5[1].TE 测试工程技术概论与基础.ppt

1、伟创力校企合作项目培训,课程名称： TE测试工程技术概论与基础,Introduction of PCBA TestPCBA测试介绍,Introduction of PCBA TestPCBA测试介绍,Summary(概要 ).Page 3 Surface Mount Process Flow(表面安装工艺流程). Page 5 Introduction to PCBA Test (PCBA测试介绍 ) In-Circuit Test(在线测试). Page 6 Functional Test(功能测试) .Page 8 PCBA Test hardware (PCBA测试硬件) .Page 9

2、 ICT Test Parameter(在线测试参数) .Page 14 Probe Pins Application(探针应用） .Page 15 Functional Test (功能测试) Page 19 Test Operation Control（测试运行控制）.Page 21 Automated Optical Inspection（自动光学检测） .Page 22 Test Performance Monitoring（测试性能监控） .Page 27,Introduction of PCBA TestPCBA测试介绍,Summary概要,The PCBA products ar

3、e getting more and more complex. Customer and end-user demands for high product quality. PCBA产品变得越来越复杂，客户和终端用户要求更高品质的产品 With today technology, we are able to detect the PCBA process quality deficiencies and defective components. The PCBA inspection consists of In-Circuit Test, MDA, Functional Test a

4、nd Automated Optical Inspection. Each of the inspection process serves different purposes and compliment each other in order to reduce outgoing product risk. 通过今天的技术，我们能发现PCBA制程的质量缺陷和有缺陷的部件。PCBA测试包括在线测试，制程能力分析测试，功能测试和自动光学检测，检查制程中每一个服务于不同目的，相辅相成，以减少离任产品的风险。,Summary （ 概要 ）,At the end of the course, th

5、e student should demonstrate the understanding of basic concept of PCBA inspection: In-Circuit Test, Functional Test, and Automated Inspection, probe pin application, Test control process, and test performance monitoring process. In addition, the student should understand the definition of yield and

6、 its calculation. 在课程结束后，学生应理解PCBA测试的基本概念，包括：在线测试，功能测试，自动光学检测，探针应用，测试控制流程，测试性能监测流程。此外，学生应了解产品良率的定义和它计算的方式。,Overview of SMT Process SMT制程概述,How are PCBs assembled ? PCBA 怎样组装？,Solder Printing 锡膏印刷,Pick & Place 选择和放置 零件,Wave Solder 波峰焊,Post Reflow 回流焊,Hand Placement 手摆放,Visual Inspection 目检,ICT 在线测试,P

7、CB Preparation PCB准备,PCBA 测试,Raw Component 原始零件,SMT Process,FT 功能测试,Introduction to PCBA Test PCBA测试介绍,In-Circuit Test concept 在线测试理论 MDA test commonly used as a manufacturing defect analysis (MDA) quality gate to assure that the SMT process is maintained within established control parameters. MDA 测

8、试通常用作制造缺陷分析，以确保SMT制程是在既定的控制参数下。 Typical MDA Test Coverage（典型的MDA测试覆盖率） - Shorts and opens on the boards 短路和开路 Analog Test 模拟测试,Introduction to PCBA Test PCBA测试介绍,A full In-Circuit Test analysis (ICT) expands In-Circuit testing beyond MDA test to ensure quality product, maximizing post-ICT functional

9、 test first pass yield by detecting as many faults as possible in the circuit board. 全套的电路测试分析（ICT）扩大了制程能力分析测试之外的测试， 以确保产品质量 最大限度地担任尽可能多的电路板故障检测 Typical, In-Circuit Test Test Coverage (典型的ICT测试覆盖率)- Shorts and opens on a component. 短路和开路 Missing, wrong or improperly placed components. 缺件，错件，多件，错位 Ou

10、t of tolerance components. 超出公差的零件 Incorrectly programmed components and faulty memory devices. 不正确的编程零件和有故障的存储设备。 Functional faults on complete devices.功能不良的零件,Introduction to PCBA Test PCBA测试介绍,Functional Test concept（功能测试理论） Functional Test (FT, FCT, BFT) ensures that the product function is as p

11、er design requirement. 功能测试（ FT, FCT, BFT ），确保产品的功能是按设计要求。 Some examples of Functional Test Coverage 功能测试覆盖率的一些例子 Supply Voltages 电源电压 LAN, Chipset Test, Flash Programming局域网测试，芯片组测试，闪存编程 Audio, USB, Serial and Parallel Ports音频，USB测试，串口和并行口测试 Input-Output devices: Video, Mouse, Floppy 输入输出设备测试：视频，鼠标

12、，软驱 Memory, etc.内存等,PCBA Test Hardware In-Circuit Test PCBA 测试硬件-在线测试机,In-Circuit Tester（在线测试机） There are 3-commonly types of ICT testers used in the industry: Teradyne, TRI and Agilent. 目前有3个在业界普遍使用的ICT测试机：泰瑞达，德律泰和安捷伦 Samples of ICT Testers shown below.ICT 测试仪样品如下 ：,PCBA Test Hardware In-Circuit Te

13、st PCBA 测试硬件-在线测试机,In-Circuit tester hardware normally have the following modules: 在线测试仪的硬件通常有以下模块： Test System to Host Computer Interface (测试系统的主机界面) Clock generation and detection (时钟产生器和检测器) Programmable DC reference voltages (可编程直 流参考电压) Driver/Sensors (驱动器/传感器) Waveform and DC voltage generatio

14、n module ( 波形和直流电压生成模块) Voltage, Resistance, Impedance and frequency measurement module (电压，电阻，阻抗和频率和测试模块,PCBA Test Hardware In-Circuit Test PCBA 测试硬件-在线测试治具,In-Circuit Test Fixture 在线测试具 Single or Dual Well 单治具或双治具 Wire- or Wireless type fixture 有线或无线治具 Vacuum or pull down 真空或压床治具,PCBA Test Hardwar

15、e In-Circuit Test PCBA 测试硬件-在线测试治具,How does Test Fixture interface with Tester? 测试夹具如何连接测试仪？ Unit under test (UUT) will sit in the fixture. 被测板放置在治具上 Fixture sit on the receiver adapter 夹具放置在接收适配器上 Both the fixture and adapter will sit on the ICT tester. 无论是夹具和适配器都将放置在ICT测试仪 Vacuum will pull down th

16、e UUT and make contact with the fixture probes. 真空会压低被测板，使和夹具探针接触 Contact of the UUT to the tester will be through the probe pins in the fixture and via the receiver nails. 被测板和测试仪的接触是通过夹具探针和机器的针,PCBA Test Hardware In-Circuit Test PCBA 测试硬件-在线测试治具,In-Circuit Test (Overall picture) Use Teradyne as an

17、 example ICT 机（整体图片）-使用泰瑞达为例,In-Circuit Test Parameters ICT 测试参数,Probe Pins Application 探针应用,What are the factors of good electrical contact什么是良好的电接触的因素? Spring force of a probe探针的弹性 Surface contact area表面接触面积 Tip geometry针尖的几何形状 Contact materials and cleanliness接触材料和清洁 Impact as product engages the

18、 probe tips产品和针尖作用的影响力 Vibration振动,Probe Pins Application 探针应用,Point Styles测试点特征 Pads测试焊盘 Self-cleaning crowns are good choice for contacting flat solder pads. 对于接触平的焊盘来说，自我清洁的皇冠针是好的选择。 Waffle and crown points distribute the force over greater area but require frequent maintenance.皇冠针通过大面积均匀分布压力，但是需

19、要经常保养。 Use spear, chisel, sharp needle or triad to increase tip contact pressure for reliable testing on heavily oxidized or flux-coated solder pads. 使用矛形，凿形，尖形针可以在严重氧化或松香覆盖的焊盘增加可靠的针尖接触性能。,Probe Pins Application 探针应用,Point Styles测试点特征 Holes贯穿孔 Use a three-sided chisel to contact contaminated holes r

20、eliably. 使用三面茅形针可以有效的接触受污染的贯穿孔 For heavily contaminated or oxidized holes, the blade point will provide highest penetrating pressure since contact is made on two sharp cutting edges. 对受严重污染或氧化的贯穿孔，刀片型针基于两个锋利的边缘，将提供很好的穿透力，得到很好的接触,Probe Pins Application 探针应用,Point Styles测试点特征 Terminals and Posts端子 Cup

21、s can easily collect dust and contamination from the UUT, they are best used in a horizontal or downward-pointing orientation. 杯型针可以很容易地收集被测板的灰尘和污染，他们最好用于 水平或向下方向 Self-cleaning crowns or waffle points will require less maintenance than cups if used in an upward-pointing orientation. 如果用于向上方向，自我清洁的皇冠

22、针需要的保养比杯形针少,Functional Test 功能测试,2-Types of Functional Fixtures 两种典型的功能测试治具 Manual Fixture 手动治具 Automatic Test Fixture 自动治具,Functional Test 功能测试,Product Test Software Architecture 产品测试软件体系结构,Test Operation Control 测试运行控制,Test Operation Control System 测试运行控制系统 Test Software control 测试软件控制 Force-Routi

23、ng 强迫路径,SMT Process制程,Flex Flow System（系统） (Shop-Floor Control System 车间控制系统),Display error message to user. Boards treated as fail boards显示错误信息给用户。被视为失败板,PCBA,Check Boards Status确认板状态,PCBA,Board gone thru ICT （通过ICT测试了吗?,Send Log File (After Test)测试后 发送日志文件 （,Test Server System 测试服务系统,Test Program

24、测试程序(Auto download 自动下载,Force-Routing,PCBA,Test Program 测试程序Auto download 自动下载,测试软件控制系统,Send Log File (After Test)测试后 发送日志文件 （,Send Log File (After Test) 测试后 发送日志文件 （,Send Log File (After Test) 测试后 发送日志文件 （,Next Process 下一个程,Yes,测试软件控制系统,No,Automated Optical Inspection System 自动光学检测系统,With trend of

25、increase component density of a board, reduction in component size and increase connectivity often restrict or eliminate the traditional probe access for In-Circuit test. 随着日益增加的元件高密度板，在元件尺寸减小和连接组件密度增加的趋势下，往往限制或消除传统用于ICT的测试点。 The resulting loss of access for bed-of-nails in ICT has driven the manufa

26、cturers to implement automated optical inspection system in the SMT process. ICT测试点漏失的结果,将驱使制造业在SMT 制程中执行自动光学检测系统,Automated Optical Inspection System 自动光学检测系统,The AOI system consists of high-speed cameras, structured LED lighting, sophisticated image-capture architecture allow the AOI system to comp

27、lete the scan, diagnose and board-handling cycle time at up to 5-square inches per second. AOI 系统包括 高速摄像机 结构化LED照明， 先进的图像捕捉架构 让AOI系统来完成扫描，诊断和电路板处理高达每秒5平方英寸的速度。,Automated Optical Inspection System 自动光学检测系统,AOI Machine System AOI 机器 Five high-speed video cameras are used to inspect the target area of

28、the board. 五个高速摄像机是用来检查板的目标区 One camera is positioned to look directly down on the board. 一台摄像被固定，用来向下看板 The other 4-cameras are angled. 其他4个摄影机成一定角度定位 The cameras inspect the surface of the component or solder joint, and optimized inspection software algorithms are applied to the bright or dark are

29、as viewed. 该系列相机检查组件或焊点的表面，并且优化被用于光明和黑暗检测的软件算法 The structured lighting uses up to 400 individually controlled LEDs arrange in a precise array, all focused on the field of view. 结构化照明用了400多个单独控制的发光二极管，它们排列在一个精确的阵列，全部聚焦于视野内,Defects covered on Automated Optical Inspection System: 自动光学检测系统涵盖的缺陷： Missing

30、 components缺件 Mis-oriented components错向 Extra Components多件 Component placement零件放置 Tombstone components立碑 Lifted leads翘角 Solder bridges短路 Insufficient solder少锡 Excess solder多焊 Throughhole pins空洞,Automated Optical Inspection System自动光学检测系统,Automated Optical Inspection System 自动光学检测系统,Test Performance

31、 Monitoring - Yield测试性能监控-良率,What is definition of Defect?缺陷的定义 “ At the end of the manufacturing process, an unacceptable deviation from a norm” 在生产过程结束时，一种规范不可接受的背离 What is definition of No Defect Found (NDF)什么是误判? “ In the manufacturing process, a deviation from a norm, that may not be a defect at the end of the manufacturing process” 在制造过程中，一个标准的偏离，可能不是制造过程造成的缺陷 Definition of First Pass Yield (FPY)一次通过率 :,Note注释: # of total tested boards总的测试板= # of First-time passed boards第一次通过的板 + # of first-time failed boards (# of defect boards第一次不良的板 + # of NDF boards误判的板),Test Performa