于等于最小中间导线线宽的3倍。如果所提供的最小边缘导线线宽大于最小中间导线线宽的三倍或没有按照UL要求来提供最小边缘导线(离板材边缘必须小于等于0.4mm并且不能沿板材边缘相切), 那最小边缘导线线宽会被默认为最小中间导线线宽的三倍；如果没有提供导线线宽, 我们会根据实验室的实测结果进行认证。通常MAD为25.4mm, 38.1mm, 50.8mm, 76.2mm等，关于MAD定义请参考附图10.2及注释。8. Manufacturing Process Designation (生产流程名称)： No special requirements. 无特别要求。9. UL 94 Flammability Class 燃烧等级: Please provide UL94 Flammability Rating which you expect, such as V-0, V-1, V-2 and HB, etc. 填写您所希望得到的燃烧等级，如V-0,V-1,V-2,HB等。 10. Solder Resist(s) 绿油： Please provide the solder resists used in your PWBs in PWB Material List Table II. If there is more than one PWB designation, please make sure the solder resists are in accordance with different PWB designations. 请将贵公司需要使用在所申请型号中的绿油的相关信息填写于原料清单（TABLE II）中。如有多个PWB型号时，油墨应对应相关的PWB型号填写。 ATTACHMENT T3Figure 10.2Figure 10.2 : Maximum unpierced conductor area measurement最大区域导体(MAD圆形区域E)的度量。A Production printed-wiring board. PWB的产品。B Largest unpierced conductor section. 无线路导体最大区域。E Largest circle that fits B (the area is not to exceed that of circle E in Figure 10.1). 适合B区域的最大圆（此区域不可以超过图10.1中E 圆的大小）。 Example of Multi-layer Manufacturing Process 多层电路板工艺流程1.May cut boards. 切板2May image for innerlayer; laminate dry film at _C maximum for _ maximum内层干膜粘压, 最高温度_C, 最长时间_.3May etch using any etchant except chromic/sulfuric. 蚀铜4May strip etch resist, rinse and dry. 剥膜 , 烘干5May apply black oxide treatment. 黑氧化6May dry at _C maximum for _ maximum.烘干, 最高温度_C, 最长时间 _7May laminate boards at _C maximum for _ maximum at a lamination pressure of _ PSI maximum.压合, 最高温度_C, 最长时间 _, 最大压力_PSI.8May dry at _C maximum for _ maximum.烘干, 最高温度_C, 最长时间 _9May cut, drill and debur boards. 切板 , 钻孔及除披铎10May electroless copper plate. 无电沉铜11May scrub boards. 磨板12May print pattern by silk screening or laminate dry-film at _C maximum for _ maximum.印刷湿膜或干膜, 最高温度_C, 最长时间 _.13May electroplate copper, then electroplate tin-lead. 电镀铜, 电镀铅锡14May strip plating resist. 剥膜15May etch using any etchant except chromic/sulfuric. 蚀铜16May strip tin-lead. 剥锡铅17Nonflame and HB rated types may be coated with any solder resists. V rated types may be coated with the resists indicated in the following pages. Boards may then be dried at _C maximum for _ minutes maximum.涂阻焊剂及烘干, 烘干的最高温度_C, 最长时间_ 18May apply marking ink, and cure at _C maximum for _ maximum.字符印刷及烘干, 烘干的最高温度_C, 最长时间 _ 19May solder reflow using hot air solder level at _oC maximum for _ maximum. 喷锡, 最高温度_C, 最长时间 _20May e