点锡机评估报告

1.Background.,Padsize:L0.75xW0.8mm,1.OnMesaflex,Switchareaislocatedin3Dstiffenerwhichtheheightis1.7mm.2.Thenormalstencilprintingcannotperformthiscase,soneedtodevelopthesolderpastedispensing.,Stiffenerheight:1.7mm,2.Evaluationplan.,3.Machinespec_Valvestructure.,2.Valvestructure.,MycronicMy700,ShinwaQuspa-MsL,Conclusion:,My700:1.Itisjetting,thevolumeiscontrolledbypiezo.2.Notcontact.,Quspa-MsL(stampandprobe)1.Botharejettingandthevolumeiscontrolledbypiezo.2.Stampisnotcontact.3.Probeiscontact.,4.MachineaccuracyCpk.,1.Testmethod.,2.TestValve.,Conclusion:1.BothmachinesaretomeetMFLEXmachinesaccuracyCPKwith1.5.,3.MachineCpk.,My700:Todispensedotwith0.33mmandmeasurethepositionX&Yofdotbymachinecamera.Quspa-MsL:Todispensedotwith0.33mm,andmeasureDotpositonX,YbySPI.,5.Valveevaluation_DotvolumeCpk.,1.Testvalve.,Conclusion:1.My700Cannotdispensewithindiumtype6,sonodata.2.ForsoldervolumeCpk,Quspa-MsLisbetterthanMy700.3.Solderballissue:My700is8%,NosolderballforQuspa-MsL.,2.Teststatus.,Quspa-MsL:Nosolderballwithmin.0.5mmjettingheight,3.Solderballfailrate.,My700:8%solderballwithmin.0.65mmjettingheight,6.Valveevaluation_TestcouponCpk.,1.Testcouponvolumeset.,Conclusion:1.ForIndium8.9HFtype6,My700cannotdispenseitnow,iskeepingontesting.2.Forsolderpastevolume,Quspa-MsLisbetterthanMy700.,7.2Solderballoccurredreason.,My700:Notcontactwithjetting,Quspa-MsL(Probe):Contactwithjetting,7.2.My700_solderballtestI.,Conclusion:1.ForMy700,Thesolderballisoccurredwithdifferentjettingheight.,1.Testwithjettingheightfrom0.65mmto2.5mm.,7.3My700_solderballtestII.,Do5paneltestwithswitchvolumeandchecksolderballfailrate,solderballsizebeforeandafterreflow.Checkifsolderballisdroppingaftervibrationanddroptest.,3.Solderballsizedistribution(JadeDFMdoesntacceptsolderballwithin0.1mm).,Conclusion:1.Highfailrateofsolderballwilldropeverystation,ithashighrisktoresultincosmeticissuesuchasDOS.,8.Maintenance.,1.Yearlymaintenancecost.,2.Programmingtime.,Conclusion:1.My700maintenancecostisveryhigh.2.Programming:Quspa-MsLisnotlogical,Needtoupgradeprogrammingmethod,willfinishiton2017/12.,9.Evaluationsummary.,Basedonevaluation:1.For3DSUS,OnlyShinwaQ