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毕业设计
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微格教室语音控制系统,毕业设计
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TDA2822March 1995DUAL POWER AMPLIFIER.SUPPLY VOLTAGE DOWN TO 3 V.LOW CROSSOVER DISTORSION.LOW QUIESCENT CURRENT.BRIDGE OR STEREO CONFIGURATIONDESCRIPTIONThe TDA2822 is a monolithic integrated circuit in12+2+2 powerdip, intended for use as dual audiopower amplifier in portable radios and TS sets.POWERDIP(Plastic 12+2+2)ORDERING NUMBER : TDA2822TYPICAL APPLICATION CIRCUIT (STEREO)1/11ntsSCHEMATIC DIAGRAMABSOLUTE MAXIMUM RATINGSSymbol Parameter Value UnitVs Supply Voltage 15 VIoOutput Peak Current 1.5 APtot Total Power Dissipation at Tamb =50Cat Tcase=70C1.254WWTstg,TjStorage and Junction Temperature 40 to 150 CPIN CONNECTION (top view)TDA28222/11ntsTHERMAL DATASymbol Parameter Value UnitRth j-ambRth j-caseThermal Resistance Junction-ambientThermal Resistance Junction-pinsMaxMax8020C/WC/WELECTRICAL CHARACTERISTICS (Vs = 6 V, Tamb=25C, unless otherwise specified)STEREO (test circuit of fig. 1)Symbol Parameter Test Condition Min. Typ. Max. UnitVs Supply Voltage 3 15 VVc Quiescent Output Voltage Vs =9VVs=6V42.7VVIdQuiescent Drain Current 6 12 mAIb Input Bias Current 100 nAPo Output Power(each channel)d = 10 % f = 1 kHzVs =9V RL=4Vs=6V RL =4Vs= 4.5 V RL=41.30.451.70.650.32WWWGvClosed Loop Voltage Gain f = 1 kHz 36 39 41 dBRi Input Resistance f = 1 kHz 100 keN Total Input Noise Rs =10kB = 22 Hz to 22 kHzCurve A2.52VVSVR Supply Voltage Rejection f = 100 Hz 24 30 dBCS Channel Separation Rg=10k f = 1 kHz 50 dBBRIDGE (test circuit of fig. 2)VsSupply Voltage 3 15 VId Quiescent Drain Current RL = 612mAVos Output Offset Voltage RL =8 10 60 mVIbInput Bias Current 100 nAPoOutput Power d = 10 % f = 1 kHzVs =9V RL=8Vs=6V RL=8Vs= 4.5 V RL =41.351WWWd Distortion (f = 1 kHz) RL =8 Po= 0.5 W 0.2 %GvClosed Loop Voltage Gain f = 1 kHz 39 dBRi Input Resistance f = 1 kHz 100 keN Total Input Noise Rs=10kB = 22 Hz to 22 kHzCurve A32.5VVSVR Supply Voltage Rejection f = 100 Hz 40 dBTDA28223/11ntsFigure 1 : Test Circuit (stereo).Figure 2 : P.C. Board and Components Layout of the Circuit of Figure 1 (1:1 scale).TDA28224/11ntsFigure 3 : Test Circuit (bridge).Figure 4 : P.C. Board and Components Layout of the Circuit of Figure 3 (1:1 scale).TDA28225/11ntsFigure 5 : Output Power vs. Supply Voltage(Stereo).Figure 6 : Output Power vs. Supply Voltage(Bridge).Figure 7 : Distorsion vs. Output Power (Bridge). Figure 8 : Distorsion vs. Output Power (Bridge).Figure 9 : Supply Voltage Rejection vs.Frequency.Figure 10 : Quiescent Current vs. Supply Voltage.TDA28226/11ntsFigure 11 : Total Power Dissipation vs. OutputPower (Stereo).Figure 12 : Total Power Dissipation vs. OutputPower (Bridge).Figure 13 : Total Power Dissipation vs. OutputPower (Bridge).TDA28227/11ntsFigure 14 : Application Circuit for Portable Radios.MOUNTING INSTRUCTIONTheRth j-ambof the TDA2822 can be reducedby sol-deringthe GND pins toa suitable copperarea of theprinted circuit board (Figure 15) or to an externalheatsink (Figure 16).The diagram of Figure 17 shows the maximum dis-sipable power Ptotand the Rth j-ambas a functionoftheside ” oftwoequalsquarecopperareashavinga thickness of 35 (1.4 mils).During soldering the pins temperature must not ex-ceed 260 C and the soldering time must not belonger than 12 seconds.The external heatsink or printed circuit copper areamust be connected to electrical ground.Figure 15 : Example of P.C. Board Copper Areawhich is used as Heatsink.Figure 16 : External Heatsink Mounting Example.TDA28228/11ntsFigure 6 : Maximum Dissipable Power andJunction to Ambient ThermalResistance vs. Side ”.Figure 7 : Maximum Allowable Power Dissipationvs. Ambient Temperature.TDA28229/11ntsPOWERDIP 16 PACKAGE MECHANICAL DATADIM.mm inchMIN. TYP. MAX. MIN. TYP. MAX.a1 0.51 0.020B 0.85 1.40 0.033 0.055b 0.50 0.020b1 0.38 0.50 0.015 0.020D 20.0 0.787E 8.80 0.346e 2.54 0.100e3 17.78 0.700F 7.10 0.280I 5.10 0.201L 3.30 0.130Z 1.27 0.050TDA282210/11ntsInformation furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility forthe consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from itsuse. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifica-tions mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information pre-viously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices orsystems without express written approval of SGS-THOMSON Microelectronics. 1995 SGS-THOMSON Microelectronics - All Rights ReservedSGS-THOMSON Microelectron
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