BTB产品介绍PPT课件

.,1,BTB&FPCCONN.簡介,.,2,內容提要,BTBConnector介紹產品功能介紹產品主零件組成及形態區分要點產品家族系列介紹產品設計要點產品編碼原則FPCConnector介紹,.,3,一.BTB產品功能介紹,1.BTB定義:即BoardToBoard:板對板,屬連接器中的Levelthree.2.功用:通常使用于NoteBook中公母型連接器分別焊于主机板之MotherBoard及CPU之Doughter-Board使其達成平行連接,訊號傳輸之目的.,.,4,PCConnectorLevels,LevelII,LevelIII,LevelIV,LevelV,LevelVI,PCIISA,.,5,MECHENICALSolutionFOR3CINDUSTRY,.,6,一.BTB產品功能介紹,.,7,二.BTB產品之零件組成及公母形態區分要點,2-1.零件組成:A:塑膠(Housing)B:端子(contact)C:輔助元件,Housing,Contact,輔助元件,.,8,二.BTB產品之零件組成及公母形態區分要點,2-2.主要形態及其區分要點:A:公型(plug)B:母型(Receptacle)*區分要點:端子接點具有彈性的一方為母型產品,另一方則為公型產品.,.,9,二.BTB產品之零件組成及公母形態區分要點,Receptacle(母型),Plug(公型),.,10,三.BTB產品家族系列簡介,3-1.0.8PBTBConn.A:0.8PS/D(Standard)BTBConn.,MH=516mm,.,11,三.BTB產品家族系列簡介,3-1.0.8PBTBConn.B:0.8PL/P(LowProfile)BTBConn.,MH=2.53.5mm,.,12,三.BTB產品家族系列簡介,3-1.0.8PBTBConn.C:0.8PF-Type(Future-Type)BTBConn.,MH=514mm,.,13,三.BTB產品家族系列簡介,3-1.0.8PBTBConn.D:0.8PFORCD-ROMBTBConn.,.,14,三.BTB產品家族系列簡介,3-1.0.8PBTBConn.D:0.8PFORCD-ROMBTBConn.,50Pos.,.,15,3-2.0.635PBTBConn.A:0.635PS/D(Standard)BTBConn.,三.BTB產品家族系列簡介,MH=516mm,.,16,3-2.0.635PBTBConn.B:0.635PL/P(LowProfile)BTBConn.,三.BTB產品家族系列簡介,MH=4mm,.,17,3-2.0.635PBTBConn.C:0.635PRec.ForCardBusGIIBTBConn,三.BTB產品家族系列簡介,136Pos.,.,18,三.BTB產品家族系列簡介,3-3.0.6PH/S(HighSpeed)BTBConn.,MH=413mm.,.,19,四.BTB產品設計要點,4-1.配合介面,決定產品GAP值,.,20,四.BTB產品設計要點,4-2.配合高度,決定產品高度及Mating深度,.,21,四.BTB產品設計要點,4-3.焊接方式,.,22,四.BTB產品設計要點,4-4.FootprintLayout,決定產品Pitch值及焊腳寬度,.,23,產品的主要功能參數,.,24,產品的主要功能參數,.,25,五.BTB產品編碼原則,.,26,(一)0.6PH/SBTB編碼原則.,SMTpick&place:B-singlecap(black)C-singlecap(ivory),QTS*NNN*-*1(*),產品型態:0-Plug.1-Rec.,產品之Pos.No.030-30Pin|160-160Pin,端子鍍金膜厚A-25u”6-10u”以上,MetalEar狀態1-W/M/E,Metalshield&SolderType:01Plug:W/OS/P.W/S/P&SMTtypeRec.W/OG/P.W/G/P&SMTtype,ProfileHeight:12345EM789Plug:3.524.525.526.527.526.127.029.5210.5211.52Rec.3.257.25,PACKAGE(包裝):2-Tape&Reel(single),.,27,0.6PH/SBTBPlug,H=3.527.52mm,H=8.5211.52mm,Coreout,Coreout,.,28,0.6PH/SBTBReceptacle,H=7.25mm,coreout,Nocoreout,H=3.254.25mm,.,29,(二)0.6PBTBforCardBusG2M編碼原則.,W-forCardBusG2M,QTS1NNN*-*121W,產品型態:1-Rec.,產品之Pos.No.150-150Pin,端子鍍金膜厚A-25u”,MetalEar狀態1-W/M/E,ProfileHeight:1:5.05mm,PACKAGE(包裝):2-Tape&Reel(single),POST:1-W/POST,.,30,(三).0.635PBTB編碼原則.,QT6*NNN*-*1*1(D),產品型態:0-Plug.1-Rec.,產品之Pos.No.020-20Pin|160-160Pin,端子鍍金膜厚A-25u”6-10u”以上,MetalEar狀態1-W/M/E,PACKAGE(包裝):2-Tape&Reel,W/MetalClip4-Tape&Reel(2-in-1)5-Tube,POST:1-W/POST,ProfileHeight:1234679APlug:4.05.06.07.09.04.512.0Rec.:4.010.0,SMTpick&placeD:2-IN-1cap(pitch=10),.,31,0.635PBTBPlug,H=3.107.0mm,H=8.012.0mm,Coreout,Coreout,.,32,0.635PBTBReceptacle,H=4.0mm,H=10.0mm,.,33,Summaryofspecialpartno.:,QT61NNN6-0121,0.635pRec.,ProfileHeight:0:3.10mmw/differentstructure,0.635pPlug,QT60NNN6-0121,ProfileHeight:0:3.25mmw/differentcontact,Different:thestructureofcontactandhousingthetipofcontactdoesnotisdifferentfrom0.635pstandard,bendtowardthehousingbecausetheprofileheightislowwall,difference,Customer:InventecP64,.,34,(四)0.635PspecialP/NForCardBusGIIBTB編碼原則.,QT61NNN*-*10C,產品之Pos.No.136-136Pin,端子鍍金膜厚A-25u”6-10u”以上,MetalEar狀態0-W/OM/E,PACKAGE(包裝):1-Tape&Reel,W/PIFilm,MetalShield&SolderType:1-w/shield&SMTTYPE2-w/shield&T/HTYPE,ProfileHeight:1:H=4.0w/housingwall2:H=5.0w/housingwall3:H=4.0w/ohousingwall&lead“L”type,CardBusGII,.,35,(五).0.8PS/DBTB編碼原則.,QT8*NNN*-*11*,產品型態:0-Plug.1-Rec.,產品之Pos.No.020-20Pin|160-160Pin,端子鍍金膜厚A-25u”6-10u”以上,MetalEar狀態0-W/0M/E1-W/M/E,PACKAGE(包裝):1-Tape&Reel,W/PIFilm,POST:1-W/POST,ProfileHeight:1234Plug:4.255.256.257.25Rec.4.258.2512.25,.,36,0.8PS/DBTBPlug,H=4.257.25mm,Coreout,.,37,0.8PS/DBTBReceptacle,H=4.25mm,H=8.2512.25mm,.,38,(六)0.8PF/TspecialBTB編碼原則.,QT8*NNN*-*9*0,產品型態:P-Plug.R-Rec.,產品之Pos.No.020-20Pin|120-120Pin,端子鍍金膜厚A-25u”6-10u”以上,MetalEar狀態0-W/0M/E,PACKAGE(包裝):1-Tape&Reel,W/PIFilm2-Tape&Reel,W/MetalClip,POST:9-W/POST,ProfileHeight:1234Plug:4.65.66.67.6Rec.3.7511.75,.,39,Summaryofspecialpartno.:,QT8PNNNA-3910N,QT8RNNNA-1910N,0.8F/TPlug,0.8F/TRec.,NarrowedTailLength:N:4.40mm,NarrowedTailLength:N:4.40mm,Customer:QuantaJM1forDellBondi,Changefrom5.60mm4.40mm,.,40,(七-1)0.8PR/ABTBforT/H編碼原則.,QT8*NNN*-*10*(*),產品型態:0-Plug.H-Rec.R/ATYPE,產品之Pos.No.050-50Pin,端子鍍金膜厚A-25u”6-10u”以上,LOCKTYPE:0-W/Board-Lock1-W/Screw2-W/B/L&Screw,PACKAGE(包裝):0-TRAY.,ContactSoldertype:1:ThroughHoletype,ProfileHeight&TailLengthk:0-H=2.0mm,K=2.200.201-H=11.1mm,K=2.200.202-H=9.5mm,K=1.350.153-H=9.0mm,K=2.60.204-H=5.9mm,K=2.00.205-H=12.05mm,K=2.00.206-H=8.7mm,K=2.40.207-H=6.1mm,K=2.00.20D-H=8.4mm,K=2.40.20,R:REVERSETYPE(frontside),.,41,Summaryofspecialpartno.:,QT8H0506-9101,0.8pR/ARec.withcover,ProfileHeight&TailLength9:7.05mm,k=2.60.20w/cover,cover,spacer,spacer,Difference:1.Addcoveronproduct2.Enhancethespacerwall,Customer:FICL1,wall,0.8pR/Aw/cover,0.8pR/AS/D,.,42,(七-2)0.8PR/ABTBforSMT編碼原則.,QT8*NNN*-*21*,產品型態:H-Rec.R/ATYPE,產品之Pos.No.050-50Pin,端子鍍金膜厚A-25u”6-10u”以上,LOCKTYPE:0-W/Board-Lock1-W/Screw,PACKAGE(包裝):1-TUBE.,ContactSoldertype:2:SMTtype,ProfileHeight&TailLengthk:G-H=10.8mmF-H=10.0mm,.,43,(八)0.8PV/TBTB編碼原則.,QT8VNNN*-*111,產品型態:V-Rec.V/TTYPE,產品之Pos.No.050-50Pin,端子鍍金膜厚A-25u”6-10u”以上,METALEAR:1:W/MetalEar,PACKAGE(包裝):1-Tape&Reelw/PIfilm,POST:1:W/Post,ProfileHeight1-H=6.55mm2-H=9.55mm,.,44,(九).0.8PSlim-TypeBTB編碼原則.,QT8*NNN*-*110S(T),產品型態:0-Plug.1-Rec.,產品之Pos.No.020-20Pin,端子鍍Sn/Pb膜厚1-100u”以上,MetalEar狀態0-W/0M/E,PACKAGE(包裝):1-Tape&Reel,POST:1-W/POST,ProfileHeight:12Plug:5.15Rec.:3.55,SlimType,T/HType,.,45,(十).0.8PL/PBTB編碼原則.,QT8*NNN*-*11,產品型態:A-Plug.B-Rec.,產品之Pos.No.014-14Pin|050-50Pin,端子鍍Sn/Pb膜厚1-100u”以上,MetalEar狀態1-W/MetalEar,Package(包裝):1-Tape&Reel,MetalShieldorGroundPin:01Plug:W/OS/PW/S/PRec.:W/OG/PW/G/P,ProfileHeight:12Plug:2.403.60Rec.:2.40,.,46,(十一).0.5PS/DBTB編碼原則.,QT5*NNNA-1*1*,產品型態:0-Plug.1-Rec.,產品之Pos.No.020-20Pin|160-160Pin,端子鍍金膜厚A-4u”以上,MetalEar狀態0-W/OM/E1-W/M/E,PACKAGE(包裝):1-Tape&Reel,POST:0-W/OPOST1-W/POST,ProfileHeight:1(MH=3.0mm)Plug:2.4Rec.:2.27,.,47,(十二).0.5PL/PBTB編碼原則.,QT5*NNN*-L*11,產品型態:0-Plug.1-Rec.,產品之Pos.No.020-20Pin|160-160Pin,端子鍍金膜厚A-25u”6-10u”以上,MetalEar狀態1-W/M/E,PACKAGE(包裝):1-Tape&Reel,POST:0-W/OPOST1-W/POST,ProfileHeight:L(MH=1.5mm)Plug:1.2Rec.:1.2,.,48,(十三)0.5PH/SBTB編碼原則.,QT0*NNN*-*20,產品型態:0