IC 封装形式.doc

Engineering Department IC制造商专区 IC制造商技术资料下载国内IC交易网技术资料查询各种IC封装形式图片库存封装缩写说明 各种IC封装形式图片BGABall Grid ArrayEBGA 680L详细规格LBGA 160L详细规格PBGA 217LPlastic Ball Grid Array详细规格 SBGA 192L详细规格 TSBGA 680L详细规格CLCC详细规格CNRCommunication and Networking Riser Specification Revision 1.2 详细规格CPGACeramic Pin Grid ArrayDIPDual Inline Package 详细规格DIP-tabDual Inline Package with Metal HeatsinkFBGAFDIPFTO220Flat PackHSOP28ITO220ITO3pJLCCLCCLDCCLGALQFPPCDIPPGAPlastic Pin Grid Array 详细规格PLCC详细规格PQFPPSDIPLQFP 100L详细规格 METAL QUAD 100L详细规格PQFP 100L详细规格QFPQuad Flat PackageSOT143SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket 603FosterLAMINATE TCSP 20LChip Scale Package详细规格TO252TO263/TO268SO DIMMSmall Outline Dual In-line Memory ModuleSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUQFPQuad Flat PackageTQFP 100L详细规格SBGASC-70 5L详细规格SDIPSIPSingle Inline PackageSOSmall Outline PackageSOJ 32L详细规格SOJSOP EIAJ TYPE II 14L详细规格SOT220SSOP 16L详细规格 SSOPTO18TO220TO247TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP or TSOP IIThin Shrink Outline PackageuBGAMicro Ball Grid ArrayuBGAMicro Ball Grid ArrayZIPZig-Zag Inline PackageBQFP132TEPBGA 288LTEPBGA 288L详细规格C-Bend Lead CERQUADCeramic Quad Flat Pack详细规格Ceramic CaseLAMINATE CSP 112LChip Scale Package详细规格Gull Wing Leads J-STDJ-STDJoint IPC / JEDEC StandardsJEPJEPJEDEC PublicationsJESDJESDJEDEC StandardsLLP 8La详细规格PCI 32bit 5VPeripheral Component Interconnect详细规格PCI 64bit 3.3VPeripheral Component Interconnect详细规格PCMCIAPDIPPLCC详细规格PS/2PS/2mouse port pinout详细规格SIMM30SIMM30Pinout详细规格SIMM30Single In-line Memory ModuleSIMM72SIMM72Pinout详细规格SIMM72Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSLOT 1For intel Pentium II Pentium III & Celeron CPUSLOT AFor AMD Athlon CPUSNAPTKSNAPTKSNAPZPSOH以上封装资料摘自盛明零件网Copyright(c) 2003 Beijing HYCD rights reserved. m